Bonding horizontal aligned carbon nanotubes with a high-frequency electromagnetic induction heating method
2011 ◽
Vol 225
(4)
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pp. 165-169
Keyword(s):
This paper introduces an innovative method using high-frequency electromagnetic induction heating to realize a partial heating process without increasing overall chip temperature. This method provides an easy and reliable way to solve the long-term problem that has limited carbon nanotube application in mass integrated circuit production. Carbon nanotube alignment and bonding experiments are also conducted and the results are analyzed and discussed. The results show that the resistance of the carbon nanotube–metal interface reduces by 90% after bonding and the contact of the interface exhibits excellent endurance.
2021 ◽
pp. 095440622110071
2016 ◽
Vol 51
(9)
◽
pp. 1997-2008
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