Texture Evolution in Cu Films and Lines

2007 ◽  
Vol 990 ◽  
Author(s):  
Chia-Jeng Chung ◽  
David Field ◽  
No-Jin Park ◽  
Christy Woo
Keyword(s):  
Grain Growth ◽  
Strain Energy ◽  
Texture Evolution ◽  
Growth Conditions ◽  
Geometric Constraints ◽  
In Situ Observation ◽  
Processing Conditions ◽  
Cu Films ◽  
Unique Character

ABSTRACTGrain growth in polycrystalline films is controlled by the energetics of the surface, interface and grain boundaries as well as strain energy. The unique character of damascene lines fabricated from electroplated Cu films introduces the additional considerations of bath chemistry and geometric constraints. The moderate stacking fault energy of Cu allows for the development of a substantial twin fraction for certain growth conditions. This paper discusses in-situ observation of grain growth in Cu films and lines under various processing conditions. It is shown that for thicker films and for structures constrained within damascene trenches the energetics of twin boundary formation play a large role in texture development of these structures.

Observation of Grain Growth in Cu Films by In-Situ EBSD Analysis

2003 ◽  
Vol 766 ◽  
Author(s):  
D.P. Field ◽  
M.M. Nowell ◽  
O.V. Kononenko
Keyword(s):  
Grain Size ◽  
Grain Growth ◽  
Crystallographic Texture ◽  
Texture Evolution ◽  
Tantalum Nitride ◽  
Cu Films ◽  
Orientation Imaging ◽  
Film Characteristics ◽  
Beam Deposition

AbstractRecrystallization, grain growth and crystallographic texture evolution in Cu films is an area of importance for IC interconnect fabrication as the film characteristics influence the resulting line microstructure. This study examines Cu films deposited by partially ionized beam deposition onto a sublayer of tantalum nitride and additionally onto alpha- C:H. The films were annealed in-situ in the SEM chamber and intermittent orientation imaging was used to characterize the grain growth and crystallographic texture evolution in the films. Both initial and final textures are weak in each of the films analyzed, but are a function of sublayer material and thickness. Grain size in the Cu films is significantly smaller for the tantalum nitride sublayer than for the á-C:H sublayer.

Substrates with Programmable Heater Arrays for In-Situ Observation of Microstructural Evolution of Polycrystalline Films: Towards Real Time Control of Grain Growth

MRS Advances ◽  
2016 ◽  
Vol 1 (26) ◽  
pp. 1947-1952 ◽  
Author(s):  
Prabhu Balasubramanian ◽  
Chengjian Zheng ◽  
Yixuan Tan ◽  
Genevieve Kane ◽  
Antoinette Maniatty ◽  
...  
Keyword(s):  
Grain Growth ◽  
Microstructural Evolution ◽  
Control Strategies ◽  
Experimental Simulation ◽  
In Situ Observation ◽  
Temperature Profiles ◽  
Theory Approach ◽  
Polycrystalline Films ◽  
Real Time Control

ABSTRACTAn integrated experimental – simulation – control theory approach designed to enable adaptive control of microstructural evolution in polycrystalline metals is described. A micro-heater array, containing ten addressable channels, is used to create desired temperature profiles across thin polycrystalline films in situ to a scanning electron microscope (SEM). The goal is that on heating with controlled temperature profiles, the evolution of grain growth within the film can be continuously monitored and compared to Monte Carlo simulations of trajectories towards a desired microstructure. Feed-forward and feedback control strategies are then used to guide the microstructure along the desired trajectory.

