Soy Flour Substitution in Polymeric Methylene Diphenyl Diisocyanate Resin for Composite Panel Applications

2020 ◽  
Vol 70 (3) ◽  
pp. 350-355
Author(s):  
Osei Asafu-Adjaye ◽  
Brian Via ◽  
Sujit Banerjee

Abstract Partial substitution of polymeric methylene diphenyl diisocyanate (pMDI) resin by 10 to 15 percent soy flour for the manufacture of strand board improves board properties while decreasing cost. For particleboard and medium-density fiberboard the soy-substituted resin performs as well as the control pMDI. The reaction of soy flour with pMDI occurs over several hours as tracked by CO2 evolution. The soy-amended resin must be used within about 30 minutes of formulation. Uniform mixing of soy flour with pMDI is critical because unreacted soy flour tends to retain water, which degrades the wet properties of the board. The soy flour increases the tack of pMDI resin, which increases the surface coverage and the relative bonded area at the glue line.

2020 ◽  
Vol 70 (1) ◽  
pp. 143-144
Author(s):  
Osei Asafu-Adjaye ◽  
Brian Via ◽  
Sujit Banerjee

Abstract Partial substitution of polymeric methylene diphenyl diisocyanate resin with soy flour increases the cold tack of the resin to the level achieved by urea formaldehyde resin. The tack can be fine-tuned by adjusting the amount of soy flour added. The increase in tack is caused by the reaction of the isocyanate resin with the water contained in soy flour, as well as with hydroxyl and other groups present in soy flour components. The higher cold tack should increase the stability of pre-press mats, especially in particleboard manufacturing.


2019 ◽  
Vol 69 (2) ◽  
pp. 154-158
Author(s):  
Qingzheng Cheng ◽  
Charles Essien ◽  
Brian Via ◽  
Sujit Banerjee

Abstract Methylene diphenyl diisocyanate (pMDI) adhesive used in the manufacture of oriented strand board and particleboard can be partially substituted with soy flour for significant cost savings. The flour is about one-third of the cost of pMDI. Properties such as internal bond, wet modulus of elasticity and modulus of rupture, and thickness swelling are unaffected by soy flour substitution of up to 20 percent. Adding soy flour to the regular dose of pMDI can improve board properties and reduce delamination.


RSC Advances ◽  
2021 ◽  
Vol 11 (40) ◽  
pp. 25010-25017
Author(s):  
Li Lu ◽  
Yan Wang ◽  
Tianhua Li ◽  
Supeng Wang ◽  
Shoulu Yang ◽  
...  

Reactions between CaCO3 and CH2O2 during polycondensation of UF resin produce Ca2+. Ionic bond complexation binds Ca2+ with UF resin. The UF resin crystalline percentage decreases from 26.86% to 22.71%. IB strength of resin bonded fiberboard increases from 0.75 to 0.94 MPa.


2016 ◽  
Vol 75 (3) ◽  
pp. 335-346 ◽  
Author(s):  
Lidia Gurau ◽  
Nadir Ayrilmis ◽  
Jan Thore Benthien ◽  
Martin Ohlmeyer ◽  
Manja Kitek Kuzman ◽  
...  

2021 ◽  
Vol 42 (2) ◽  
pp. 124-129
Author(s):  
D. Kazlauskas ◽  
G. Keturakis ◽  
V. Jankauskas ◽  
A. Andriušis

Author(s):  
S. Thirugnanam ◽  
R. Srinivasan ◽  
Kshitij Anand ◽  
Abhishek Bhardwaj ◽  
G. Puthilibai ◽  
...  

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