Ba substituted Pb(ZrxTi1-x)O3 thin films grown by MOCVD

2005 ◽  
Vol 902 ◽  
Author(s):  
Jochen Puchalla ◽  
Susanne Hoffmann-Eifert ◽  
Lorena Cattaneo ◽  
Sergio Carella ◽  
Rainer Waser

AbstractHigh quality Pb(Zr,Ti)O3 [PZT] and (Pb1-xBax)(ZryTi1-y)O3 (x ≤ 0.15, 0.25 ≤ y ≤ 0.50) [PBZT] thin films were grown on Pt (111) and Ir (111) coated silicon substrates by means of a pulsed liquid injection metal organic chemical vapor deposition (MOCVD) technique. The precursor solutions of Pb(DPM)2, Ba(DPM)2, Zr(IBPM)4, and Ti(OiPr)2(DPM)2 dissolved in butylacetate were separately injected into an AIX-200 reactor using a TriJet™ vaporizer. Stoichiometric films (0.98 ≤ A/B ≤ 1.06) with thickness between 80 nm and 150 nm were deposited at a susceptor temperature of 615 °C to 660 °C. Pure PZT films grown on platinum coated substrates show a randomly oriented perovskite structure accompanied with formation of a PbPtx alloy at the PZT/Pt interface. On the Ir(111) coated substrates the pure PZT films also exhibit a random orientation possibly due to oxidation of the Ir surface layer during the deposition process. Ferroelectric properties of Pr = 35 µC/cm2 and Ec = 90 kV/cm were obtained for a PZT (30/70) film of 150 nm thickness grown on Ir/Si. In contrast, PBZT films with a Ba content of about 5 to 15% show lower tendency for formation of a PbPtx interfacial layer, and a preferred (111) texture was observed for PBZT films grown on the Ir (111) substrates under optimized process conditions. Tetragonal and rhombohedral PBZT films with 15% Ba and a Zr-content of about 0.35 and 0.50, respectively, show an orientation dependence of the ferroelectric properties in the way that Ec is highest for <111> textured films in comparison to Ec determined for <110> textured films. The remanent polarization of 85 nm thick tetragonal PBZT films changes from 17 µC/cm2 for <111> orientation to 13.5 µC/cm2 for <110> texture. The relative permittivity changes in the same way from 600 to 540, respectively. The rhombohedral films exhibit a nearly independent Pr value of about 11 µC/cm2 while the switching field changes from 75 kV/cm for an <111> textured film to 46 kV/cm for an (110) textured one. The relative permittivity values of both films are 890 and 715 for the (110) and the (111) textured films, respectively. The trends observed for the textured PBZT films grown on Si substrates reflect the behaviour reported for epitaxial films [2]

1997 ◽  
Vol 12 (3) ◽  
pp. 783-792 ◽  
Author(s):  
Yongfei Zhu ◽  
Seshu B. Desu ◽  
Tingkai Li ◽  
Sasangan Ramanathan ◽  
Masaya Nagata

A liquid source metal-organic chemical vapor deposition system was installed to deposit SrBi2Ta2O9 (SBT) thin films on sapphire and Pt/Ti/SiO2/Si substrates. The process parameters such as deposition temperature and pressure, and ratio of Sr: Bi: Ta in the precursor solutions were optimized to achieve stoichiometric films with good reproducible ferroelectric properties. It was found that the nucleation of SBT started at a deposition temperature close to 500 °C and grain growth dominated at 700 °C and higher temperatures. With increasing deposition temperatures, the grain size of SBT thin films increased from 0.01 μm to 0.2 μm; however, the surface roughness and porosity of the films also increased. To fabricate specular SBT films, the films had to be deposited at lower temperature and annealed at higher temperature for grain growth. A two-step deposition process was developed which resulted in high quality films in terms of uniformity, surface morphology, and ferroelectric properties. The key to the success of this process was the homogeneous nucleation sites at lower deposition temperature during the first step and subsequent dense film growth at higher temperature. The two-step deposition process resulted in dense, homogeneous films with less surface roughness and improved ferroelectric properties. SBT thin films with a grain size of about 0.1 μm exhibited the following properties: thickness: 0.16–0.19 μm; 2Pr: 7.8–11.4 μC/cm2 at 5 V; Ec: 50–65 kV/cm; Ileakage: 8.0–9.5 × 10−9 Acm−2 at 150 kV/cm; dielectric constant: 100–200; and fatigue rate: 0.94–0.98 after 1010 cycles at 5 V.


1997 ◽  
Vol 493 ◽  
Author(s):  
C. H. Lin ◽  
B. M. Yen ◽  
Haydn Chen ◽  
T. B. Wu ◽  
H. C. Kuo ◽  
...  

ABSTRACTHighly textured PbZrxTi1−xO3 (PZT) thin films with x= 0-0.6 were grown on LaNiO3 coated Si substrates at 600 °C by metal-organic chemical vapor deposition (MOCVD). The preferred crystalline orientation of PZT thin films with various Zr concentration were characterized by X-ray diffraction (XRD). Microstructures were studied by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The dielectric constants, hysteresis and fatigue behavior of these thin films were also measured. The relationship between growth rate and the preferential orientation is discussed. Furthermore, the dependence of the electrical properties on Zr concentration and preferential orientation is demonstrated.


