Excimer-Laser-Induced Melting and Solidification of PECVD a-Si films under Partial-Melting Conditions

2011 ◽  
Vol 1321 ◽  
Author(s):  
Q. Hu ◽  
Catherine S. Lee ◽  
T. Li ◽  
Y. Deng ◽  
U.J. Chung ◽  
...  

ABSTRACTThis paper reports on new experimental findings and conclusions regarding the pulsed-laser-induced melting-and-solidification behavior of PECVD a-Si films. The experimental findings reveal that, within the partial-melting regime, these a-Si films can melt and solidify in ways that are distinct from, and more complex than, those encountered in microcrystalline-cluster-rich LPCVD a-Si films. Specifically (1) spatially dispersed and temporally stochastic nucleation of crystalline solids occurring relatively effectively at the moving liquid-amorphous interface, (2) very defective crystal growth that leads to the formation of fine-grained Si proceeding, at least initially after the nucleation, at a sufficiently rapidly moving crystal solidification front, and (3) the propensity for local preferential remelting of the defective regions and grain boundaries (while the beam is still on) are identified as being some of the fundamental factors that can participate and affect how these PECVD films melt and solidify.

2006 ◽  
Vol 979 ◽  
Author(s):  
S. Hazair ◽  
P. C. van der Wilt ◽  
Y. Deng ◽  
U.-J. Chung ◽  
A. B. Limanov ◽  
...  

AbstractThin Si films on SiO2 that are completely melted by pulsed laser irradiation cool rapidly and eventually solidify via nucleation and growth of solids. It has been observed that a variety of solidified microstructures can be obtained, depending primarily (but not exclusively) on the degree of supercooling achieved prior to the onset of nucleation. This paper focuses on investigating one particular and unusual polycrystalline microstructure that consists of “flower-like” grains, the interiors of which can be described as being made up of two distinct regions: (1) an extremely defective core region consisting of fine-grained material, and (2) an outer region consisting of relatively defect-free crystal “petals” that radiate outwards. After considering the microstructural details and experimental behavior of the microstructure, we have formulated a growth-based physical model to account for the formation of the microstructure. The model is found to be also capable of accounting for the other complex and unusual microstructures obtained via nucleation and growth in the complete melting regime.


2010 ◽  
Vol 1245 ◽  
Author(s):  
Yikang Deng ◽  
Qiongying Hu ◽  
Ui-Jin Chung ◽  
Adrian Chitu ◽  
Alexander Limanov ◽  
...  

AbstractWe have investigated the solid nucleation mechanism in laser-quenched Si films on SiO2. Previously neglected experimental steps, consisting of BHF-etching and irradiation in vacuum, were implemented to reduce potential extrinsic influences. The resulting experimental findings and computational analysis lead us to conclude that solid nucleation consistently takes place heterogeneously at, and only at, the bottom liquid Si-SiO2 interface.


2015 ◽  
Vol 1770 ◽  
pp. 55-60
Author(s):  
Ying Wang ◽  
Monica D. Chahal ◽  
J. J. Wang ◽  
A. B. Limanov ◽  
A. M. Chitu ◽  
...  

ABSTRACTWe have experimentally investigated the anisotropy of Si-SiO2 interfacial energy by leveraging the mixed-phase solidification (MPS) method. By examining the microstructure evolution resulting from partial-melting-and-solidification cycles, and interpreting the changes in the surface-orientation distribution of the grains in terms of the thermodynamic model, we have identified the orientation-dependent hierarchical order of Si-SiO2 interfacial energies, σ{hkl}, as: σ{100} < σ{310} < σ{113} < σ{112} < σ{221} < σ{210}∼σ{331} < σ{111}, σ{110}.


