Vapor grown carbon fiber reinforced aluminum composites with very high thermal conductivity

1995 ◽  
Vol 10 (2) ◽  
pp. 247-250 ◽  
Author(s):  
Jyh-Ming Ting ◽  
Max L. Lake
Keyword(s):  
Thermal Conductivity ◽  
Carbon Fiber ◽  
Thermal Management ◽  
Room Temperature ◽  
Electronic Devices ◽  
High Thermal Conductivity ◽  
Aluminum Metal ◽  
Aluminum Metal Matrix Composite ◽  
New Material ◽  
Very High

The first use of continuous vapor grown carbon fiber (VGCF) as reinforcement in aluminum metal matrix composite (Al MMC) is reported. Al MMC represents a new material for thermal management in high-power, high-density electronic devices. Due to the ultrahigh thermal conductivity of VGCF, 1950 W/m-K at room temperature, VGCF-reinforced Al MMC exhibits excellent thermal conductivity that cannot be achieved by using any other carbon fiber as reinforcement. An unprecedented high thermal conductivity of 642 W/m-K for Al MMC was obtained by using 36.5% of VGCF.

Passive Thermal Management of Excess Heat from Electronic Devices

1989 ◽  
Vol 154 ◽  
Author(s):  
John J. Glatz ◽  
Juan F. Leon
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Heat Exchanger ◽  
Thermal Management ◽  
Electronic Devices ◽  
High Thermal Conductivity ◽  
Enabling Technology ◽  
Electronic Components ◽  
Potential Applications ◽  
General Scope

AbstractThermal management in the packaging of electronic components is fast becoming an enabling technology in the development of reliable electronics for a range of applications. The objective of the paper is to assess the feasibility of using advance high thermal conductivity pitch fiber (HTCPF) as a solution to some of the packaging problems. The general scope will include the following: identification of the candidate material and its potential applications; thermal management of the chip to board interface; thermal management of the heat within the multi-layer interconnect board (MIB); thermal management of the standard electronic module-format E (SEME); and heat transfer thru the enclosure to a remote heatsink/heat exchanger.

Thermal Conductivity Measurement of Individual Polythiophene Nanofibers With Suspended Micro-Resistance Thermometer Devices

2012 ◽  
Author(s):  
Sally A. McMenamin ◽  
Annie Weathers ◽  
Virendra Singh ◽  
Michael T. Pettes ◽  
Baratunde A. Cola ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Room Temperature ◽  
Defect Density ◽  
Conductivity Measurement ◽  
Polymer Chains ◽  
High Thermal Conductivity ◽  
Resistance Thermometer ◽  
Aligned Nanofibers ◽  
Measured Thermal Conductivity

High thermal conductivity, comparable to that of a metal, has been observed in some stretched polyethylene nanofibers due to a decrease in defect density with the alignment of the polymer chains. Such high thermal conductivity may be useful for thermal management applications such as thermal adhesives made of aligned nanofibers. Polythiophene (Pth) is a conducting polymer that can be synthesized electrochemically as aligned nanofiber forests without the need for stretching individual fibers. Here we report the thermal conductivity of individual suspended Pth nanofibers synthesized electrochemically and measured with the use of a microfabricated device in the temperature range of 80 K to 375 K. The measured thermal conductivity increases with temperature. For three single suspended Pth nanofibers with a diameter on the order of 200 nm, the room temperature value between 0.6 and 0.8 W/m K is about four-fold higher than that reported for Pth thin films and comparable to that reported for binder-filler thermal adhesives.

Thermally Conductive Plastics for Enhanced Thermal Management

2015 ◽  
Vol 2015 (1) ◽  
pp. 000530-000535
Author(s):  
Chandrashekar Raman
Keyword(s):  
Thermal Conductivity ◽  
Natural Convection ◽  
Thermal Management ◽  
Electronic Devices ◽  
Heat Sinks ◽  
Significant Challenge ◽  
Design Engineers ◽  
Thermally Conductive ◽  
New Material ◽  
Conductive Plastics

Electronic devices continue to shrink while continuing to offer increasing functionality. This trend poses a significant challenge to design engineers who need to adequately address the increasing thermal management requirements of these devices on a shrinking footprint. Thermally conductive plastics have been gaining attention as an innovative new material option to address this challenge. While plastics are typically poor conductors of heat, it is possible to increase the thermal conductivity with the use of certain additives. Unique ceramic additives like boron nitride offer the added advantage of enabling thermally conductive plastic formulations that are also electrically insulating. The replacement of aluminum heat sinks in free (natural) convection environments with thermally conductive plastics is discussed in this paper. The results show it may indeed be possible to replace aluminum with thermally conductive plastic heat sinks in convection limited environments, and if judicious redesign of the plastic heat sink is incorporated, an improved thermal management solution can be realized. Additionally, the benefits of enhancing existing plastic housings to enable an improved thermal management solution are discussed. The results also show that modest enhancements to the thermal conductivity of existing plastic housings can yield significant improvements to the overall thermal management solution as well.

