A New Evaluation Method of Adhesion Between Glass/Epoxy Composite Substrate and Copper Foil for Multilayer Circuit Board Applications

2021 ◽  
pp. 37-42
Author(s):  
Naoto Ikegawa ◽  
Hiroyuki Hamada ◽  
Masahiro Yamanouchi
Keyword(s):  
Copper Foil ◽  
Evaluation Method ◽  
Epoxy Composite ◽  
Circuit Board ◽  
Composite Substrate

Improvement in Etching Factor of Micro Patterns by Controlling Residual Stress of Copper Thin Foil

2010 ◽  
Vol 123-125 ◽  
pp. 479-482
Author(s):  
Hyo Soo Lee ◽  
Hai Joong Lee
Keyword(s):  
Heat Treatment ◽  
Residual Stress ◽  
Copper Foil ◽  
Compressive Residual Stress ◽  
Printed Circuit Board ◽  
Thermal Conditions ◽  
Thin Foil ◽  
Circuit Board ◽  
Grain Distribution ◽  
Etching Factor

The effectiveness of residual stress on forming copper patterns of printed circuit board was investigated during applied thermal conditions. Generally, the electrolytic copper foil showed a compressive residual stress about -55~-60MPa as received, which easily caused to form copper patterns irregularly when the pattern was etched finely. The compressive residual stress was relaxed with applying heat-treatment for a few hours. However, we observed that the compressed residual stress of copper foil tended to be relaxed, constant, and compressed again during heat-treatment process, which is mainly considered as that the grain of copper is grown restrictively within a Cu thin foil layer. We suggested a quantitative method for controlling grain size, grain distribution and relaxing stress of copper foil, which was very helpful for increasing an etching factor to decrease pattern width.

A reconfigurable patch antenna printed on YIG-epoxy composite substrate

2016 ◽  
Author(s):  
E. Andreou ◽  
T. Zervos ◽  
E. Varouti ◽  
A.A. Alexandridis ◽  
F. Lazarakis ◽  
...  
Keyword(s):  
Patch Antenna ◽  
Epoxy Composite ◽  
Composite Substrate

Evaluation of Effective Thermal Conductivity of Multilayer Printed Circuit Board

2011 ◽  
Author(s):  
Toshio Tomimura ◽  
Yoshihiro Shiotsu ◽  
Yasushi Koito ◽  
Masaru Ishizuka ◽  
Tomoyuki Hatakeyama
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Printed Circuit Board ◽  
Evaluation Method ◽  
Circuit Board ◽  
Printed Circuit ◽  
Plane Direction ◽  
Simple Evaluation

To perform a rational thermal design of a printed circuit board (PCB) with highly anisotropic heat transfer nature in its initial stage, effective thermal conductivities in thickness direction and in in-plane direction must be given depending on the electric circuit of the board. However, a simple evaluation method for the effective thermal conductivities of such PCB has not been developed yet. In this study, as the first step to propose a simple evaluation method, the heat transfer coefficient by natural convection around a horizontal disk, which is indispensable for measuring the effective thermal conductivity, has been evaluated. Furthermore, the thermal conductivity of the glass epoxy resin in in-plane direction has been evaluated by applying the evaluated heat transfer coefficient, and then, the validity of the proposed thermal conductivity measurements of the anisotropic PCB has been confirmed.

Patterned ZnO Nanowires between Interdigitated Electrodes by Integrating Hydrothermal Approach with Photolithography Process

2020 ◽  
Vol 990 ◽  
pp. 283-287
Author(s):  
Yaw Jen Chang
Keyword(s):  
Copper Foil ◽  
Printed Circuit Board ◽  
Simple Approach ◽  
Zno Nanowires ◽  
Circuit Board ◽  
Interdigitated Electrodes ◽  
Printed Circuit ◽  
Lift Off ◽  
Hydrothermal Approach ◽  
Photolithography Process

This paper presents a simple approach to selectively synthesize the ZnO nanowires between interdigitated electrodes by integrating the hydrothermal method with the photolithography process. The printed circuit board (PCB) was adopted as the substrate. Interdigitated electrodes were fabricated by etching the copper foil of PCB. Then, both the positive and negative photoresists were used to control the growth of nanowires through lift-off concept. No costly materials and expensive apparatuses are required. Biotin–streptavidin reaction was used as an example to examine this proposed device. When histidine-tagged biotin was added and the reaction of biotin–streptavidin was completed, the distinguishable I-V curves were detected, respectively. The experimental results reveal that this proposed device is sensitive.

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