CH4 :H2 :Ar rf/ECR Plasma Etching of GaAs and InP

1991 ◽  
Vol 223 ◽  
Author(s):  
Victor. J. Law ◽  
S. G. Ingram ◽  
G. A. C. Jones ◽  
R. C. Grimwood ◽  
H. Royal
Keyword(s):  
Plasma Etching ◽  
Gas Flow ◽  
Electron Cyclotron Resonance ◽  
Kinetic Studies ◽  
High Electron Mobility Transistor ◽  
Rf Plasma ◽  
High Electron ◽  
Ecr Plasma ◽  
Etch Rates ◽  
Ecr Plasma Etching

ABSTRACTA comparative study of CH4 :H2 , and CH4 :H2 :Ar rf-plasma and microwave electron cyclotron resonance (ECR) plasma etching of GaAs and InP is presented. The study is in two parts;(i) Kinetic studies of GaAs and InP etch rates as a function of the constituent gas flow rates, applied rf and microwave powers, substrate temperature and position. The results indicate that CH4 :H2 :Ar ECR etching of GaAs is 10× more efficient in the utilisation of the CH4 precursor gas than rf-plasmas. However, the absolute etch rates are lower (70 nm min−1 for rf and 25 nm min−1 for rf biassed ECR-plasmas).The effect of etching conditions on InP morphology is also examined.(ii) The study of electrical “damage” in GaAs/AlGaAs high electron mobility transistor (HEMT) Hall bar structures, was investigated by ECR-plasma etching off the top GaAs capping layer. Results indicate that ECR-plasma etching with an rf-bias between 0V and −30V does not significantly effect the electrical characteristics of such devices at 300K, with some degredation at 1.2 K.

Dry Etching of InGaP and AlInP in CH4/H2/Ar

1996 ◽  
Vol 421 ◽  
Author(s):  
J. W. Lee ◽  
S. J. Pearton ◽  
C. J. Santana ◽  
E. S. Lambers ◽  
C. R. Abernathy ◽  
...  
Keyword(s):  
Plasma Etching ◽  
Cyclotron Resonance ◽  
Electron Cyclotron Resonance ◽  
Low Flow ◽  
Flow Rates ◽  
Ecr Plasma ◽  
Order Of Magnitude ◽  
Etch Stop ◽  
Etch Rates ◽  
Ecr Plasma Etching

AbstractElectron Cyclotron Resonance (ECR) plasma etching with additional if-biasing produces etch rates ≥ 2,500Å/min for InGaP and AlInP in CH4/H2/Ar. These rates are an order of magnitude or much higher than for reactive ion etching conditions (RIE) carried out in the same reactor. N2 addition to CH4/H2/Ar can enhance the InGaP etch rates at low flow rates, while at higher concentrations it provides an etch-stop reaction. The InGaP and AtlnP etched under ECR conditions have somewhat rougher morphologies and different stoichiometries up to ˜200Å from the surface relative to the RIE samples.

Comparison of Microwave ECR and RF Plasmas for Dry Etching of Single Crystal 6H-SiC

1994 ◽  
Vol 339 ◽  
Author(s):  
J. R. Flemish ◽  
K. Xie ◽  
W. Buchwald ◽  
L. Casas ◽  
J. H. Zhao ◽  
...  
Keyword(s):  
Single Crystal ◽  
Plasma Etching ◽  
Electron Cyclotron Resonance ◽  
Schottky Diodes ◽  
Substrate Bias ◽  
Rf Plasmas ◽  
Ecr Plasma ◽  
Current Voltage ◽  
Capacitance Voltage ◽  
Etch Rates

ABSTRACTElectron cyclotron resonance (ECR) plasma etching of single crystal 6H-SiC has been investigated using a CF4/O2 gas mixture and compared to conventional reactive ion etching (RIE) in a radio frequency (13.56 MHz) reactor. The use of ECR results in higher etch rates, lower levels of bias and smoother etched surfaces than rf-RIE. ECR etch rates exceeding 100 nm/min have been obtained at a substrate bias of-100 V. Etch rate and surface morphology have been studied as a function of pressure, bias and power. Auger electron spectroscopy shows that ECR etching leaves no residues unlike rf-RIE which leaves residues containing Al, F, O and C. The current-voltage and capacitance-voltage measurements of Schottky diodes show that there is far less damage induced by ECR etching compared to rf-RIE.

