Characterization of Polysilicon Thin Films by Variable Angle Spectroscopic Ellipsometry
Keyword(s):
AbstractVariable angle spectroscopic ellipsometry was used to characterize polysilicon multilayer structures. Five different multilayer wafers, each containing a polysilicon layer, were studied. Layer thicknesses and compositions were determined at several locations across each wafer. The thickness measurements obtained by ellipsometry are compared with those determined from cross-sectional transmission electron microscopy (XTEM).
2001 ◽
Vol 16
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pp. 806-811
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2005 ◽
Vol 23
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pp. 1284-1289
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1992 ◽
Vol 12
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pp. 177-184
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