1988 ◽  
Vol 144 ◽  
Author(s):  
P. Grodzinski ◽  
J.H. Mazur ◽  
A. Nouhi ◽  
R.J. Stirn ◽  
R. Sudharsananu

ABSTRACTElectron diffraction and high resolution electron microscopy (HREM) have been used to investigate the origin of multiple orientation-relationships and defect structure of CdTe thin films grown on (100) GaAs and Si substrates by metal- organic chemical vapor deposition (MOCVD). It has been determined that growth at 370°C with pre-exposure of the GaAs surface to Te following oxide desorption treatment at 600°C resulted in non-parallel epitaxy ((111)CdTe // (100)GaAs), while growth at 300°C following oxide desorption at 500°C with no exposure to Te resulted in parallel epitaxy ((100)CdTe // (100)GaAs). Both epitaxial orientation-relationships were observed on the same substrate for growth at 300°C temperature after 600°C oxide desorption treatment, but with no pre-exposure of the GaAs surface to Te. Preliminary results of growth of CdTe on Si are also reported.


1998 ◽  
Vol 541 ◽  
Author(s):  
Nan Chen ◽  
G. R. Bai ◽  
O. Auciello ◽  
R. E. Koritala ◽  
M. T. Lanagan

AbstractSingle-phase polycrystalline PbZrO3 (PZ) thin films, 3000-6000 A thick, have been grown by metal-organic chemical vapor deposition (MOCVD) on (111)Pt/Ti/SiO2/Si substrates at ≍525°C. X-ray diffraction analysis indicated that the PZ films grown on (111)Pt/Ti/SiO2/Si (Pt/Tgi/Si) showed preferred pseudocubic (110) orientation. In contrast, PZ films grown on 150 A thick PbTiO3 (PT) template layers exhibited a pseudocubic (100) preferred orientation, and PZ films deposited on TiO2 template layers consisted of randomly oriented grains. The PZ films grown on Pt/Ti/Si with or without templates exhibited dielectric constants of 120-200 and loss tangents of 0.01-0.0. The PZ films with (110) orientation exhibited an electric-field-inducedtransformation from the antiferroelectric phase to the ferroelectric phase with a polarization of ≍34 µC/cm2, and the energy that was stored during switching was 7.1 J/cm3. The field needed to excite the ferroelectric state and that needed to revert to the antiferroelectric state were 50 and 250 kV/cm, respectively. Relationships between the MOCVD processing and the film microstructure and properties are discussed.


2005 ◽  
Vol 902 ◽  
Author(s):  
Serhiy Matichyn ◽  
Marco Lisker ◽  
Edmund P. Burte

AbstractIn this study lead zirkonat titanate (PZT) thin films were deposited using direct liquid injection metal organic chemical vapor deposition (DLI-MOCVD).The chemical states and the stoichiometry of PZT-films were characterized using X-ray photoelectron spectroscopy (XPS). The crystal structure of the films was investigated by X-ray diffraction (XRD).The surface composition of the films was Pb : Zr : Ti = 1.05 : 0.52 : 0.48, which indicates that the deposited films had a stoichiometric PZT composition. 130 nm thick PZT films deposited on Ir showed <110> preferred orientation.The main role for formation of the perovsktive PZT films plays the content of the lead in the deposited films. Lead deficiency causes the formation of the pyrochlore phase with poor electrical properties. In films with a significant excess of lead a second PbO phase appeared that can be observed even with naked eyes. Negligible excess of lead can be reduced by post-deposition annealing at 500-600 °C.The Ir/PZT/Ir capacitor showed large values of the remanent polarisation of about 60μC/cm2 at an applied voltage of 3 V. So high value of the remanent polarisation can be induced by structural stress in the films. After ten switch impulses the values of the remanent polarisation have significantly decreased. This is probably due to a relaxation of crystal cells.


2001 ◽  
Vol 672 ◽  
Author(s):  
Sang Y. Kang ◽  
Cheol S. Hwang ◽  
Hyeong J. Kim

ABSTRACTRu thin films were deposited on SiO2/Si and (Ba,Sr)TiO3 [BST]/Pt/TiO2/SiO2/Si substrates using Ru(C2H5C5H4)2 [Ru(EtCp)2] by metal-organic chemical vapor deposition (MOCVD). To determine the effects of the solvent, C4H8O [tetrahydrofuran: THF], it was injected into the reaction chamber by the Direct Liquid Injection (DLI) system while Ru(EtCp)2 was input through the bubbler system. Also, Ru thin films were deposited using a liquid source, Ru(EtCp)2 dissolved in THF, delivered by the DLI system. The surface of the Ru thin films deposited on the BST substrate using only Ru(EtCp)2 through the bubbler system was very rough and milky, but the addition of THF made the surface of the films smooth and clean. In addition, Ru films deposited at 325°C using Ru(EtCp)2 dissolved in THF through the DLI system have a dense and smooth microstructure with resistivity as low as 15µωcm.


1992 ◽  
Vol 284 ◽  
Author(s):  
Hiroshi Miki ◽  
Yuzuru Ohji ◽  
Shinichi Tachi

ABSTRACTFerroelectric PZT (Pb (Zr,Ti)O3) from 100 nm down to 50 nm thick was deposited on Pt/SiO2/Si substrates using MOCVD (Metal Organic Chemical Vapor Deposition) under reduced pressure at 550°C. Using Pb (DPM)2, Zr (DPM)4, and Ti(i–OC3H7)4 as precursors made it possible to control the composition of CVD films and to produce pure perovskite crystalline structure in the range of thickness less than 100 nm. Electrical measurements of the capacitors revealed that 50-nm PZT films typically had a dielectric constant of 500, resulting in the same capacitance as 0.4-nm SiO2.


Sign in / Sign up

Export Citation Format

Share Document