Investigation of Material Combinations Processed via Two-Component Metal Injection Moulding (2C-MIM)

Joining materials with different properties into a single component is an attractive solution that allows producing parts with unique properties. In this respect, Two-Component Metal Injection Moulding (2C-MIM) presents numerous advantages, since the moulding and joining stage are performed in a single process step. In this work, the challenges, which occur when different materials are combined, are elucidated. Furthermore, the contact between metals with unequal chemical compositions leads to atomic interdiffusion that forms an interface layer. The interface quality is crucial to the production of intact parts after processing. Different material combinations are co-sintered and the interfaces are characterized by means of optical microscopy and EDX/SEM line scans. Further, thermodynamic and kinetic simulations are used to examine the interdiffusion in detail. The results show promising possibilities to combine different materials and helpful methods to examine the interface.

Thermocapillary Patterning of Nanoscale Polymer Films

We investigate a method for non-contact patterning of molten polymer nanofilms based on thermocapillary modulation. Imposed thermal distributions along the surface of the film generate spatial gradients in surface tension. The resulting interfacial stresses are used to shape and mold nanofilms into 3D structures, which rapidly solidify when cooled to room temperature. Finite element simulations of the evolution of molten shapes illustrate how this technique can be used to fabricate features of different heights and separation distances in a single process step. These results provide useful guidelines for controlling proximity effects during evolution of adjacent structures.

Advanced Anodic Bonding Processes For MEMS Applications

ABSTRACTAnodic bonding is a powerful technique used in MEMS manufacturing. This process is applied mainly for building three-dimensional structures for microfluidic applications or for wafer level packaging. Process conditions will be evaluated in present paper. An experimental solution for bonding three wafers in one single process step (“triple-stack bonding”) will be introduced.

Application of Tem on Sub-Half Micron Semiconductor Devices

Application of transmission electron microscopy on sub-half micron devices has been illustrated in terms of process evaluation and failure analysis. For process evaluation, it is emphasized that a large number of features need to be examined in order to have reliable conclusions about the processes, while for failure analysis, the goal is to pin-point a single process step causing failure or a single source introducing the particle defect.

Morphological evolution of nanometer-sized BaTiO3 particles

Highly pure, stoichiometric, nanometer-sized, and fairly monodispersed anhydrous crystalline BaTiO3 particles are synthesized under hydrothermal conditions in a single process step without further heat treatment by reacting titanium isopropoxide [Ti(OC3H7)4] precursor in aqueous solutions of Ba(OH)2 at 80°C. Traditional considerations of solution hydrolysis, solute condensation, and nucleation only partly explain the generation of the “raspberry-like” BaTiO3 particles composed of 5∼10 nm primary crystalline particles. Consequently, the colloidal interaction of the precipitating particles and, therefore, controlled aggregation of freshly nucleated particles must be taken into account. Our TEM studies show aggregation growth of small subunits to form uniform, rounded polyhedral particles, suggesting colloidal stability may play a key role in controlling precipitate size and shape.In order to investigate the evidence supporting the aggregation growth, Ti(OC3H7)4 precursor (Aldrich) has been added to l.OM Ba(OH)2 solution and hydrothermally reacted at 80°C in polyethylene bottles. Four molecules of water and two hydroxyl ions attach through their oxygen atoms to the titanium of Ti(OC3H7)4 in a nucleophilic process.