scholarly journals Polymer substrates for flexible photovoltaic cells application in personal electronic system

2016 ◽  
Vol 24 (1) ◽  
Author(s):  
K. Znajdek ◽  
M. Sibiński ◽  
A. Strąkowska ◽  
Z. Lisik
Keyword(s):  
Photovoltaic Cells ◽  
Polymeric Materials ◽  
Electronic System ◽  
Electronic Systems ◽  
Flexible Substrates ◽  
Polyimide Films ◽  
Polymer Substrates ◽  
The Third ◽  
Visible Light Range ◽  
High Elasticity

The article presents an overview of polymeric materials for flexible substrates in photovoltaic (PV) structures that could be used as power supply in the personal electronic systems. Four types of polymers have been elected for testing. The first two are the most specialized and heat resistant polyimide films. The third material is transparent polyethylene terephthalate film from the group of polyesters which was proposed as a cheap and commercially available substrate for the technology of photovoltaic cells in a superstrate configuration. The last selected polymeric material is a polysiloxane, which meets the criteria of high elasticity, is temperature resistant and it is also characterized by relatively high transparency in the visible light range. For the most promising of these materials additional studies were performed in order to select those of them which represent the best optical, mechanical and temperature parameters according to their usage for flexible substrates in solar cells.

scholarly journals A Flexible Two-Sensor System for Temperature and Bending Angle Monitoring

Materials ◽  
2021 ◽  
Vol 14 (11) ◽  
pp. 2962
Author(s):  
Yifeng Mu ◽  
Rou Feng ◽  
Qibei Gong ◽  
Yuxuan Liu ◽  
Xijun Jiang ◽  
...  
Keyword(s):  
Electronic System ◽  
Disease Diagnosis ◽  
Accurate Information ◽  
Polyimide Films ◽  
Bending Angle ◽  
Multiple Sensors ◽  
Constituent Material ◽  
Application Potential ◽  
Wearable Electronic ◽  
Bending Angles

A wearable electronic system constructed with multiple sensors with different functions to obtain multidimensional information is essential for making accurate assessments of a person’s condition, which is especially beneficial for applications in the areas of health monitoring, clinical diagnosis, and therapy. In this work, using polyimide films as substrates and Pt as the constituent material of serpentine structures, flexible temperature and angle sensors were designed that can be attached to the surface of an object or the human body for monitoring purposes. In these sensors, changes in temperature and bending angle are converted into variations in resistance through thermal resistance and strain effects with a sensitivity of 0.00204/°C for temperatures in the range of 25 to 100 °C and a sensitivity of 0.00015/° for bending angles in the range of 0° to 150°. With an appropriate layout design, two sensors were integrated to measure temperature and bending angles simultaneously in order to obtain decoupled, compensated, and more accurate information of temperature and angle. Finally, the system was tested by being attached to the surface of a knee joint, demonstrating its application potential in disease diagnosis, such as in arthritis assessment.

Experimental Study of the High Cycle Fatigue of Thin Film Metal on Polyethylene Terephthalate for Flexible Electronics Applications

2009 ◽  
Author(s):  
Khalid Alzoubi ◽  
Susan Lu ◽  
Bahgat Sammakia ◽  
Mark Poliks
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Polyethylene Terephthalate ◽  
Flexible Electronics ◽  
Electrical Resistance ◽  
Thermal Stresses ◽  
Electronic Systems ◽  
Total Width ◽  
Flexible Substrates ◽  
Polyethylene Naphthalate

