Elektronenmikroskopische Beobachtungen der Bruchgefüge von Hartmetallen / Electron Microscope Studies of Fracture Surfaces in Hard Metals

1972 ◽  
Vol 9 (5) ◽  
pp. 243-255
Author(s):  
Erich Kohlhaas ◽  
Otto Jung ◽  
Alfred Fischer
2016 ◽  
Vol 61 (2) ◽  
pp. 791-796 ◽  
Author(s):  
S. Lesz ◽  
S. Griner ◽  
R. Nowosielski

Abstract The cracking of materials and fracture surface is of great practical and academic importance. Over the last few years the development of the fractography of crystalline alloys resulted in a useful tool for the prediction or failure analysis. Many attempts have been made to observe cracks using optical microscopy, X-ray topography and transmission electron microscopy (TEM). Of these techniques, the resolution of optical microscopy and X-ray topography is too poor. By contrast, the resolution of TEM is high enough for detailed information to be obtained. However, in order to apply TEM observations, a thin foil specimen must be prepared, and it is usually extremely difficult to prepare such a specimen from a pre-selected region containing a crack. In the present work, deformation mechanisms fracture surfaces of Ni-based metallic glass samples have been studied by specially designed experiments. In order to study the deformation mechanisms and fracture the Ni-based metallic glasses have been investigated in the tensile test. The structure and fracture surfaces after the decohesion process in tensile tests were observed using transmission electron microscope (TEM) and scanning electron microscope (SEM), respectively. The studies of structure were performed on thin foils. Moreover the investigated tape was subjected to a banding test. Then, the tape was straightened and the thin foil from the area of maximum strain was prepared. This thin foil sample was deformed before the TEM investigation to obtain local tears.


2015 ◽  
Vol 2015 ◽  
pp. 1-6 ◽  
Author(s):  
Z. Z. Zhang

Experiments on granite specimens after different high temperature under uniaxial compression were conducted and the fracture surfaces were observed by scanning electron microscope (SEM). The fractal dimensions of the fracture surfaces with increasing temperature were calculated, respectively. The fractal dimension of fracture surface is between 1.44 and 1.63. Its value approximately goes up exponentially with the increase of temperature. There is a quadratic polynomial relationship between the rockburst tendency and fractal dimension of fracture surface; namely, a fractal dimension threshold can be obtained. Below the threshold value, a positive correlativity shows between rockburst tendency and fractal dimension; when the fractal dimension is greater than the threshold value, it shows an inverse correlativity.


Author(s):  
Osamu Watanabe ◽  
Marina Kikuchi ◽  
Akihiro Matsuda

Fatigue crack propagation forms a distinctive pattern which is observable on the fracture surfaces of materials. Purpose of this study is to analyze the fracture process of the materials received under cyclic distortion loading using scanning electron microscope. The test piece made of type 304 stainless steel with the hole of a different size is examined on the conditions of the high temperature fatigue and creep-fatigue. This study first takes a picture of the fracture with SEM, and measures the intervals of striation on fracture surfaces. Next, this study calculates the number of the crack propagation cycles and compares with the original experimental data defined by the load decrease condition or the crack length. Consequently, there is not so much differences at striation intervals regardless of the size of the root notch radius in the present tests. However, the striation spacing in the creep fatigue test has grown about twice of striation intervals in the high temperature fatigue-test.


2005 ◽  
Vol 20 (11) ◽  
pp. 3088-3093
Author(s):  
Jung-Sub Lee ◽  
Kun-Mo Chu ◽  
Duk Young Jeon

Sn–3.5Ag solder bumps were formed on electroless Ni/immersion Au (Ni/Au) and organic solderability preservative (OSP) surface-finished bond pads, respectively. The shear strength of the solder bumps was measured as a function of reflow steps. Fracture surfaces and interfacial microstructures were investigated by scanning electron microscope. The shear strength of Ni/Au samples increased up to the seventh reflow step and subsequently decreased after the tenth reflow step. Spalling of Ni3Sn4 intermetallic compounds (IMCs) and the P-rich Ni layer strengthened and weakened the bond, respectively. For OSP samples, although Cu6Sn5 IMCs grew as the reflow step was repeated, no remarkable change in shear strength was observed. Interfacial fractures of OSP samples occurred at the interface between Cu6Sn5 IMC and Cu3Sn IMC. Fracture surfaces of OSP samples showed concave pits that consisted of a Cu3Sn bottom and an Sn wall. The pits were formed by separation of Cu6Sn5 IMC from Cu3Sn IMC and the molten Sn channel between the Cu6Sn5 IMC grains.


1990 ◽  
Vol 25 (10) ◽  
pp. 4440-4448 ◽  
Author(s):  
H. M�ller ◽  
K. Wetzig ◽  
B. Schultrich ◽  
S. M. Pimenov ◽  
N. I. Chapliev ◽  
...  

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