Complex nanostructures in PMMA made by a single process step using e-beam lithography

2010 ◽  
Vol 87 (5-8) ◽  
pp. 1139-1142 ◽  
Author(s):  
S. Gautsch ◽  
M. Studer ◽  
N.F. de Rooij
Keyword(s):  
Process Step ◽  
Single Process ◽  
Single Process Step ◽  
Complex Nanostructures

Application of Tem on Sub-Half Micron Semiconductor Devices

1998 ◽  
Vol 523 ◽  
Author(s):  
Hong Zhang
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Failure Analysis ◽  
Process Evaluation ◽  
Semiconductor Devices ◽  
Single Source ◽  
Process Step ◽  
Transmission Electron ◽  
Single Process ◽  
Single Process Step

AbstractApplication of transmission electron microscopy on sub-half micron devices has been illustrated in terms of process evaluation and failure analysis. For process evaluation, it is emphasized that a large number of features need to be examined in order to have reliable conclusions about the processes, while for failure analysis, the goal is to pin-point a single process step causing failure or a single source introducing the particle defect.

Morphological evolution of nanometer-sized BaTiO3 particles

1996 ◽  
Vol 54 ◽  
pp. 676-677
Author(s):  
C. M. Chun ◽  
A. Navrotsky ◽  
I. A. Aksay
Keyword(s):  
Heat Treatment ◽  
Colloidal Stability ◽  
Morphological Evolution ◽  
Titanium Isopropoxide ◽  
Precipitate Size ◽  
Hydrothermal Conditions ◽  
Process Step ◽  
Polyhedral Particles ◽  
Single Process ◽  
Single Process Step

Highly pure, stoichiometric, nanometer-sized, and fairly monodispersed anhydrous crystalline BaTiO3 particles are synthesized under hydrothermal conditions in a single process step without further heat treatment by reacting titanium isopropoxide [Ti(OC3H7)4] precursor in aqueous solutions of Ba(OH)2 at 80°C. Traditional considerations of solution hydrolysis, solute condensation, and nucleation only partly explain the generation of the “raspberry-like” BaTiO3 particles composed of 5∼10 nm primary crystalline particles. Consequently, the colloidal interaction of the precipitating particles and, therefore, controlled aggregation of freshly nucleated particles must be taken into account. Our TEM studies show aggregation growth of small subunits to form uniform, rounded polyhedral particles, suggesting colloidal stability may play a key role in controlling precipitate size and shape.In order to investigate the evidence supporting the aggregation growth, Ti(OC3H7)4 precursor (Aldrich) has been added to l.OM Ba(OH)2 solution and hydrothermally reacted at 80°C in polyethylene bottles. Four molecules of water and two hydroxyl ions attach through their oxygen atoms to the titanium of Ti(OC3H7)4 in a nucleophilic process.

Advanced Anodic Bonding Processes For MEMS Applications

2003 ◽  
Vol 782 ◽  
Author(s):  
V. Dragoi ◽  
P. Lindner ◽  
T. Glinsner ◽  
M. Wimplinger ◽  
S. Farrens
Keyword(s):  
Three Dimensional ◽  
Anodic Bonding ◽  
Process Conditions ◽  
Wafer Level ◽  
Process Step ◽  
Packaging Process ◽  
Powerful Technique ◽  
Wafer Level Packaging ◽  
Single Process ◽  
Single Process Step

ABSTRACTAnodic bonding is a powerful technique used in MEMS manufacturing. This process is applied mainly for building three-dimensional structures for microfluidic applications or for wafer level packaging. Process conditions will be evaluated in present paper. An experimental solution for bonding three wafers in one single process step (“triple-stack bonding”) will be introduced.