In Situ Observation of Texture Evolution in Ti-10-2-3

2008 ◽  
pp. 65-72
Author(s):  
Seema L. Raghunathan ◽  
Richard Dashwood ◽  
Martin Jackson ◽  
Sven Vogel ◽  
David Dye
Keyword(s):  
Texture Evolution ◽  
In Situ Observation

In-Situ Tem Investigation During Thermal Cycling of thin Copper Films

1996 ◽  
Vol 436 ◽  
Author(s):  
R.-M. Keller ◽  
W. Sigle ◽  
S. P. Baker ◽  
O. Kraft ◽  
E. Arzt
Keyword(s):  
Grain Growth ◽  
Room Temperature ◽  
Dislocation Motion ◽  
In Situ Tem ◽  
Copper Films ◽  
Stress Evolution ◽  
Cu Films ◽  
Transmission Electron ◽  
Insight Into

AbstractIn-situ transmission electron microscopy (TEM) was performed to study grain growth and dislocation motion during temperature cycles of Cu films with and without a cap layer. In addition, the substrate curvature method was employed to determine the corresponding stresstemperature curves from room temperature up to 600°C. The results of the in-situ TEM investigations provide insight into the microstructural evolution which occurs during the stress measurements. Grain growth occurred continuously throughout the first heating cycle in both cases. The evolution of dislocation structure observed in TEM supports an explanation of the stress evolution in both capped and uncapped films in terms of dislocation effects.

Structure Evolution in Plated Cu Films

2005 ◽  
Vol 863 ◽  
Author(s):  
D.P. Field ◽  
NJ Park ◽  
PR Besser ◽  
JE Sanchez
Keyword(s):  
Film Thickness ◽  
Grain Growth ◽  
Texture Evolution ◽  
Structural Evolution ◽  
Similar Process ◽  
Structure Evolution ◽  
Line Geometry ◽  
Strong Function ◽  
Cu Films ◽  
Line Widths

AbstractStructure evolution in plated Cu films is a function of sublayer stacking, film thickness, plating chemistry, plating parameters, and temperature. The present work examines grain growth and texture evolution in annealed plated Cu on a 25 nm thick Ta sublayer for films of 480 and 750 nm in thickness. These results are compared against those obtained from damascene Cu lines fabricated from a similar process, using a series of line widths. The results show that the initial structures of the plated films are similar, with slightly weaker (111) texture, a higher fraction of twin boundaries, and larger grains in the thicker films. The microstructure of the Cu within the trench constraints is a strong function of line geometry with the propensity for twin boundary development controlling structural evolution.

In situ observation of twin-assisted grain growth in nanometer-scaled metal

Micron ◽  
2020 ◽  
Vol 131 ◽  
pp. 102825
Author(s):  
Suyun He ◽  
Chunyang Wang ◽  
Lu Qi ◽  
Hengqiang Ye ◽  
Kui Du
Keyword(s):  
Grain Growth ◽  
In Situ Observation

In Situ Observation of Grain Growth and Recrystallization of Steel at High Temperature

2010 ◽  
Vol 638-642 ◽  
pp. 1077-1082 ◽  
Author(s):  
Yasuhiro Yogo ◽  
Kouji Tanaka ◽  
Koukichi Nakanishi
Keyword(s):  
Grain Size ◽  
High Temperature ◽  
Grain Growth ◽  
In Situ Observation ◽  
Initial Structure ◽  
Grain Sizes ◽  
Dynamic Observation ◽  
Average Grain Size ◽  
Observation Method

An in-situ observation method for structures at high temperature is developed. The new observation device can reveal grain boundaries at high temperature and enables dynamic observation of these boundaries. Grain growth while maintaining microstructure at high temperature is observed by the new observation device with only one specimen for the entire observation, and grain sizes are quantified. The quantifying process reveals two advantages particular to the use of the new observation device: (1) the ability to quantify grain sizes of specified sizes and (2) the results of average grain size for many grains have significantly less errors because the initial structure is the same for the entire observation and the quantifying process. The new observation device has the function to deform a specimen while observing structures at high temperature, so that enables it to observe dynamic recrystallization of steel. The possibility to observe recrystallization is also shown.

In-situ observation of abnormal grain growth in a low-alloyed carbon steel using SEM-EBSD

Materialia ◽  
2021 ◽  
Vol 15 ◽  
pp. 100985
Author(s):  
Genki Saito ◽  
Tianglong Zhang ◽  
Norihito Sakaguchi ◽  
Munekazu Ohno ◽  
Kiyotaka Matsuura ◽  
...  
Keyword(s):  
Carbon Steel ◽  
Grain Growth ◽  
Abnormal Grain Growth ◽  
In Situ Observation
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