Effects of graphite on wear and corrosion behaviour of SiCp-reinforced copper matrix composites formed by hot pressing

2004 ◽  
Vol 39 (3) ◽  
pp. 229-235 ◽  
Author(s):  
T.-F. Wu ◽  
Z.-W. Qiu ◽  
S.-L. Lee ◽  
Z.-G. Lee ◽  
J.-C. Lin
2021 ◽  
Vol 171 ◽  
pp. 110812
Author(s):  
C. Salvo ◽  
E. Chicardi ◽  
J. Hernández-Saz ◽  
C. Aguilar ◽  
P. Gnanaprakasam ◽  
...  

2009 ◽  
Vol 79-82 ◽  
pp. 1579-1582
Author(s):  
Chang Chun Wang ◽  
Guang Hui Min ◽  
Suk Bong Kang

SiCp reinforced copper matrix composites with the reinforcement content of 30-50vol. % were fabricated by hot pressing using Cu-coated and uncoated SiC powder. And the microstructure and electrical conductivity of the composites were also studied. The results showed that with the increasing of SiCp particle size, the electrical conductivity of the composites also increased. And the oxides in the composites can decrease the electrical conductivity of the composites obviously. The electrical conducting property of the composites can be improved by the copper coating layer and suitable annealing treatment. It provided important data for the application of SiCp/Cu composites as electronic packaging materials.


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