High-reliability, high-performance, low-cost coaxial laser module at 1.3 µm for local-loop applications

Future robotic systems will be pervasive technologies operating autonomously in unknown spaces that are shared with humans. Such complex interactions make it compulsory for them to be lightweight, soft, and efficient in a way to guarantee safety, robustness, and long-term operation. Such a set of qualities can be achieved using soft multipurpose systems that combine, integrate, and commute between conventional electromechanical and fluidic drives, as well as harvest energy during inactive actuation phases for increased energy efficiency. Here, we present an electrostatic actuator made of thin films and liquid dielectrics combined with rigid polymeric stiffening elements to form a circular electrostatic bellow muscle (EBM) unit capable of out-of-plane contraction. These units are easy to manufacture and can be arranged in arrays and stacks, which can be used as a contractile artificial muscle, as a pump for fluid-driven soft robots, or as an energy harvester. As an artificial muscle, EBMs of 20 to 40 millimeters in diameter can exert forces of up to 6 newtons, lift loads over a hundred times their own weight, and reach contractions of over 40% with strain rates over 1200% per second, with a bandwidth over 10 hertz. As a pump driver, these EBMs produce flow rates of up to 0.63 liters per minute and maximum pressure head of 6 kilopascals, whereas as generator, they reach a conversion efficiency close to 20%. The compact shape, low cost, simple assembling procedure, high reliability, and large contractions make the EBM a promising technology for high-performance robotic systems.

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A HIGH THROUGHPUT, LOW COST ASSEMBLY APPROACH FOR LED IMS PACKAGES TO HEAT SINK USING ADVANCED THERMAL INTERFACE MATERIALS

International Symposium on Microelectronics ◽

10.4071/isom-2015-tha36 ◽

2015 ◽

Vol 2015 (1) ◽

pp. 000627-000632 ◽

Cited By ~ 1

Author(s):

Swapan K. Bhattacharya ◽

Fei Xie ◽

Han Wu ◽

Kelley Hodge ◽

Keck Pathammavong ◽

...

Keyword(s):

Heat Sink ◽

High Performance ◽

High Reliability ◽

Low Cost ◽

Thermal Interface Material ◽

Thermal Interface Materials ◽

Thermal Interface ◽

Cycle Times ◽

High Adhesion ◽

Machine Cycle

The objective of this study is to design and fabricate a high reliability LED Insulated Metal Substrate (IMS) package to complex heat sink attachment using an advanced thermal interface material (TIM). The assembly consists of LED IMS parts bonded to a heat spreader/sink using an advanced TIM and a corner bond material to quickly and accurately secure the LEDs in position. The corner bond adhesive is snap cured for fast machine cycle times while the high performance, high adhesion TIM materials cure throughout the rest of the assembly operation. This approach allows high accuracy LED bonding without the need for alignment pins or fasteners to anchor to the IMS. The IMS attached to the heat sink is then electrically interconnected with a thin flex substrate on top of the IMS. This approach is expected to replace the current mechanical fastners and low strength silicone TIM materials and reduce the cycle time and overall placement cost which are key drivers especially for the automotive industry.

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MEASUREMENT OF CO AND NO2 GAS CONCENTRATION'S BY MULTISENSOR MICROSYSTEM IN THE MODE OF PULSE HEATING

Devices and Methods of Measurements ◽

10.21122/2220-9506-2017-8-2-160-167 ◽

2017 ◽

Vol 8 (2) ◽

pp. 160-167

Author(s):

O. G. Reutskaya ◽

Y. M. Pleskachevsky

Keyword(s):

Power Consumption ◽

High Performance ◽

Pulse Heating ◽

High Reliability ◽

Low Cost ◽

Gas Analysis ◽

Sensor Response ◽

Point Of View ◽

Pulsed Heating ◽

Constant Heating

The most promising for mass use in gas analysis equipment are semiconductor gas sensors due to their high reliability, easy operation and relatively low cost. Power consumption in the single-sensor mode, constant heating is from 250 to 600 W average and in pulsed mode heating – ≤ 20 W. The aim of this work was to study the effectiveness of the pulsed heating for multisensor microsystems consisting of two sensors on the substrate of the nanostructured aluminum oxide, compared with the mode of constant heating.For sensitive layers were chosen compositions: SnO2+Pt+Pd at the first sensor of the microsystem and In2O3+Al2O3+Pt on the second. Measuring the sensor response in the pulse heating mode was carried out as follows. Power on each sensor microsystem was installed 1.3 mW. Then the short-term heating (theat.. = 5 s) was performed at the power 61 mW. The detected gases CO and NO2 with the concentration 200 ppm and 4 ppm, correspondingly, were submitted to the microsystem after 15 minutes. The resistance values for each of the sensor were fixed. According to the results determine the sensitivity (sensor response) the maximum value is after 60 s for the sensor with a sensing layer SnO2+Pt+Pd when exposed to CO was 670 %, and for the sensor with In2O3+Al2O3+Pt – 380 %.Advantages of using pulsed heating from the point of view of a power consumption multisensor microsystem mW-range and high performance sensors on substrates of nanostructured alumina were established.

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Design of High Performance and Low-Cost Single Longitudinal Mode Laser Module for DWDM Application

Selected Topics on Optical Fiber Technology ◽

10.5772/26327 ◽

2012 ◽

Author(s):

Huei-Min Yang

Keyword(s):

High Performance ◽

Low Cost ◽

Longitudinal Mode ◽

Single Longitudinal Mode ◽

Mode Laser ◽

Laser Module

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High Reliability and High Performance 30μm Through-Package-Vias in Ultra-Thin Bare Glass Interposer

International Symposium on Microelectronics ◽

10.4071/isom-wa16 ◽

2014 ◽

Vol 2014 (1) ◽

pp. 000402-000408

Author(s):

Venky Sundaram ◽

Jialing Tong ◽

Kaya Demir ◽

Timothy Huang ◽

Aric Shorey ◽

...

Keyword(s):

High Performance ◽

High Reliability ◽

Low Cost ◽

Electrical Performance ◽

Mechanical Reliability ◽

Bare Glass ◽

Fine Pitch ◽

Glass Panels ◽

Accelerated Thermal Cycling ◽

Frequency Behavior

This paper presents, for the first time, the thermo-mechanical reliability and the electrical performance of 30μm through package vias (TPVs) formed by Corning in ultra-thin low-cost bare glass interposers and metallized directly by sputter seed and electroplating. In contrast to glass interposers with polymer coated glass cores reported previously, this paper reports on direct metallization of thin and uncoated glass panels with fine pitch TPVs. The scalability of the unit processes to large panel sizes is expected to result in bare glass interposers at 2 to 10 times lower cost than silicon interposers fabricated using back end of line (BEOL) wafer processes. The thermo-mechanical reliability of 30μm TPVs was studied by conducting accelerated thermal cycling tests (TCT), with most via chains passing 1000 cycles from −55°C to 125°C. The high-frequency behavior of the TPVs was characterized by modeling, design and measurement up to 30 GHz.

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