Investigation of Material Combinations Processed via Two-Component Metal Injection Moulding (2C-MIM)

2012 ◽  
Vol 727-728 ◽  
pp. 248-253 ◽  
Author(s):  
Gabriel Benedet Dutra ◽  
Marco Mulser ◽  
Roger Calixto ◽  
Frank Petzoldt
Keyword(s):  
Optical Microscopy ◽  
Injection Moulding ◽  
Interface Layer ◽  
Chemical Compositions ◽  
Interface Quality ◽  
Process Step ◽  
Metal Injection Moulding ◽  
Two Component ◽  
Single Process ◽  
Single Process Step

Joining materials with different properties into a single component is an attractive solution that allows producing parts with unique properties. In this respect, Two-Component Metal Injection Moulding (2C-MIM) presents numerous advantages, since the moulding and joining stage are performed in a single process step. In this work, the challenges, which occur when different materials are combined, are elucidated. Furthermore, the contact between metals with unequal chemical compositions leads to atomic interdiffusion that forms an interface layer. The interface quality is crucial to the production of intact parts after processing. Different material combinations are co-sintered and the interfaces are characterized by means of optical microscopy and EDX/SEM line scans. Further, thermodynamic and kinetic simulations are used to examine the interdiffusion in detail. The results show promising possibilities to combine different materials and helpful methods to examine the interface.

Thermocapillary Patterning of Nanoscale Polymer Films

2009 ◽  
Vol 1179 ◽  
Author(s):  
Mathias Dietzel ◽  
Sandra M Troian
Keyword(s):  
Surface Tension ◽  
Finite Element ◽  
Room Temperature ◽  
Proximity Effects ◽  
Rapidly Solidify ◽  
Process Step ◽  
Spatial Gradients ◽  
Adjacent Structures ◽  
Single Process ◽  
Single Process Step

AbstractWe investigate a method for non-contact patterning of molten polymer nanofilms based on thermocapillary modulation. Imposed thermal distributions along the surface of the film generate spatial gradients in surface tension. The resulting interfacial stresses are used to shape and mold nanofilms into 3D structures, which rapidly solidify when cooled to room temperature. Finite element simulations of the evolution of molten shapes illustrate how this technique can be used to fabricate features of different heights and separation distances in a single process step. These results provide useful guidelines for controlling proximity effects during evolution of adjacent structures.

scholarly journals Development of Combined Manufacturing Technologies for High-Strength Structural Components

2010 ◽  
Vol 137 ◽  
pp. 219-246 ◽  
Author(s):  
Berend Denkena ◽  
Bernd Breidenstein ◽  
Luis de Leon ◽  
Jan Dege
Keyword(s):  
Material Properties ◽  
High Strength ◽  
Tool Geometry ◽  
Structural Components ◽  
Deep Rolling ◽  
Process Step ◽  
Single Process ◽  
Local Modification ◽  
Manufacturing Technologies ◽  
Finishing Processes

Novel manufacturing technologies for high-strength structural components of aluminium allow a local modification of material properties to respond to operational demands. Machining and finishing processes for changing material properties like deep rolling or rubbing are to be combined to a single process step. The intention is the controlled adjustment of the component’s properties by the modification of its subsurface. For that purpose the essential understanding of the interaction mechanisms of the basic processes turning, deep rolling and rubbing is necessary. Influences of the tool geometry as well as of the process parameters on the material properties are investigated. The results will be extended by parameter studies within numerical simulations. Thereafter, combinations of the basic processes in process sequences are analyzed to their ability to modify the subsurface properties. In consideration of these results, a prototypic combined turn-rolling tool is developed

Lignocellulosic biorefinery: process integration of hydrolysis and fermentation (SSF process)

Holzforschung ◽  
2011 ◽  
Vol 65 (5) ◽  
Author(s):  
Sebastian Poth ◽  
Magaly Monzon ◽  
Nils Tippkötter ◽  
Roland Ulber
Keyword(s):  
Process Integration ◽  
Beech Wood ◽  
Pachysolen Tannophilus ◽  
Process Step ◽  
Fiber Fraction ◽  
Single Process ◽  
Pre Treatment ◽  
Ssf Process ◽  
Hydrolysis Of ◽  
Simultaneous Saccharification