2006 ◽  
Vol 505-507 ◽  
pp. 283-288 ◽  
Author(s):  
Chien Hung Chang ◽  
Long Sun Chao

In the fabrication of a poly-Si film, an a-Si thin layer on glass substrate is melted by the irradiation of an excimer laser with the duration of nanosecond scale, and then is cooled down to form the poly-Si one. For analyzing the fabricating process, an efficient two-dimensional numerical model has been developed in this work, based on the finite difference method and the specific heat/enthalpy method used to handle the release of latent heat. The model can simulate the heat transfer, melt and solidification behavors of a-Si films subjected to the laser irradiation. Numerical analysis was performed by solving the heat flow equation which incorporates the material properties of temperature dependence, the surface reflectivity of silicon film, the variation of the incident power density with time and heat lose by the radiation and convection from the film surfaces into the surroundings. From the analysis of temperature responses for different laser intensities, the thresholds corresponding to the surface and full melting of the Si film can be found. The temperature responses are essentially different in the partial-melting and the complete-melting regimes. The Ft (surface melting threshold) and Fc (full-melt threshold) obtained from the simulation results of the proposed model in this study agree fairly well with those from the experimental data reported in the literature. In the partial-melting regime, the maximum temperature is close to the melting point of amorphous Si, since it is the point where solid a-Si is transformed into liquid state and the high latent heat can absorb extra energy to keep the temperature at the melting point. The fluence larger than Fc is the complete-melting regime, the maximum temperature increases with fluence. It is also found that the variation of the surface reflectivity gives a good way to observe the phase change and the melting duration. When the a-Si melts, the reflectivity rapidly goes up to a steady value which is consistent with the reflectivity of liquid silicon, and stays there until the melt silicon begins to solidify. As the irradiation energy of laser increases, the melting duration in the silicon layer is prolonged.


2015 ◽  
Vol 1770 ◽  
pp. 67-72
Author(s):  
Vernon K. Wong ◽  
A. M. Chitu ◽  
A. B. Limanov ◽  
James S. Im

ABSTRACTWe have investigated the solidified microstructure of nucleation-generated grains obtained via complete melting of Si films on SiO2 at high nucleation temperatures. This was achieved using a high-temperature-capable hot stage in conjunction with excimer laser irradiation. As predicted by the direct-growth model that considers (1) the evolution in the temperature of the solidifying interface and (2) the subsequent modes of growth (consisting of amorphous, defective, and epitaxial) as key factors, we were able to observe the appearance of “normal” grains that possess a single-crystal core area. These grains, which are in contrast to previously reported flower-shaped grains that fully make up the microstructure of the solidified films obtained via irradiation at lower preheating temperatures (and amongst which these “normal” grains emerge), indicate that epitaxial growth of nucleated crystals must have taken place within the grains. We discuss the implications of our findings regarding (1) the validity of the direct-growth model, (2) the nature of the heterogeneous nucleation mechanism, and (3) the alternative explanations and assumptions that have been previously employed in order to explain the microstructure of Si films obtained via nucleation and growth within the complete melting regime.


1983 ◽  
Vol 23 ◽  
Author(s):  
D. H. Lowndes ◽  
R. F. Wood ◽  
C. W. White ◽  
J. Narayan

ABSTRACTMeasurements of the time of the onset of melting of self-implantation amorphized (a) Si, during an incident laser pulse, have been combined with modified melting model calculations and measurements of surface melt duration to demonstrate that the thermal conductivity, Ka, of a-Si is very low (≃0.02 W/cm-K). Ka is also shown to be the dominant parameter determining the dynamical response of ionimplanted Si to pulsed laser radiation; the latent heat and melting temperature of a-Si are relatively unimportant. Cross-sectional transmission electron micrographs on implantation-amorphized Si layers of several different thicknesses show that for energy densities less than the threshold value for complete annealing there are usually two distinct regions in the re-solidified a-Si, consisting of fine-grained and large-grained polycrystalline Si, respectively. The presence of the fine-grained poly-Si suggests that bulk nucleation occurs directly from the highly undercooled liquid phase. Thermal melting model calculations suggest that the nucleation temperature, Tn is ≃1200°C.


2011 ◽  
Vol 176 (11) ◽  
pp. 835-839
Author(s):  
Wanbing Lu ◽  
Xingkuo Li ◽  
Xinzhan Wang ◽  
Liping Wu ◽  
Li Han ◽  
...  

