Thermocapillary Patterning of Nanoscale Polymer Films

2009 ◽  
Vol 1179 ◽  
Author(s):  
Mathias Dietzel ◽  
Sandra M Troian
Keyword(s):  
Surface Tension ◽  
Finite Element ◽  
Room Temperature ◽  
Proximity Effects ◽  
Rapidly Solidify ◽  
Process Step ◽  
Spatial Gradients ◽  
Adjacent Structures ◽  
Single Process ◽  
Single Process Step

AbstractWe investigate a method for non-contact patterning of molten polymer nanofilms based on thermocapillary modulation. Imposed thermal distributions along the surface of the film generate spatial gradients in surface tension. The resulting interfacial stresses are used to shape and mold nanofilms into 3D structures, which rapidly solidify when cooled to room temperature. Finite element simulations of the evolution of molten shapes illustrate how this technique can be used to fabricate features of different heights and separation distances in a single process step. These results provide useful guidelines for controlling proximity effects during evolution of adjacent structures.

Application of Tem on Sub-Half Micron Semiconductor Devices

1998 ◽  
Vol 523 ◽  
Author(s):  
Hong Zhang
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Failure Analysis ◽  
Process Evaluation ◽  
Semiconductor Devices ◽  
Single Source ◽  
Process Step ◽  
Transmission Electron ◽  
Single Process ◽  
Single Process Step

AbstractApplication of transmission electron microscopy on sub-half micron devices has been illustrated in terms of process evaluation and failure analysis. For process evaluation, it is emphasized that a large number of features need to be examined in order to have reliable conclusions about the processes, while for failure analysis, the goal is to pin-point a single process step causing failure or a single source introducing the particle defect.

Morphological evolution of nanometer-sized BaTiO3 particles

1996 ◽  
Vol 54 ◽  
pp. 676-677
Author(s):  
C. M. Chun ◽  
A. Navrotsky ◽  
I. A. Aksay
Keyword(s):  
Heat Treatment ◽  
Colloidal Stability ◽  
Morphological Evolution ◽  
Titanium Isopropoxide ◽  
Precipitate Size ◽  
Hydrothermal Conditions ◽  
Process Step ◽  
Polyhedral Particles ◽  
Single Process ◽  
Single Process Step

Highly pure, stoichiometric, nanometer-sized, and fairly monodispersed anhydrous crystalline BaTiO3 particles are synthesized under hydrothermal conditions in a single process step without further heat treatment by reacting titanium isopropoxide [Ti(OC3H7)4] precursor in aqueous solutions of Ba(OH)2 at 80°C. Traditional considerations of solution hydrolysis, solute condensation, and nucleation only partly explain the generation of the “raspberry-like” BaTiO3 particles composed of 5∼10 nm primary crystalline particles. Consequently, the colloidal interaction of the precipitating particles and, therefore, controlled aggregation of freshly nucleated particles must be taken into account. Our TEM studies show aggregation growth of small subunits to form uniform, rounded polyhedral particles, suggesting colloidal stability may play a key role in controlling precipitate size and shape.In order to investigate the evidence supporting the aggregation growth, Ti(OC3H7)4 precursor (Aldrich) has been added to l.OM Ba(OH)2 solution and hydrothermally reacted at 80°C in polyethylene bottles. Four molecules of water and two hydroxyl ions attach through their oxygen atoms to the titanium of Ti(OC3H7)4 in a nucleophilic process.

Advanced Anodic Bonding Processes For MEMS Applications

2003 ◽  
Vol 782 ◽  
Author(s):  
V. Dragoi ◽  
P. Lindner ◽  
T. Glinsner ◽  
M. Wimplinger ◽  
S. Farrens
Keyword(s):  
Three Dimensional ◽  
Anodic Bonding ◽  
Process Conditions ◽  
Wafer Level ◽  
Process Step ◽  
Packaging Process ◽  
Powerful Technique ◽  
Wafer Level Packaging ◽  
Single Process ◽  
Single Process Step

ABSTRACTAnodic bonding is a powerful technique used in MEMS manufacturing. This process is applied mainly for building three-dimensional structures for microfluidic applications or for wafer level packaging. Process conditions will be evaluated in present paper. An experimental solution for bonding three wafers in one single process step (“triple-stack bonding”) will be introduced.

Investigation of Material Combinations Processed via Two-Component Metal Injection Moulding (2C-MIM)

2012 ◽  
Vol 727-728 ◽  
pp. 248-253 ◽  
Author(s):  
Gabriel Benedet Dutra ◽  
Marco Mulser ◽  
Roger Calixto ◽  
Frank Petzoldt
Keyword(s):  
Optical Microscopy ◽  
Injection Moulding ◽  
Interface Layer ◽  
Chemical Compositions ◽  
Interface Quality ◽  
Process Step ◽  
Metal Injection Moulding ◽  
Two Component ◽  
Single Process ◽  
Single Process Step

Joining materials with different properties into a single component is an attractive solution that allows producing parts with unique properties. In this respect, Two-Component Metal Injection Moulding (2C-MIM) presents numerous advantages, since the moulding and joining stage are performed in a single process step. In this work, the challenges, which occur when different materials are combined, are elucidated. Furthermore, the contact between metals with unequal chemical compositions leads to atomic interdiffusion that forms an interface layer. The interface quality is crucial to the production of intact parts after processing. Different material combinations are co-sintered and the interfaces are characterized by means of optical microscopy and EDX/SEM line scans. Further, thermodynamic and kinetic simulations are used to examine the interdiffusion in detail. The results show promising possibilities to combine different materials and helpful methods to examine the interface.

