Wireless Power Delivery

2016 ◽  
pp. 293-302
Author(s):  
Kiichi Niitsu
2013 ◽  
Vol 101 (6) ◽  
pp. 1343-1358 ◽  
Author(s):  
Alanson P. Sample ◽  
Benjamin H. Waters ◽  
Scott T. Wisdom ◽  
Joshua R. Smith

2014 ◽  
Vol 13 ◽  
pp. 919-922 ◽  
Author(s):  
Xin Wang ◽  
Shaoshu Sha ◽  
Jinmei He ◽  
Lisheng Guo ◽  
Mingyu Lu

2018 ◽  
Vol 5 (2) ◽  
pp. 87-96 ◽  
Author(s):  
Yi Zhao ◽  
Huaye Li ◽  
Saman Naderiparizi ◽  
Aaron Parks ◽  
Joshua R. Smith

Near-field communication (NFC) readers, ubiquitously embedded in smartphones and other infrastructures can wirelessly deliver mW-level power to NFC tags. Our previous work NFC-wireless identification and sensing platform (WISP) proves that the generated NFC signal from an NFC enabled phone can power a tag (NFC-WISP) with display and sensing capabilities in addition to identification. However, accurately aligning and placing the NFC tag's antenna to ensure the high power delivery efficiency and communication performance is very challenging for the users. In addition, the performance of the NFC tag is not only range and alignment sensitive but also is a function of its run-time load impedance. This makes the execution of power-hungry tasks on an NFC tag (like the NFC-WISP) very challenging. Therefore, we explore a low-cost tag antenna design to achieve higher power delivered to the load (PDL) by utilizing two different antenna configurations (2-coil/3-coil). The two types of antenna configurations can be used to dynamically adapt to the requirements of varied range, alignment and load impedance in real-time, therefore, we achieve continuous high PDL and reliable communication. With the proposed method, we can, for example, turn a semi-passive NFC-WISP into a passive display tag in which an embedded 2.7″ E-ink screen can be updated robustly by a tapped NFC reader (e.g. an NFC-enable cell-phone) over a 3 seconds and within 1.5cm range.


Electronics ◽  
2020 ◽  
Vol 9 (8) ◽  
pp. 1210
Author(s):  
Hanh Dang-ba ◽  
Gyung-su Byun

In this paper, a sub-THz wireless power transfer (WPT) interface for non-contact wafer-level testing is proposed. The on-chip sub-THz couplers, which have been designed and analyzed with 3-D EM simulations, could be integrated into the WPT to transfer power through an air media. By using the sub-THz coils, the WPT occupies an extremely small chip size, which is suitable for future wafer-testing applications. In the best power transfer efficiency (PTE) condition of the WPT, the maximum power delivery is limited to 2.5 mW per channel. However, multi-channel sub-THz WPT could be a good solution to provide enough power for testing purposes while remaining high PTE. Simulated on a standard 28-nm CMOS technology, the proposed eight-channel WPT could provide 20 mW power with the PTE of 16%. The layouts of the eight-channel WPT transmitter and receiver occupy only 0.12 mm2, 0.098 mm2, respectively.


2017 ◽  
Vol 65 (1) ◽  
pp. 280-292 ◽  
Author(s):  
Rangarajan Jegadeesan ◽  
Kush Agarwal ◽  
Yong-Xin Guo ◽  
Shih-Cheng Yen ◽  
Nitish V. Thakor

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