Evaluation of adhesion between glass/epoxy composite substrate and copper foil for printed circuit board applications

2002 ◽  
Vol 9 (3) ◽  
pp. 235-245 ◽  
Author(s):  
Naoto Ikegawa ◽  
Hiroyuki Hamada ◽  
Masahiro Yamanouchi
2020 ◽  
Vol 990 ◽  
pp. 283-287
Author(s):  
Yaw Jen Chang

This paper presents a simple approach to selectively synthesize the ZnO nanowires between interdigitated electrodes by integrating the hydrothermal method with the photolithography process. The printed circuit board (PCB) was adopted as the substrate. Interdigitated electrodes were fabricated by etching the copper foil of PCB. Then, both the positive and negative photoresists were used to control the growth of nanowires through lift-off concept. No costly materials and expensive apparatuses are required. Biotin–streptavidin reaction was used as an example to examine this proposed device. When histidine-tagged biotin was added and the reaction of biotin–streptavidin was completed, the distinguishable I-V curves were detected, respectively. The experimental results reveal that this proposed device is sensitive.


2011 ◽  
Vol 496 ◽  
pp. 259-265 ◽  
Author(s):  
Li Juan Zheng ◽  
Cheng Yong Wang ◽  
Yun Peng Qu ◽  
Li Peng Yang ◽  
Yue Xian Song

This work is focused on the investigation of the influence of the materials of PCB, feed rate, spindle speed and tool wear on thrust force when drilling PCB using 0.3 mm diameter cemented tungsten carbide drills. The results indicate that thrust force increases with feed rate and drill wear, but decreases with spindle speed firstly and then increases with it within the cutting range tested. Thrust force caused by the copper foil is much larger than that caused by the epoxy glass fiber cloth when feed rate is low. However, the difference between them decreases as feed rate increases. The thickness of nail head increases with thrust force. The accuracy of hole location increases with thrust force firstly but decreases afterward. The influence of thrust force on hole wall roughness is not obvious.


2015 ◽  
Vol 749 ◽  
pp. 290-294
Author(s):  
Jae Hyun Choi ◽  
Bong Goo Choi ◽  
Min A. Lee ◽  
Jae Sik Na

The epoxy composites with high thermal conductivity for metal-core printed circuit board (MCPCB) can be prepared by varnish coating and a hot press method. Alumina filler of plate-like shape was used as primary micro-filler, while plate-like alumina filler, h-BN, a-BN and s-BN filler were used for blending into the plate-like alumina filler as the secondary filler. Results showed that the secondary fillers a-BN and s-BN loaded epoxy composites have higher thermal conductivity than alumina filler single-loaded composites. Also, BN filler has high thermal conductivity, but h-BN filled epoxy composite has lower thermal conductivity than alumina filled epoxy composite. The decrease of voids in epoxy composite are very important, and the filler shape and surface modification is also necessary to achieve high thermal conductivity in epoxy composite for MCPCB


2017 ◽  
Vol 14 (4) ◽  
pp. 166-171
Author(s):  
Oriol Aviño-Salvado ◽  
Wissam Sabbah ◽  
Cyril Buttay ◽  
Hervé Morel ◽  
Pascal Bevilacqua

This article presents the long-term (1,000 h) behavior of two printed-circuit board materials (Panasonic R1755V, a high-TG glass-epoxy composite and Arlon 85N, a polyimide-based laminate) stored at high temperature (190°C). Tests are performed in air and in nitrogen atmospheres. Electrical and physical measurements are performed regularly (once per week). Almost no degradation is observed for both materials when stored in nitrogen. On the contrary, the board stored in air shows the consequences of ageing. This is especially true for the glass-epoxy material, which becomes unusable after 2 w, because of large swelling.


2021 ◽  
Vol 410 ◽  
pp. 692-696
Author(s):  
Alexey N. Shulgin ◽  
Olesya A. Chuprina ◽  
Vasiliy V. Pykhov

One of the main technological criteria affecting the quality of drilling the holes is the correct geometry of a cutting tool and the amount of its wear. The determination of the “critical” amount of a drill wear is possible only through the indirect way, in particular by the presence of the copper foil burrs at the tool output from the printed circuit board, since with the up-to-date degree of integration of micro-assemblies, the main part of the processed holes has the diameter of about 0.6-0.8 mm, and it is quite challenging to determine the tool wear without special equipment, and in conditions of mass production it is almost impossible. A number of industrial experiments with the hard-alloy drills of standard sharpening geometry of various amount of wear was carried out in order to assess the influence of the cutting tool geometry and the amount of wear on the drilling process. To assess the quality of the processed holes, the chip size (Lch), the micro-roughness of the holes (Ra) and the size of the copper foil burrs at the output of the workpieces (Hb) were additionally measured with a specialized precision tool. In total, 1500 holes were drilled at each previously determined operating mode. The “critical” value of the tool blunting, the maximum allowable values of Lch,Ra and Hbwere practically defined in the course of work. On the basis of the conducted experiments, the threshold values of the axial feed speeds for the work of the “worn out” and “blunted” tool were defined. In addition, the general recommendations were formulated for the operator when drilling the foiled fiberglass and eliminating mass defects at printed circuit board manufacture.


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