ECR Plasma Etching Technology for ULSIs

1991 ◽  
Vol 223 ◽  
Author(s):  
Seiji Samukawa
Keyword(s):  
Plasma Etching ◽  
High Selectivity ◽  
Electron Cyclotron Resonance ◽  
Etching Rate ◽  
High Rate ◽  
Ion Energy ◽  
Ecr Plasma ◽  
High Etching Rate ◽  
Phosphorus Doped ◽  
Ecr Plasma Etching

ABSTRACTA new electron cyclotron resonance (ECR) plasma etching technology has been developed to realize simultaneously high selectivity, high rate and anisotropic etching for phosphorus doped poly-Si and WSix/poly-Si at a low ion energy. In this technology, a substrate is located around the ECR position (875 gauss position) in an ECR plasma. As a result of ECR position etching, under the low pressure of 5 × 10−4 Torr, a high etching rate and an infinite selectivity to SiO2 etching are realized by using C12/O2 and Cl2/O2/SF6 etching gas.

ECR Plasma Etching with Heavy Halogen Ions

1990 ◽  
Vol 29 (Part 1, No. 10) ◽  
pp. 2223-2228 ◽  
Author(s):  
Nobuo Fujiwara ◽  
Hisaharu Sawai ◽  
Masahiro Yoneda ◽  
Kyusaku Nishioka ◽  
Haruhiko Abe
Keyword(s):  
Plasma Etching ◽  
Ecr Plasma ◽  
Ecr Plasma Etching

Anisotropic ECR Plasma Etching with Low-Energy Ions

1993 ◽  
Vol 140-142 ◽  
pp. 39-54
Author(s):  
Y. Tobinaga ◽  
T. Miyano ◽  
K. Fujimoto ◽  
M. Fujito ◽  
H. Fujiwara
Keyword(s):  
Plasma Etching ◽  
Low Energy ◽  
Ecr Plasma ◽  
Low Energy Ions ◽  
Ecr Plasma Etching

HI/H2 ECR Plasma Etching of III-V Semiconductors

1992 ◽  
Vol 268 ◽  
Author(s):  
S. J. Pearton ◽  
U. K. Chakrabarti ◽  
A. Katz ◽  
F. Ren ◽  
T. R. Fullowan ◽  
...  
Keyword(s):  
Plasma Etching ◽  
Electron Spectroscopy ◽  
Dry Etching ◽  
Hydrogen Passivation ◽  
Near Surface ◽  
Ecr Plasma ◽  
Order Of Magnitude ◽  
Polymer Deposition ◽  
Etch Rates ◽  
Surface Morphologies

ABSTRACTHI/H2/Ar discharges are shown to be universal etchants for rn-V semiconductors, giving rise to highly anisotropic features with smooth surface morphologies. At loy dc self bia:s (-100V) and low pressure (1 mTorr), etch rates for all III-V materials of >2000Å min−1 are possible for high HI percentages in the discharges, whereas rates greater than 1 Åm min−1 are obtained at higher pressures and dc biases. These etch rates are approximately an order of magnitude faster than for CH4/H2/Ar mixtures under the same conditions and there is no polymer deposition on the mask or within the reactor chamber with HI/H2/Ar. Auger Electron Spectroscopy reveals residue-free, stoichiometric surfaces after dry etching in this mixture. As i result, photoluminescence intensities from dry etched samples remain high with little apparent damage introduction. Changes in the near-surface carrier concentration due to hydrogen passivation effects are also negligible with HI-based mixtures in comparison to CH4-based dry etching.

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