Direct attachment of optical fibers to photonic integrated circuits with in situ UV curing

2021 ◽  
Author(s):  
Gregory Bond ◽  
Thomas Palone ◽  
Matthew van Niekerk ◽  
John Serafini ◽  
Mario Ciminelli ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Optical Fibers ◽  
Photonic Integrated Circuits ◽  
Uv Curing ◽  
Direct Attachment

scholarly journals Ultra-fast germanium photodiode with 3-dB bandwidth of 265 GHz

2021 ◽  
Author(s):  
S. Lischke ◽  
A. Peczek ◽  
J. S. Morgan ◽  
K. Sun ◽  
D. Steckler ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
High Speed ◽  
State Of The Art ◽  
Photonic Integrated Circuits ◽  
Bandwidth Efficiency ◽  
Novel Device ◽  
Silicon Devices ◽  
Performance Specifications ◽  
Dark Currents

AbstractOn a scalable silicon technology platform, we demonstrate photodetectors matching or even surpassing state-of-the-art III–V devices. As key components in high-speed optoelectronics, photodetectors with bandwidths greater than 100 GHz have been a topic of intense research for several decades. Solely InP-based detectors could satisfy the highest performance specifications. Devices based on other materials, such as germanium-on-silicon devices, used to lag behind in speed, but enabled complex photonic integrated circuits and co-integration with silicon electronics. Here we demonstrate waveguide-coupled germanium photodiodes with optoelectrical 3-dB bandwidths of 265 GHz and 240 GHz at a photocurrent of 1 mA. This outstanding performance is achieved by a novel device concept in which a germanium fin is sandwiched between complementary in situ-doped silicon layers. Our photodetectors show internal responsivities of 0.3 A W−1 (265 GHz) and 0.45 A W−1 (240 GHz) at a wavelength of 1,550 nm. The internal bandwidth–efficiency product of the latter device is 86 GHz. Low dark currents of 100–200 nA are obtained from these ultra-fast photodetectors.

scholarly journals Optical meta-waveguides for integrated photonics and beyond

2021 ◽  
Vol 10 (1) ◽  
Author(s):  
Yuan Meng ◽  
Yizhen Chen ◽  
Longhui Lu ◽  
Yimin Ding ◽  
Andrea Cusano ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Optical Fibers ◽  
Optical Waveguides ◽  
Electromagnetic Waves ◽  
Degrees Of Freedom ◽  
Photonic Integrated Circuits ◽  
Interaction Strength ◽  
Physical Models ◽  
Computer Algorithms ◽  
Plasmonic Waveguides

AbstractThe growing maturity of nanofabrication has ushered massive sophisticated optical structures available on a photonic chip. The integration of subwavelength-structured metasurfaces and metamaterials on the canonical building block of optical waveguides is gradually reshaping the landscape of photonic integrated circuits, giving rise to numerous meta-waveguides with unprecedented strength in controlling guided electromagnetic waves. Here, we review recent advances in meta-structured waveguides that synergize various functional subwavelength photonic architectures with diverse waveguide platforms, such as dielectric or plasmonic waveguides and optical fibers. Foundational results and representative applications are comprehensively summarized. Brief physical models with explicit design tutorials, either physical intuition-based design methods or computer algorithms-based inverse designs, are cataloged as well. We highlight how meta-optics can infuse new degrees of freedom to waveguide-based devices and systems, by enhancing light-matter interaction strength to drastically boost device performance, or offering a versatile designer media for manipulating light in nanoscale to enable novel functionalities. We further discuss current challenges and outline emerging opportunities of this vibrant field for various applications in photonic integrated circuits, biomedical sensing, artificial intelligence and beyond.

scholarly journals In situ fabricated 3D micro-lenses for photonic integrated circuits

2018 ◽  
Vol 26 (10) ◽  
pp. 13436 ◽  
Author(s):  
R. Thomas ◽  
J. Li ◽  
Sam Ladak ◽  
D. Barrow ◽  
P. M. Smowton
Keyword(s):  
Integrated Circuits ◽  
Photonic Integrated Circuits

