scholarly journals The Effect of Transient Liquid Phase on the Joining Process of Aluminum Foam Core Sandwiches

2016 ◽  
Vol 16 (1) ◽  
pp. 48-58
Author(s):  
A. T. Tabrizi ◽  
M. Azadbeh
Keyword(s):  
Liquid Phase ◽  
Bonding Strength ◽  
Energy Dispersive Spectrometry ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Bending Test ◽  
Recent Developments ◽  
Al Foam ◽  
Joining Process ◽  
Mathematical Relations

Abstract Despite recent developments in sandwich panels production technology, there are some difficulties in joining core sandwiches. Liquid Phase Sintering is a conventional method to increase the density of powder metallurgy parts. In this paper, we applied LPS as a joining process between Al-foam and Al-metal by using Al-mixture powders with different compositions as the interlayer. At first stage, Al-Zn powder mixture was used and the possibility of this process was investigated. At later stages, we tried to increase the joint bonding strength with different Al-mixture powder compositions. 3-point bending test was applied and by using mathematical relations, bonding strengths were calculated. The highest bonding strength was obtained, about 9 kPa, when Al-Zn-Mg was used as the interlayer. Also energy dispersive spectrometry (EDS) was used to investigate the diffusion of additive elemental powders to Al-mixture powders.

scholarly journals Transient Liquid Phase Bonding of Semi-Solid Metal 7075 Aluminum Alloy using ZA27 Zinc Alloy Interlayer

Metals ◽  
2018 ◽  
Vol 8 (8) ◽  
pp. 637 ◽  
Author(s):  
Chaiyoot Meengam ◽  
Yongyuth Dunyakul ◽  
Dech Maunkhaw ◽  
Suppachai Chainarong
Keyword(s):  
Aluminum Alloy ◽  
Liquid Phase ◽  
Bonding Strength ◽  
Transient Liquid Phase ◽  
Solid Metal ◽  
Bonding Time ◽  
Zinc Alloy ◽  
Transient Liquid Phase Bonding ◽  
Bonding Zone ◽  
Semi Solid

Transient Liquid Phase Bonding (TLPB) process of semi-solid metal 7075 aluminum alloys (SSM7075) using 50 μm thick of ZA27 zinc alloys as interlayers for the experiment were carried out under bonding temperatures of 480 and 540 °C and bonding times of 30, 60, 90 and 120 min respectively. In the bonding zone, the semi-solid state of ZA27 zinc alloy interlayers were diffused into the SSM7075 aluminum alloy. Examination of the bonding zone using Scanning Electron Microscope (SEM) and Energy-dispersive X-ray spectroscopy (EDS) showed that the precipitation of the intermetallic compound of η(Zn–Al–Cu), β(Al2Mg3Zn3), T′(Zn10Al35Cu55) and MgZn2 were formed in the bonding zone. The better homogenized microstructure in the bonding zone was formed when increasing bonding time and bonding temperature. The highest bonding strength was recorded at 17.44 MPa and average hardness was at 87.67 HV with the bonding time of 120 min and temperature at 540 °C. Statistically, the coefficient of determination analysis of bonding strength data was at 99.1%.

Transient liquid-phase sintering using silver and tin powder mixture for die bonding

2016 ◽  
Vol 55 (4S) ◽  
pp. 04EC14 ◽  
Author(s):  
Masahisa Fujino ◽  
Hirozumi Narusawa ◽  
Yuzuru Kuramochi ◽  
Eiji Higurashi ◽  
Tadatomo Suga ◽  
...  
Keyword(s):  
Liquid Phase ◽  
Powder Mixture ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Die Bonding ◽  
Transient Liquid Phase Sintering

Microstructure of Transient Liquid Phase Sintering Joint by Sn-Coated Cu Particles for High Temperature Packaging

2015 ◽  
Vol 2015 (1) ◽  
pp. 000449-000452 ◽  
Author(s):  
Xiangdong Liu ◽  
Hiroshi Nishikawa
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Liquid Phase ◽  
Applied Pressure ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Thermally Stable ◽  
Bonding System ◽  
Cu Substrates ◽  
Transient Liquid Phase Sintering

We develop a transient liquid phase sinter (TLPS) bonding using Sn-coated Cu micro-sized particles. With this bonding process, a thermally stable joint comprising Cu3Sn phase and a dispersion of ductile Cu particles can be obtained. The particle paste, which contained Cu particles with a thin Sn coating and terpineol, was used to join Cu substrates. The setup was bonded at 300 °C for 30s under an applied pressure of 10 MPa using a thermo-compression bonding system under a formic acid gas atmosphere for reducing the oxide layer on the Sn coating and the Cu substrate. After bonding, the TLPS joint showed a thermally stable microstructure with a good shear strength, which was fully consisted of Cu3Sn intermetallic compounds matrix and embedded ductile Cu particles. The kinetics of the microstructure transformation and high temperature reliability of the TLPS joint were investigated. After 300 °C isothermal aging for 200h, the shear strength and microstructure of the TLPS joints showed almost unchanged. The results demonstrate that joint with high-melting-point obtained by the TLPS bonding using Sn-coated Cu particle paste has the potential to fulfill the requirement of high temperature electronic packaging.

scholarly journals Deformation Behavior of Transient Liquid-Phase Sintered Cu-Solder-Resin Microstructure for Die-Attach

2019 ◽  
Vol 9 (17) ◽  
pp. 3476 ◽  
Author(s):  
Hiroaki Tatsumi ◽  
Hiroshi Yamaguchi ◽  
Tomoki Matsuda ◽  
Tomokazu Sano ◽  
Yoshihiro Kashiba ◽  
...  
Keyword(s):  
Liquid Phase ◽  
Resin Composite ◽  
Copper Substrate ◽  
Transient Liquid Phase ◽  
Liquid Phase Sintering ◽  
Experimental Investigations ◽  
Uniaxial Tensile ◽  
Element Analysis ◽  
Die Attach ◽  
Deformation Properties

We have proposed a low-temperature bonding technology utilizing the sintering of Cu particles with transient liquid-phase of Sn-based solder, called transient liquid-phase sintering (TLPS), as a die-attach solution for high-temperature power modules. A copper-intermetallic compound-resin (Cu-IMC-resin) microstructure, which consists of Cu particles connected with Cu–Sn intermetallic compounds (IMCs) partially filled with polyimide resin, is obtained by the pressureless TLPS process at 250 °C for 1 min using a novel Cu-solder-resin composite as the bonding material in a nitrogen atmosphere. Macro- and micro-deformation properties of the unique microstructure of the TLPS Cu-IMC-resin are evaluated by finite element analysis using a three-dimensional image reconstruction model. The macroscopic computational uniaxial tensile tests of the Cu-IMC-resin model reveal that the utilization of the IMCs and the addition of the easily-deformable resin facilitates the temperature-stability and low-stiffness of the mechanical properties. The microstructure exhibits a significantly low homogenized Young’s modulus (11 GPa). Microscopic investigations show that the local stresses are broadly distributed on the IMC regions under uniaxial macroscopic tensile displacement, indicating highly reliable performance of the joint within a specific macroscopic strain condition. Numerical and experimental investigations demonstrate the excellent thermal cyclic reliability of die-attached joints between silicon carbide chips and directly bonded copper substrate.

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