Silicon carbide whisker copper-matrix composites fabricated by hot pressing copper coated whiskers

1996 ◽  
Vol 31 (2) ◽  
pp. 399-406 ◽  
Author(s):  
Pay Yih ◽  
D. D. L. Chung
Keyword(s):  
Silicon Carbide ◽  
Hot Pressing ◽  
Copper Matrix ◽  
Matrix Composites ◽  
Copper Matrix Composites ◽  
Silicon Carbide Whisker

Microstructure, electrical and mechanical properties of Ti2AlN MAX phase reinforced copper matrix composites processed by hot pressing

2021 ◽  
Vol 171 ◽  
pp. 110812
Author(s):  
C. Salvo ◽  
E. Chicardi ◽  
J. Hernández-Saz ◽  
C. Aguilar ◽  
P. Gnanaprakasam ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Hot Pressing ◽  
Copper Matrix ◽  
Max Phase ◽  
Matrix Composites ◽  
Copper Matrix Composites

Electrical Behavior of SiCp Reinforced Copper Matrix Composites by Hot Pressing

2009 ◽  
Vol 79-82 ◽  
pp. 1579-1582
Author(s):  
Chang Chun Wang ◽  
Guang Hui Min ◽  
Suk Bong Kang
Keyword(s):  
Electrical Conductivity ◽  
Hot Pressing ◽  
Coating Layer ◽  
Annealing Treatment ◽  
Copper Matrix ◽  
Matrix Composites ◽  
Copper Matrix Composites ◽  
Conducting Property ◽  
Reinforcement Content ◽  
Electrical Conducting

SiCp reinforced copper matrix composites with the reinforcement content of 30-50vol. % were fabricated by hot pressing using Cu-coated and uncoated SiC powder. And the microstructure and electrical conductivity of the composites were also studied. The results showed that with the increasing of SiCp particle size, the electrical conductivity of the composites also increased. And the oxides in the composites can decrease the electrical conductivity of the composites obviously. The electrical conducting property of the composites can be improved by the copper coating layer and suitable annealing treatment. It provided important data for the application of SiCp/Cu composites as electronic packaging materials.

Effect of graphene lateral size on the microstructure and properties of graphene/copper composites

2019 ◽  
Vol 34 (01n03) ◽  
pp. 2040045
Author(s):  
Dandan Zhang ◽  
Huaxing Xiao ◽  
Wei Jiang ◽  
Xia Cao ◽  
Manyu Ye ◽  
...  
Keyword(s):  
Electrical Conductivity ◽  
Tensile Strength ◽  
Hot Pressing ◽  
Copper Matrix ◽  
Matrix Composites ◽  
Lateral Size ◽  
Average Thickness ◽  
Copper Matrix Composites ◽  
Microstructure And Properties ◽  
Microstructure Observation

Copper matrix composites reinforced with graphene nanoplatelets (GNPs) were prepared by vacuum hot pressing of ball milled mixtures of powders. Two grades of GNPs were used; one with average thickness of 2 nm and average lateral size of 6 [Formula: see text]m and another with much larger lateral size of 80 [Formula: see text]m. Microstructure and properties of as-prepared composites containing 10 vol.% GNPs were studied. The GNPs sheets are uniformly distributed and well aligned in the Cu matrix. The microstructure observation shows that the GNPs-2–6 exhibits a better dispersion in the Cu matrix than GNPs-2–80. The addition of fine GNPs-2–6 lead to [Formula: see text]31% higher tensile strength and approximately same electrical conductivity of the Cu matrix, while the GNPs-2–80/Cu composite only shows a [Formula: see text]15% increase of tensile strength and a lower electrical conductivity than the Cu matrix.

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