High-efficiency broadband light coupling between optical fibers and photonic integrated circuits

Nanophotonics ◽  
2018 ◽  
Vol 7 (12) ◽  
pp. 1845-1864 ◽  
Author(s):  
Gyeongho Son ◽  
Seungjun Han ◽  
Jongwoo Park ◽  
Kyungmok Kwon ◽  
Kyoungsik Yu
Keyword(s):  
Integrated Circuits ◽  
Optical Fibers ◽  
Optical Switching ◽  
High Efficiency ◽  
Photonic Integrated Circuits ◽  
Coupling Efficiency ◽  
Optical Signal ◽  
Coupling Methods ◽  
Light Coupling ◽  
Waveguide Coupling

AbstractEfficient light energy transfer between optical waveguides has been a critical issue in various areas of photonics and optoelectronics. Especially, the light coupling between optical fibers and integrated waveguide structures provides essential input-output interfaces for photonic integrated circuits (PICs) and plays a crucial role in reliable optical signal transport for a number of applications, such as optical interconnects, optical switching, and integrated quantum optics. Significant efforts have been made to improve light coupling properties, including coupling efficiency, bandwidth, polarization dependence, alignment tolerance, as well as packing density. In this review article, we survey three major light coupling methods between optical fibers and integrated waveguides: end-fire coupling, diffraction grating-based coupling, and adiabatic coupling. Although these waveguide coupling methods are different in terms of their operating principles and physical implementations, they have gradually adopted various nanophotonic structures and techniques to improve the light coupling properties as our understanding to the behavior of light and nano-fabrication technology advances. We compare the pros and cons of each light coupling method and provide an overview of the recent developments in waveguide coupling between optical fibers and integrated photonic circuits.

scholarly journals Bridging the gap between optical fibers and silicon photonic integrated circuits

2014 ◽  
Vol 22 (2) ◽  
pp. 1277 ◽  
Author(s):  
Wissem Sfar Zaoui ◽  
Andreas Kunze ◽  
Wolfgang Vogel ◽  
Manfred Berroth ◽  
Jörg Butschke ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Optical Fibers ◽  
Photonic Integrated Circuits ◽  
Silicon Photonic

scholarly journals Localized in situ cladding annealing for post-fabrication trimming of silicon photonic integrated circuits

2016 ◽  
Vol 24 (6) ◽  
pp. 5996 ◽  
Author(s):  
Steven Spector ◽  
Jeffrey M. Knecht ◽  
Paul W. Juodawlkis
Keyword(s):  
Integrated Circuits ◽  
Photonic Integrated Circuits ◽  
Silicon Photonic

Preparation of integrated circuits for TEM electromigration in situ studies

1986 ◽  
Vol 44 ◽  
pp. 882-883
Author(s):  
J. V. Maskowitz ◽  
W. E. Rhoden ◽  
D. R. Kitchen ◽  
R. E. Omlor ◽  
P. F. Lloyd
Keyword(s):  
Integrated Circuits ◽  
Crystallographic Orientation ◽  
Silicon Wafers ◽  
Minimum Size ◽  
Test Vehicle ◽  
In Situ Studies ◽  
Boron Doped ◽  
Doped Silicon ◽  
Drill Holes

The fabrication of the aluminum bridge test vehicle for use in the crystallographic studies of electromigration involves several photolithographic processes, some common, while others quite unique. It is most important to start with a clean wafer of known orientation. The wafers used are 7 mil thick boron doped silicon. The diameter of the wafer is 1.5 inches with a resistivity of 10-20 ohm-cm. The crystallographic orientation is (111).Initial attempts were made to both drill and laser holes in the silicon wafers then back fill with photoresist or mounting wax. A diamond tipped dentist burr was used to successfully drill holes in the wafer. This proved unacceptable in that the perimeter of the hole was cracked and chipped. Additionally, the minimum size hole realizable was > 300 μm. The drilled holes could not be arrayed on the wafer to any extent because the wafer would not stand up to the stress of multiple drilling.

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