Flexible electronics represent an emerging area in the electronics packaging and systems integration industry with the potential for new product development and commercialization in the near future. Manufacturing electronics on flexible substrates will produce low cost devices that are rugged, light, and flexible. However, electronic systems are vulnerable to failures caused by mechanical and thermal stresses. For electronic systems on flexible substrates repeated stresses below the ultimate tensile strength or even below the yield strength will cause failures in the thin films. It is known that mechanical properties of thin films are different from those of bulk materials; so, it is difficult to extrapolate bulk material properties on thin film materials. The objective of this work is to study the behavior of thin-film metal coated flexible substrates under high cyclic bending fatigue loading. Polyethylene terephthalate (PET) and polyethylene naphthalate (PEN) are widely used substrates in the fabrication of microelectronic devices. Factors affecting the fatigue life of thin-film coated flexible substrates were studied, including thin film thickness, temperature, and humidity. A series of experiments for sputter-deposited copper on PET substrates were performed. Electrical resistance and crack growth rate were monitored during the experiments at specified time intervals. High magnification images were obtained to observe the crack initiation and propagation in the metal film. Statistical analysis based on design of experiments concepts was performed to identify the main factors and factor’s interaction that affect the life of a thin-film coated substrate. The results of the experiments showed that the crack starts in the middle of the sample and slowly grows toward the edges. Electrical resistance increases slightly during the test until the crack length covers about 90% of the total width of the sample where a dramatic increase in the resistance takes place.

On the Thermal Interaction Between an Isothermal Cylinder and Its Isothermal Enclosure for Cylinder Rayleigh Numbers of Order 104

2001 ◽  
Vol 123 (6) ◽  
pp. 1052-1061 ◽  
Author(s):  
D. T. Newport ◽  
T. M. Dalton ◽  
M. R. D. Davies ◽  
M. Whelan ◽  
C. Forno
Keyword(s):  
Nusselt Number ◽  
Electronic System ◽  
Electronic Systems ◽  
Thermal Interaction ◽  
Cubical Enclosure ◽  
System Temperature ◽  
Nusselt Number Distribution ◽  
Complex Fluid ◽  
Digital Moiré ◽  
Rayleigh Numbers

An experimental investigation is made of the thermal interaction between a horizontal isothermal cylinder centrally located in a water-cooled isothermal cubical enclosure. The study is restricted to laminar flow and cylinder Rayleigh numbers of order 104. The application of interest is the cooling of electronic systems. This field is currently lacking in techniques that can measure the complex fluid phenomena encountered in real systems. The paper therefore begins with an experimental review of interferometry to assess its applicability as a potential solution to this need. Based on this review, a real time Digital Moire´ Subtraction interferometer is used to measure temperature profiles, and local Nusselt number distributions in two regions of interest: the plume impingement on the ceiling of the enclosure, and the upper corner region of the enclosure. A Mach-Zehnder interferometer is used for the cylinder Nusselt number distribution. Results are compared both qualitatively and quantitatively with a numerical simulation run on a commercial CFD package widely used for electronic system temperature predictions. The paper gives considerable insight into the nature of the enclosure heat transfer and an indication of the accuracy of a widely used predictive code.

Donohue+: Developing performer-specific electronic improvisatory accompaniment for instrumental improvisation

2021 ◽  
Vol 26 (1) ◽  
pp. 129-139
Author(s):  
Sam Gillies ◽  
Maria Sappho Donohue
Keyword(s):  
Decision Making ◽  
Electronic System ◽  
Instrument Design ◽  
Electronic Systems ◽  
Musical Language ◽  
Live Performance ◽  
Collaborative Process ◽  
Creative Practice ◽  
Free Improvisation ◽  
Music Making

Electronic systems designed to improvise with a live instrumental performer are a constant mediation of musical language and artificial decision-making. Often these systems are designed to elicit a reaction in a very broad way, relying on segmenting and playing back audio material according to a fixed or mobile set of rules or analysis. As a result, such systems can produce an outcome that sounds generic across different improvisers, or restrict meaningful electroacoustic improvisation to those performers with a matching capacity for designing improvisatory electroacoustic processing. This article documents the development of an improvisatory electroacoustic instrument for pianist Maria Donohue as a collaborative process for music-making. The Donohue+ program is a bespoke electroacoustic improvisatory system designed to augment the performance capabilities of Maria, enabling her to achieve new possibilities in live performance. Through the process of development, Maria’s performative style, within the broader context of free improvisation, was analysed and used to design an interactive electronic system. The end result of this process is a meaningful augmentation of the piano in accordance with Maria’s creative practice, differing significantly from other improvising electroacoustic instruments she has previously experimented with. Through the process of development, Donohue+ identifies a practice for instrument design that engages not only with a performer’s musical materials but also with a broader free improvisation aesthetic.

