scholarly journals In situ fabricated 3D micro-lenses for photonic integrated circuits

2018 ◽  
Vol 26 (10) ◽  
pp. 13436 ◽  
Author(s):  
R. Thomas ◽  
J. Li ◽  
Sam Ladak ◽  
D. Barrow ◽  
P. M. Smowton
2021 ◽  
Author(s):  
S. Lischke ◽  
A. Peczek ◽  
J. S. Morgan ◽  
K. Sun ◽  
D. Steckler ◽  
...  

AbstractOn a scalable silicon technology platform, we demonstrate photodetectors matching or even surpassing state-of-the-art III–V devices. As key components in high-speed optoelectronics, photodetectors with bandwidths greater than 100 GHz have been a topic of intense research for several decades. Solely InP-based detectors could satisfy the highest performance specifications. Devices based on other materials, such as germanium-on-silicon devices, used to lag behind in speed, but enabled complex photonic integrated circuits and co-integration with silicon electronics. Here we demonstrate waveguide-coupled germanium photodiodes with optoelectrical 3-dB bandwidths of 265 GHz and 240 GHz at a photocurrent of 1 mA. This outstanding performance is achieved by a novel device concept in which a germanium fin is sandwiched between complementary in situ-doped silicon layers. Our photodetectors show internal responsivities of 0.3 A W−1 (265 GHz) and 0.45 A W−1 (240 GHz) at a wavelength of 1,550 nm. The internal bandwidth–efficiency product of the latter device is 86 GHz. Low dark currents of 100–200 nA are obtained from these ultra-fast photodetectors.


2016 ◽  
Vol 24 (6) ◽  
pp. 5996 ◽  
Author(s):  
Steven Spector ◽  
Jeffrey M. Knecht ◽  
Paul W. Juodawlkis

2021 ◽  
Author(s):  
Gregory Bond ◽  
Thomas Palone ◽  
Matthew van Niekerk ◽  
John Serafini ◽  
Mario Ciminelli ◽  
...  

Author(s):  
J. V. Maskowitz ◽  
W. E. Rhoden ◽  
D. R. Kitchen ◽  
R. E. Omlor ◽  
P. F. Lloyd

The fabrication of the aluminum bridge test vehicle for use in the crystallographic studies of electromigration involves several photolithographic processes, some common, while others quite unique. It is most important to start with a clean wafer of known orientation. The wafers used are 7 mil thick boron doped silicon. The diameter of the wafer is 1.5 inches with a resistivity of 10-20 ohm-cm. The crystallographic orientation is (111).Initial attempts were made to both drill and laser holes in the silicon wafers then back fill with photoresist or mounting wax. A diamond tipped dentist burr was used to successfully drill holes in the wafer. This proved unacceptable in that the perimeter of the hole was cracked and chipped. Additionally, the minimum size hole realizable was > 300 μm. The drilled holes could not be arrayed on the wafer to any extent because the wafer would not stand up to the stress of multiple drilling.


Author(s):  
Kevin Luke ◽  
Prashanta Kharel ◽  
Christian Reimer ◽  
Lingyan He ◽  
Marko Loncar ◽  
...  

ACS Photonics ◽  
2021 ◽  
Author(s):  
Chen Shang ◽  
Yating Wan ◽  
Jennifer Selvidge ◽  
Eamonn Hughes ◽  
Robert Herrick ◽  
...  

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