Composites based on thermally hyper-conductive vapor grown carbon fiber

1995 ◽  
Vol 10 (6) ◽  
pp. 1478-1484 ◽  
Author(s):  
Jyh-Ming Ting ◽  
Max L. Lake ◽  
David R. Duffy
Keyword(s):  
Thermal Conductivity ◽  
Carbon Fiber ◽  
Thermal Management ◽  
Carbon Fibers ◽  
Electronic Devices ◽  
Aluminum Matrix ◽  
Aluminum Matrix Composites ◽  
Carbon Composites ◽  
Matrix Composites ◽  
A Value

Aluminum matrix composites and carbon/carbon composites based on vapor grown carbon fiber (VGCF) were fabricated for analysis of thermophysical properties. Due to the highly graphitic nature of VGCF, the resulting composites exhibit values of thermal conductivity that have not been achieved by using any other carbon fibers, and thus represent new materials for thermal management in applications such as packaging for high-power, high-density electronic devices. In the aluminum matrix VGCF composites, a thermal conductivity of 642 W/m-K was obtained by using a VGCF loading of only 36.5 vol.%. For VGCF/C composites, thermal conductivity of 910 W/m-K has been observed, a value which is more than a factor of two higher than that of copper. Based on the observed thermal conductivity of VGCF/Al composites and VGCF/C composites, the room temperature thermal conductivity of VGCF in the composite was calculated to be 1460 W/m-K and 1600 W/m-K, respectively.

High thermal conductivity carbon fiber reinforced polymer based on a carbon fiber from pitch and dispersed-filled ENPB matrix

2018 ◽  
pp. 130-137
Author(s):  
E. A. Nikolaeva ◽  
A. N. Timofeev ◽  
K. V. Mikhaylovskiy
Keyword(s):  
Thermal Conductivity ◽  
Carbon Fiber ◽  
High Thermal Conductivity ◽  
Fiber Reinforced Polymer ◽  
Carbon Fiber Reinforced Polymer ◽  
Carbon Powder ◽  
Fiber Reinforced ◽  
Thermophysical Characteristics ◽  
Reinforced Polymer ◽  
Carbon Fiber Reinforced

This article describes the results of the development of a high thermal conductivity carbon fiber reinforced polymer based on carbon fiber from pitch and an ENPB matrix modified with a carbon powder of high thermal conductivity. Data of the technological scheme of production and the results of determining the physicomechanical and thermophysical characteristics of carbon fiber reinforced polymer are presented. 

Multi-scale modeling of thermal conductivity of SiC-reinforced aluminum metal matrix composite

2017 ◽  
Vol 51 (28) ◽  
pp. 3941-3953 ◽  
Author(s):  
Xiangyang Dong ◽  
Yung C Shin
Keyword(s):  
Thermal Conductivity ◽  
Metal Matrix Composite ◽  
Matrix Composite ◽  
Metal Matrix ◽  
Scale Model ◽  
Electronic Effects ◽  
Multi Scale ◽  
Aluminum Metal ◽  
Aluminum Metal Matrix Composite ◽  
Sic Particle

High thermal conductivity is one important factor in the selection or development of ceramics or composite materials. Predicting the thermal conductivity would be useful to the design and application of such materials. In this paper, a multi-scale model is developed to predict the effective thermal conductivity in SiC particle-reinforced aluminum metal matrix composite. A coupled two-temperature molecular dynamics model is used to calculate the thermal conductivity of the Al/SiC interface. The electronic effects on the interfacial thermal conductivity are studied. A homogenized finite element model with embedded thin interfacial elements is used to predict the properties of bulk materials, considering the microstructure. The effects of temperatures, SiC particle sizes, and volume fractions on the thermal conductivity are also studied. A good agreement is found between prediction results and experimental measurements. The successful prediction of thermal conductivity could help a better understanding and an improvement of thermal transport within composites and ceramics.

scholarly journals High thermal conductivity polymer chains with reactive groups: a step towards true application

2020 ◽  
Vol 1 (6) ◽  
pp. 1996-2002
Author(s):  
Anqi Chen ◽  
Yanyan Wu ◽  
Shaoxin Zhou ◽  
Wenxue Xu ◽  
Wenlong Jiang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Polymer Chains ◽  
High Thermal Conductivity ◽  
Reactive Groups

Nanostructured polyethylene (PE, [–CH2–CH2–]n) films with metal-like thermal conductivity have opened up opportunities for polymers in advanced thermal management.

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