Electrochemical treatment of metal inserts for subsequent assembly injection molding of tight electronic systems

2018 ◽  
Vol 38 (7) ◽  
pp. 675-684 ◽  
Author(s):  
Tobias Kleffel ◽  
Dietmar Drummer
Keyword(s):  
Injection Molding ◽  
Electronic System ◽  
Electrochemical Treatment ◽  
Electronic Systems ◽  
Automotive Applications ◽  
Two Stage ◽  
Metal Insert

Abstract One method to produce electronic systems with high resilience is the encapsulation of metal inserts, for example, lead frames, using assembly injection molding. Such parts are exposed to different mediums, such as water and oil, which can infiltrate and damage the electronic system, especially in automotive applications. Hence, one challenge is to ensure the tightness. The research covered in this paper focuses on the assembly injection molding of tight electronic systems using microstructured metal inserts, manufactured by a two-stage electrochemical treatment. The effects of the electrochemical treatment on the tightness and the bond between metal and polymer of the electronic system are investigated. Furthermore, the influence of the electrochemical treatment on the surface and geometry of the metal insert is evaluated.

Definitions of terms relating to reactions of polymers and to functional polymeric materials (IUPAC Recommendations 2003)

2004 ◽  
Vol 76 (4) ◽  
pp. 889-906 ◽  
Author(s):  
K. Horie ◽  
Máximo Barón ◽  
R. B. Fox ◽  
J. He ◽  
M. Hess ◽  
...  
Keyword(s):  
Chemical Reactions ◽  
Polymeric Materials ◽  
Functional Polymers ◽  
Polymer Systems ◽  
The Third ◽  
Polymer Reactions

The document defines the terms most commonly encountered in the field of polymer reactions and functional polymers. The scope has been limited to terms that are specific to polymer systems. The document is organized into three sections. The first defines the terms relating to reactions of polymers. Names of individual chemical reactions are omitted from the document, even in cases where the reactions are important in the field of polymer reactions. The second section defines the terms relating to polymer reactants and reactive polymeric materials. The third section defines the terms describing functional polymeric materials.

Time-Dependent Fracture of Polyimide Films

1993 ◽  
Vol 115 (3) ◽  
pp. 264-269 ◽  
Author(s):  
S. F. Popelar ◽  
C. H. Popelar ◽  
V. H. Kenner
Keyword(s):  
Stress Intensity Factor ◽  
Stress Intensity ◽  
Intensity Factor ◽  
Crack Growth ◽  
Practical Implication ◽  
Slow Crack Growth ◽  
Polymeric Materials ◽  
Polyimide Films ◽  
Test Protocol ◽  
Fracture Tests

A fracture mechanics approach for quantifying slow crack growth in thin polyimide films and assessing their structural integrity and life expectancy is presented. The methodology and techniques developed in this investigation may also be applied to other polymeric materials. A test protocol for studying slow crack growth is described. Room temperature fracture tests were performed and an analysis model was developed and validated to analyze the fracture tests. Correlations between the rate of crack growth and the crack driving force as measured by the stress intensity factor were made and contrasted for Kapton 100HN, 300H and 500HN polyimide films. The crack growth rate was found to depend very strongly upon the stress intensity factor. The practical implication of this finding is that the fracture of these polyimide films may be approximated as being controlled by a critical value of the stress intensity factor.

Effect of fluorination on haze reduction in transparent polyimide films for flexible substrates

2016 ◽  
Vol 134 (4) ◽  
Author(s):  
Yooseong Yang ◽  
Jong Hwan Park ◽  
Youngsuk Jung ◽  
Seung Geol Lee ◽  
Sang Kil Park ◽  
...  
Keyword(s):  
Flexible Substrates ◽  
Polyimide Films
Sign in / Sign up

Export Citation Format

Share Document