A study of a low copper dental amalgam by analytical transmission electron microscopy
1996 ◽
Vol 11
(10)
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pp. 2474-2485
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Keyword(s):
Analytical transmission electron microscopy was used to study specimens of a low-Cu dental amalgam (Velvalloy), prepared using the “wedge technique.” Analysis confirmed that the microstructure consists of a Ag2Hg3(γ1)/HgSn7−9(γ2) matrix surrounding unreacted Ag3Sn(γ) particles. In addition a hitherto uncharacterized reaction layer of fine grains between Ag3Sn(γ) and Ag2Hg3(γ1) is a mixture of Ag3Sn(γ), Ag–Hg–Sn (β1), Ag2Hg3 (γ1), and occasionally Cu6Sn5 (η′). An Ag–Hg–Sn (β1) phase was clearly identified for the first time. Since Velvalloy is a simple commercial dental amalgam, it is a reasonable starting point for characterizing more complex dental amalgam microstructures.
1990 ◽
Vol 48
(4)
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pp. 424-424
1994 ◽
Vol 349
(1-3)
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pp. 122-130
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1997 ◽
Vol 04
(03)
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pp. 559-566
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1995 ◽
Vol 103
(1203)
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pp. 1197-1200
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2014 ◽
Vol 522
◽
pp. 012026
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