1987 ◽  
Vol 2 (5) ◽  
pp. 648-680 ◽  
Author(s):  
D. H. Lowndes ◽  
S. J. Pennycook ◽  
G. E. Jellison ◽  
S. P. Withrow ◽  
D. N. Mashburn

Nanosecond resolution time-resolved visible (632.8 nm) and infrared (1152 nm) reflectivity measurements, together with structural and Z-contrast transmission electron microscope (TEM) imaging, have been used to study pulsed laser melting and subsequent solidification of thick (190–410 nm) amorphous (a) Si layers produced by ion implantation. Melting was initiated using a KrF (248 nm) excimer laser of relatively long [45 ns full width half maximum (FWHM)] pulse duration; the microstructural and time-resolved measurements cover the entire energy density (E1) range from the onset of melting (at ∼ 0.12J/cm2) up to the onset of epitaxial regrowth (at ∼ 1.1 J/cm2). At low E1 the infrared reflectivity measurements were used to determine the time of formation, the velocity, and the final depth of “explosively” propagating buried liquid layers in 410 nm thick a-Si specimens that had been uniformly implanted with Si, Ge, or Cu over their upper ∼ 300 nm. Measured velocities lie in the 8–14 m/s range, with generally higher velocities obtained for the Ge- and Cu-implanted “a-Si alloys.” The velocity measurements result in an upper limit of 17 (± 3) K on the undercooling versus velocity relationship for an undercooled solidfying liquid-crystalline Si interface. The Z-contrast scanning TEM measurements of the final buried layer depth were in excellent agreement with the optical measurements. The TEM study also shows that the “fine-grained polycrystalline Si” region produced by explosive crystallization of a-Si actually contains large numbers of disk-shaped Si flakes that can be seen only in plan view. These Si flakes have highly amorphous centers and laterally increasing crystallinity; they apparently grow primarily in the lateral direction. Flakes having this structure were found both at the surface, at low laser E1, and also deep beneath the surface, throughout the “fine-grained poly-Si” region formed by explosive crystallization, at higher E1. Our conclusion that this region is partially amorphous (the centers of flakes) differs from earlier results. The combined structural and optical measurements suggest that Si flakes nucleate at the undercooled liquid-amorphous interface and are the crystallization events that initiate explosive crystallization. Time-resolved reflectivity measurements reveal that the surface melt duration of the 410 nm thick a-Si specimens increases rapidly for 0.3E1 <0.6 J/cm2, but then remains nearly constant for E1 up to ∼ 1.0 J/cm2. For 0.3 < E1 < 0.6 J/cm2 the reflectivity exhibits a slowly decaying behavior as the near-surface pool of liquid Si fills up with growing large grains of Si. For higher E1, a flat-topped reflectivity signal is obtained and the microstructural and optical studies together show that the principal process occurring is increasingly deep melting followed by more uniform regrowth of large grains back to the surface. However, cross-section TEM shows that a thin layer of fine-grained poly-Si still is formed deep beneath the surface for E1<0.9 J/cm2, implying that explosive crystallization occurs (probably early in the laser pulse) even at these high E1 values. The onset of epitaxial regrowth at E1 = 1.1 J/cm2 is marked by a slight decrease in surface melt duration.


2020 ◽  
Vol 8 (1) ◽  
pp. 33
Author(s):  
Daama Isaac ◽  
Mbowou Gbambie Isaac Bertrand ◽  
Yamgouot Ngounouno Fadimatou ◽  
Ntoumbe Mama ◽  
Ngounouno Ismaïla

The Garga-Sarali granitoids outcrop in form of large slabs and undistorted large blocks, into a schisto-gneissic basement. These rocks contain mainly muscovite and microcline, followed by K-feldspar, quartz, biotite, pyroxene, zircon and oxides, with coarse-grained to fine-grained textures. Geochemical analysis show that it belongs to differentiated rocks group (granodiorite-granite) with high SiO2 (up to 72 wt%) contents. Their genesis was made from a process of partial melting and fractional crystallization. These rocks are classified as belonging to I- and S-Type, meta-peraluminous, shoshonitic granites; belonging to the domain of volcanic arcs. The rare earth elements patterns suggest a source enriched of incompatible elements. The Nb-Ta and Ti negative anomalies from the multi-element patterns are characteristics of the subduction domains.  


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