Spontaneous and induced optical absorption in ultra-low loss amorphous Ta2O5 and SiO2 dielectric thin films

CLEO: 2013 ◽  
2013 ◽  
Author(s):  
A. S. Markosyan ◽  
R. Route ◽  
M. M. Fejer ◽  
D. Patel ◽  
C.S. Menoni
1987 ◽  
Vol 105 ◽  
Author(s):  
Robert M. Curran ◽  
Thomas M. Crook ◽  
J. David Zook

AbstractWhile low levels of optical absorption are easily measured in SiO2 bulk samples or optical fibers, we present here a method of detirmining low levels of absorption in thin films of SiO2. Films are deposited on top of high reflectivity multi-layer miriors, and absorption is derived from the time decay in a resonant cavity of threj mirrorsgt 633 nm. Absorption coefficients on the order of 1 cm−1. (k = 10−5) can be measured in films as thin as 100 Angstroms.With this method, we find that absorption at 633 nm can be induced in SiO2 films by exposing them to a He-Ne plasma discharge. Although the plasma radiation (>10 eV) is absorbed near the SiO2 surface, the plasma-induced absorption is uniform within the SiO2 film. This was shown by plasma irradiation of SiO2 films of 4arying thickness, together with computer calgulation of the optical properties of multilayer thin films. Similar absorption behavior has been reported in SiO2 optical fibers and may be due here to DIA (Drawing-Induced Aisorption) centers or NBOHCs (Non-Bridging Oxygen Hole Centers).


2000 ◽  
Vol 28 (1-4) ◽  
pp. 161-173 ◽  
Author(s):  
Allen M. Hermann ◽  
Badri Veeraraghavan ◽  
Davor Balzar ◽  
Fred R. Fickett

Author(s):  
Ashot Markosyan ◽  
Robert M. Faris ◽  
Martin Fejer ◽  
Roger Route ◽  
Dinesh Patel ◽  
...  

2018 ◽  
Author(s):  
K. A. Rubin ◽  
W. Jolley ◽  
Y. Yang

Abstract Scanning Microwave Impedance Microscopy (sMIM) can be used to characterize dielectric thin films and to quantitatively discern film thickness differences. FEM modeling of the sMIM response provides understanding of how to connect the measured sMIM signals to the underlying properties of the dielectric film and its substrate. Modeling shows that sMIM can be used to characterize a range of dielectric film thicknesses spanning both low-k and medium-k dielectric constants. A model system consisting of SiO2 thin films of various thickness on silicon substrates is used to illustrate the technique experimentally.


1995 ◽  
Vol 31 (21) ◽  
pp. 1814-1815 ◽  
Author(s):  
A.T. Findikoglu ◽  
D.W. Reagor ◽  
Q.X. Jia ◽  
X.D. Wu

2020 ◽  
Vol 2 (3) ◽  
Author(s):  
Lukas Terkowski ◽  
Iain W. Martin ◽  
Daniel Axmann ◽  
Malte Behrendsen ◽  
Felix Pein ◽  
...  

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