Electrocapillary Curves for the Hg/Ionic Liquid Interface

2009 ◽  
Vol 64 (3-4) ◽  
pp. 263-268 ◽  
Author(s):  
Andrzej Lewandowski ◽  
Tomasz Majkowski ◽  
Maciej Galinski
Keyword(s):  
Surface Tension ◽  
Ionic Liquid ◽  
Electrode Potential ◽  
Room Temperature ◽  
Narrow Range ◽  
Room Temperature Ionic Liquids ◽  
Second Derivative ◽  
Drop Volume ◽  
Potential Of Zero Charge ◽  
Weight Drop

Abstract Electrocapillary curves (surface tension γ as a function of the electrode potential E) for a series of room-temperature ionic liquids (RTILs) were measured using a mercury dropping electrode with the drop-weight (drop-volume) technique. The curves γ = f (E) for the Hg/RTIL interface have one maximum and may be approximated with a polynomial of sixth-order. There are no ‘humps’ in the curves. The interfacial tension of the Hg/RTIL system changes with potential E in a monotonic way. The second derivative of γ = f (E) leads to a polynomial of fourth order, indicating the capacitance of the Hg/RTIL interface. The potential of zero charge is within a relatively narrow range. The specific capacitance at the minimum is of the order 10 μF/cm2

The phase transition in superconductors - I. Nucleation

1952 ◽  
Vol 214 (1118) ◽  
pp. 392-412 ◽  
Keyword(s):  
Surface Tension ◽  
Room Temperature ◽  
Lattice Distortion ◽  
Impurity Content ◽  
Superconducting Phase ◽  
Interphase Surface ◽  
Local Lattice Distortion ◽  
Surface Conditions ◽  
Local Lattice ◽  
Crystal Boundaries

A detailed study of ‘supercooling' in tin rods has confirmed the hypothesis that this is caused by the difficulty of forming a nucleus of the superconducting phase. The experiments show that when nucleation does occur it only happens at certain flaws in the metal, which have been proved to lie at the surface and to be between 10 -4 and 10 -3 cm in size. These flaws do not appear to be necessarily associated with surface conditions, impurity content, or crystal boundaries. Any handling of the specimen affects them, but simply warming it to room temperature often does not, in which case the supercooling observed in separate experiments is reproducible. The degree of supercooling ϕ l defined as ( H 2 c - H 2 l )/ H 2 c , where H l is the field at which nucleation is first possible, varies in magnitude from flaw to flaw (0⋅8 is the largest value found), but it always depends on temperature in the same way, rising as T → T c , The supercooling can sometimes be increased by applying a high field to the specimen beforehand, indicating that some of the flaws can be temporarily destroyed by such treatment. The behaviour of the flaws can be accounted for if they are assumed to be domains where the interphase surface tension has become negative, perhaps as the result of local lattice distortion produced by dislocations. Using a simple model based on this picture the magnitude and temperature dependence of ϕ l have been explained quantitatively in terms of the characteristic flaw size and the positive surface tension in the undistorted metal (as estimated from work on the intermediate state). Slight superheating (up to 1⋅5% of H c ) has also been observed.

scholarly journals Influence of Magnetic Field on Evaporation Rate and Surface Tension of Water

2018 ◽  
Vol 2 (4) ◽  
pp. 68 ◽  
Author(s):  
Emil Chibowski ◽  
Aleksandra Szcześ ◽  
Lucyna Hołysz
Keyword(s):  
Magnetic Field ◽  
Surface Tension ◽  
Hydrogen Bonds ◽  
Room Temperature ◽  
Evaporation Rate ◽  
Water Evaporation ◽  
Water Molecules ◽  
Surface Tension Data ◽  
Ring Magnet ◽  
The Magnetic Field

Using neodymium ring magnets (0.5–0.65 T), the experiments on the magnetic field (MF) effects on water evaporation rate and surface tension were performed at room temperature (22–24 °C). In accordance with the literature data, the enhanced evaporation rates were observed in the experiments conducted in a period of several days or weeks. However, the evaporated amounts of water (up to 440 mg over 150 min) in particular experiments differed. The evaporated amounts depended partially on which pole of the ring magnet was directed up. The relatively strong MF (0.65 T) caused a slight decrease in surface tension (−2.11 mN/m) which lasted longer than 60 min and the memory effect vanished slowly. The surface tension data reduced by the MF action are reported in the literature, although contrary results can be also found. The observed effects can be explained based on literature data of molecular simulations and the suggestion that MF affects the hydrogen bonds of intra- and inter-clusters of water molecules, possibly even causing breakage some of them. The Lorentz force influence is also considered. These mechanisms are discussed in the paper.

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