Deformation Characteristics of Quasicrystalline Al–Cu–Fe Alloys

1997 ◽  
Vol 12 (8) ◽  
pp. 2043-2047 ◽  
Author(s):  
J. E. Shield ◽  
M. J. Kramer
Keyword(s):  
Grain Size ◽  
High Temperature ◽  
Grain Boundary ◽  
Deformation Process ◽  
Microstructural Analysis ◽  
Grain Boundary Sliding ◽  
High Temperature Creep ◽  
Deformation Characteristics ◽  
Boundary Sliding ◽  
Fe Alloys

The deformation characteristics of icosahedral Al–Cu–Fe quasicrystals were determined by high temperature creep experiments between 680 and 720 °C and 15 and 41 MPa. The deformation process was determined to be controlled by grain boundary mechanisms. Both the stress and grain size sensitivity exponents were found to be 2, suggesting that grain boundary sliding was the rate-controlling deformation mechanism. Microstructural analysis supported this conclusion, as no intragranular defects were produced during the deformation experiments.

The Effect of Grain Boundary State on Deformation Process Development in Nanostructured Metals Produced by the Methods of Severe Plastic Deformation

2011 ◽  
Vol 683 ◽  
pp. 69-79 ◽  
Author(s):  
Evgeny V. Naydenkin ◽  
Galina P. Grabovetskaya ◽  
Konstantin Ivanov
Keyword(s):  
Plastic Deformation ◽  
Grain Boundary ◽  
Severe Plastic Deformation ◽  
Deformation Process ◽  
Process Development ◽  
Grain Boundary Sliding ◽  
Total Deformation ◽  
Nanostructured Metals ◽  
Boundary State ◽  
Boundary Sliding

In this review the investigations of deformation process development are discussed which were carried out by tension and creep in the temperature range Т<0.4Tm (here Тm is the absolute melting point of material) for nanostructured metals produced by the methods of severe plastic deformation. The contribution of grain boundary sliding to the total deformation in the above temperature interval is also considered. An analysis is made of the effect of grain size and grain boundary state on the evolution of grain boundary sliding and cooperative grain boundary sliding in nanostructured metals.

scholarly journals The role of grain size evolution in the rheology of ice: implications for reconciling laboratory creep data and the Glen flow law

2021 ◽  
Vol 15 (9) ◽  
pp. 4589-4605
Author(s):  
Mark D. Behn ◽  
David L. Goldsby ◽  
Greg Hirth
Keyword(s):  
Grain Size ◽  
Grain Boundary ◽  
Stress Exponent ◽  
Ice Sheets ◽  
Grain Boundary Sliding ◽  
Dislocation Creep ◽  
Ice Flow ◽  
Size Evolution ◽  
Boundary Sliding ◽  
Flow Law

Abstract. Viscous flow in ice is often described by the Glen flow law – a non-Newtonian, power-law relationship between stress and strain rate with a stress exponent n ∼ 3. The Glen law is attributed to grain-size-insensitive dislocation creep; however, laboratory and field studies demonstrate that deformation in ice can be strongly dependent on grain size. This has led to the hypothesis that at sufficiently low stresses, ice flow is controlled by grain boundary sliding, which explicitly incorporates the grain size dependence of ice rheology. Experimental studies find that neither dislocation creep (n ∼ 4) nor grain boundary sliding (n ∼ 1.8) have stress exponents that match the value of n ∼ 3 in the Glen law. Thus, although the Glen law provides an approximate description of ice flow in glaciers and ice sheets, its functional form is not explained by a single deformation mechanism. Here we seek to understand the origin of the n ∼ 3 dependence of the Glen law by using the “wattmeter” to model grain size evolution in ice. The wattmeter posits that grain size is controlled by a balance between the mechanical work required for grain growth and dynamic grain size reduction. Using the wattmeter, we calculate grain size evolution in two end-member cases: (1) a 1-D shear zone and (2) as a function of depth within an ice sheet. Calculated grain sizes match both laboratory data and ice core observations for the interior of ice sheets. Finally, we show that variations in grain size with deformation conditions result in an effective stress exponent intermediate between grain boundary sliding and dislocation creep, which is consistent with a value of n = 3 ± 0.5 over the range of strain rates found in most natural systems.

Mechanical Properties of Novel Nanocrystalline Materials

2001 ◽  
Author(s):  
J. Narayan ◽  
H. Wang ◽  
A. Kvit
Keyword(s):  
Grain Size ◽  
Grain Boundary ◽  
Nanocrystalline Materials ◽  
High Surface ◽  
Grain Boundary Sliding ◽  
Boundary Shear ◽  
Functionally Gradient ◽  
Boundary Sliding ◽  
First Time ◽  
Critical Grain Size

Abstract We have synthesized nanocrystalline thin films of Cu, Zn, TiN, and WC having uniform grain size in the range of 5 to 100 nm. This was accomplished by introducing a couple of manolayers of materials with high surface and have a weak interaction with the substrate. The hardness measurements of these well-characterized specimens with controlled microstructures show that hardness initially increases with decreasing grain size following the well-known Hall-Petch relationship (H∝d−½). However, there is a critical grain size below which the hardness decreases with decreasing grain size. The experimental evidence for this softening of nanocrystalline materials at very small grain sizes (referred as reverse Hall-Petch effect) is presented for the first time. Most of the plastic deformation in our model is envisioned to be due to a large number of small “sliding events” associated with grain boundary shear or grain boundary sliding. This grain-size dependence of hardness can be used to create functionally gradient materials for improved adhesion and wear among other improved properties.

scholarly journals Molecular Dynamics Simulation on Creep Behavior of Nanocrystalline TiAl Alloy

Nanomaterials ◽  
2020 ◽  
Vol 10 (9) ◽  
pp. 1693
Author(s):  
Fei Zhao ◽  
Jie Zhang ◽  
Chenwei He ◽  
Yong Zhang ◽  
Xiaolei Gao ◽  
...  
Keyword(s):  
Molecular Dynamics ◽  
Grain Size ◽  
Steady State ◽  
High Temperature ◽  
Grain Boundary ◽  
Tial Alloy ◽  
Boundary Diffusion ◽  
Dislocation Motion ◽  
High Temperature Creep ◽  
Creep Stage

TiAl alloy represents a new class of light and heat-resistant materials. In this study, the effect of temperature, pressure, and grain size on the high-temperature creep properties of nanocrystalline TiAl alloy have been studied through the molecular dynamics method. Based on this, the deformation mechanism of the different creep stages, including crystal structure, dislocation, and diffusion, has been explored. It is observed that the high-temperature creep performance of nanocrystalline TiAl alloy is significantly affected by temperature and stress. The higher is the temperature and stress, the greater the TiAl alloy’s steady-state creep rate and the faster the rapid creep stage. Smaller grain size accelerates the creep process due to the large volume fraction of the grain boundary. In the steady-state deformation stage, two kinds of creep mechanisms are manly noted, i.e., dislocation motion and grain boundary diffusion. At the same temperature, the creep mechanism is dominated by the dislocation motion in a high-stress field, and the creep mechanism is dominated by the diffusion creep in the low-stress field. However, it is observed to be mainly controlled by the grain boundary diffusion and lattice diffusion in the rapid creep stage.

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