Thermal and Stress Modeling for the Flash Lamp Crystallization of Amorphous Silicon Films

2006 ◽  
Vol 910 ◽  
Author(s):  
Mark Smith ◽  
Richard A. McMahon ◽  
Keith A. Seffen ◽  
Dieter Panknin ◽  
Matthias Voelskow ◽  
...  

AbstractThin poly-crystalline silicon films are attractive for the fabrication of active matrix liquid crystal displays. We investigate the use of flash lamp annealing to crystallize amorphous silicon layers on glass substrates as a low cost manufacturing route. In this process amorphous silicon (a-Si) can be crystallized by solid phase crystallization (SPC) or in the super lateral growth (SLG) regime. We present a thermal model incorporating the phase transitions during annealing; providing a valuable tool for optimizing the process conditions. Another consideration is the evolution of stress resulting from the transient thermal loading of the substrate material. Results are presented for various substrate geometries and important scalability issues are addressed.

1999 ◽  
Vol 587 ◽  
Author(s):  
Rosaria A. Puglisi ◽  
Hiroshi Tanabe ◽  
Claudine M. Chen ◽  
Harry A. Atwater ◽  
Emanuele Rimini

AbstractWe investigated the formation of large-grain polycrystalline silicon films on glass substrates for application in low-cost thin film crystalline silicon solar cells. Since use of glass substrates constrains process temperatures, our approach to form large-grain polycrystalline silicon templates is selective nucleation and solid phase epitaxy (SNSPE). In this process, selective crystallization of an initially amorphous silicon film, at lithographically predetermined sites, enables grain sizes larger than those observed via random crystallization. Selective heterogeneous nucleation centers were created on undoped, 75 nm thick, amorphous silicon films, by masked implantation of Ni islands, followed by annealing at temperatures below 600 °. At this temperature, the Ni precipitates into NiSi2 particles that catalyze the transition from the amorphous to the crystalline Si phase. Seeded crystallization begins at the metal islands and continues via lateral solid phase epitaxy (SPE), thus obtaining crystallized regions of several tens of square microns in one hour. We have studied the dependence of the crystallization rate on the Ni-implanted dose in the seed, in the 5×1015/cm3 - 1016/cm3range. The large grained polycrystalline Si films were then used as a substrate for molecular beam epitaxy (MBE) depositions of 1 [.proportional]m thick Si layers. Transmission electron microscopy (TEM) analysis showed a strong correlation between the substrate morphology and the deposited layer. The layer presented a large grain morphology, with sizes of about 4 [.proportional]m.


1984 ◽  
Vol 117 (2) ◽  
pp. 117-123 ◽  
Author(s):  
B. Loisel ◽  
B. Guenais ◽  
A. Poudoulec ◽  
P. Henoc

2007 ◽  
Vol 989 ◽  
Author(s):  
Tining Su ◽  
Tong Ju ◽  
P. Craig Taylor ◽  
Pauls Stradins ◽  
Yueqin Xu ◽  
...  

AbstractSolid-phase crystallization and the subsequent re-hydrogenation of the amorphous silicon thin films provides a low cost approach for thin-film crystalline Si:H-based photovoltaic devices. During the hydrogen effusion, significant lattice reconstruction occurs, as hydrogen is driven out of the film, accompanied by creation and migration of a large number of dangling bonds. We used electron-spin-resonance (ESR) to study evolution of the local order surrounding these dangling bonds during crystallization. When samples made by both plasma enhanced chemical vapor deposition (PECVD) and the and hot wire CVD (HWCVD) are heated to 560°C, hydrogen effuses within 30 min, giving rise to H-effused defect densities of about 5x1018 cm-3. Further heating at 560°C results in crystallizati°n in the HWCVD sample after about 200 min. On the other hand, PECVD samples crystallize only when heated up to 580°C, and then only after much longer times (Dt ~ 1300 min) [1,2]. ESR defects in both samples persist at the 5x1018 cm-3 level as long as the sample remains amorphous during the grain nucleation period. As the crystallites appear, the defect densities gradually decrease and saturate at about 3x1017 cm-3 as the crystallization is completed, both in HWCVD and PECVD samples.In the H-effused states before crystallization, the ESR signals for both the HWCVD and PECVD samples show significant exchange-narrowing, suggesting that the defects are probably clustered. As the sample crystallizes, the defect clustering largely disappears, yet the line-widths in fully crystallized films are somewhat narrower than those in typical micro-crystalline silicon thin films as reported earlier [3]. This difference is probably due the specific structures of the grain boundaries in the present study. The effect of re-hydrogenation on both the H-effused amorphous and crystallized states will be discussed.


2020 ◽  
Vol 65 (3) ◽  
pp. 236
Author(s):  
R. M. Rudenko ◽  
O. O. Voitsihovska ◽  
V. V. Voitovych ◽  
M. M. Kras’ko ◽  
A. G. Kolosyuk ◽  
...  

The process of crystalline silicon phase formation in tin-doped amorphous silicon (a-SiSn) films has been studied. The inclusions of metallic tin are shown to play a key role in the crystallization of researched a-SiSn specimens with Sn contents of 1–10 at% at temperatures of 300–500 ∘C. The crystallization process can conditionally be divided into two stages. At the first stage, the formation of metallic tin inclusions occurs in the bulk of as-precipitated films owing to the diffusion of tin atoms in the amorphous silicon matrix. At the second stage, the formation of the nanocrystalline phase of silicon occurs as a result of the motion of silicon atoms from the amorphous phase to the crystalline one through the formed metallic tin inclusions. The presence of the latter ensures the formation of silicon crystallites at a much lower temperature than the solid-phase recrystallization temperature (about 750 ∘C). A possibility for a relation to exist between the sizes of growing silicon nanocrystallites and metallic tin inclusions favoring the formation of nanocrystallites has been analyzed.


2014 ◽  
Vol 568 ◽  
pp. 38-43 ◽  
Author(s):  
J.M. Westra ◽  
R.A.C.M.M. van Swaaij ◽  
P. Šutta ◽  
K. Sharma ◽  
M. Creatore ◽  
...  

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