Abstract The aim of the present work is the process integration and the optimization of the enzymatic hydrolysis of wood and the following fermentation of the products to ethanol. The substrate is a fiber fraction obtained by organosolv pre-treatment of beech wood. For the ethanol production, a co-fermentation by two different yeasts (Saccharomyces cerevisiae and Pachysolen tannophilus) was carried out to convert glucose as well as xylose. Two approaches has been followed: 1. A two step process, in which the hydrolysis of the fiber fraction and the fermentation to product are separated from each other. 2. A process, in which the hydrolysis and the fermentation are carried out in one single process step as simultaneous saccharification and fermentation (SSF). Following the first approach, a yield of about 0.15 g ethanol per gram substrate can be reached. Based on the SSF, one process step can be saved, and additionally, the gained yield can be raised up to 0.3 g ethanol per gram substrate.

scholarly journals Characterization of Hermetically Sealed Metallic Feedthroughs through Injection-Molded Epoxy-Molding Compounds

2021 ◽  
Vol 2 (4) ◽  
pp. 976-995
Author(s):  
Mehmet Haybat ◽  
Thomas Guenther ◽  
Romit Kulkarni ◽  
Serhat Sahakalkan ◽  
Tobias Grözinger ◽  
...  
Keyword(s):  
Injection Molding ◽  
Electronic Devices ◽  
Injection Molding Process ◽  
Molding Process ◽  
Process Step ◽  
Molding Compounds ◽  
Single Process ◽  
Injection Molded ◽  
Molding Tool

Electronic devices and their associated sensors are exposed to increasing mechanical, thermal and chemical stress in modern applications. In many areas of application, the electronics are completely encapsulated with thermosets in a single process step using injection molding technology, especially with epoxy molding compounds (EMC). The implementation of the connection of complete systems for electrical access through a thermoset encapsulation is of particular importance. In practice, metal pin contacts are used for this purpose, which are encapsulated together with the complete system in a single injection molding process step. However, this procedure contains challenges because the interface between the metallic pins and the plastic represents a weak point for reliability. In order to investigate the reliability of the interface, in this study, metallic pin contacts made of copper-nickel-tin alloy (CuNiSn) and bronze (CuSn6) are encapsulated with standard EMC materials. The metal surfaces made of CuNiSn are further coated with silver (Ag) and tin (Sn). An injection molding tool to produce test specimens is designed and manufactured according to the design rules of EMC processing. The reliability of the metal-plastic interfaces are investigated by means of shear and leak tests. The results of the investigations show that the reliability of the metal-plastic joints can be increased by using different material combinations.

Queue Time Sensitivity Analysis Methodology

2013 ◽  
Vol 205-206 ◽  
pp. 376-379
Author(s):  
Alex Freilikhman ◽  
Rotem Drori ◽  
Yakov Shor
Keyword(s):  
Sensitivity Analysis ◽  
Significant Elevation ◽  
Process Step ◽  
Factors Affecting ◽  
Analysis Methodology ◽  
Time Sensitivity ◽  
Single Process ◽  
Calculation Results ◽  
The Impact

Queue time (QT) between consecutive process-steps is one of the factors affecting the quality of current products in semiconductors industry. Identification of process steps with queue time sensitivity is not an easy and quick analysis, and it requires a high number of lots. An effective tool for a quick identification of sensitivity of a specific operation to a queue time was developed at Micron Israel and it is applied on production material. The algorithm calculates the average absolute delta of responses between consecutive step QTs, where a minimal value is accepted in steps with a linear correlation between the QT and the response. This calculation results in a snap-shot of the impact of QT for specific responses, or failures modes, for the entire production line, where the step with minimal value of this parameter is easily detected. This algorithm was used on production material and indeed helped to detect a new QT dependency in specific process steps. The Queue Time Sensitivity Analysis (QTSA) algorithm is a novel methodology to detect correlation of QT in a single process step to a certain electrical EOL failure. It can be easily implemented in a fabrication site by the IT team. QTSA methodology is very efficient in detecting QT related issues and it can be used both in routine mode on baseline material and during significant elevation in EOL or in-line failures.

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