A new thin film Growth/Regrowth Process Design and Experimental Comparisons with Molecular Dynamic Analyses

1992 ◽  
Vol 283 ◽  
Author(s):  
Takako K. Okada ◽  
Shigeru Kambayashi ◽  
Moto Yabuki ◽  
Yoshitaka Tsunashima ◽  
Yuichi Mirata ◽  
...  

ABSTRACTA new concept of thin film growth/regrowth process design taking atomic motions into account using molecular dynamics is proposed. In the system, a modified many-body Tersoff-type interatomic potential for silicon has been adopted. The mathematical derivation of higher order derivatives was rigorously treated. Among many applications, the solid phase growth process was studied. It has been found from simulation studies that the solid phase growth of crystalline silicon proceeded along the [110] direction layer by layer. Furthermore, it has been obtained that all the atoms are activated in an extremely thin amorphous silicon film. Based on simulated results, an experiment using an extremely thin amorphous silicon film was carried out. It has been found that the perfect spherical silicon crystals with a uniform size and spacing can be grown from a thin amorphous silicon film.

2015 ◽  
Vol 158 ◽  
pp. 269-273 ◽  
Author(s):  
Shane McMahon ◽  
Ashok Chaudhari ◽  
Zhouying Zhao ◽  
Harry Efstathiadis

1993 ◽  
Vol 321 ◽  
Author(s):  
J. Yi ◽  
R. Wallace ◽  
N. Sridhar ◽  
D. D. L. Chung ◽  
W. A. Anderson

ABSTRACTThin film hydrogenated Amorphous silicon (a-Si:H) was deposited on Molybdenum (Mo) substrates by d.c. glow discharge. We investigated the a-Si:H crystallization using four anneal techniques; nitrogen atmosphere furnace, vacuum, rapid thermal anneal (RTA), and excimer laser anneal. Anneal temperature ranged from 100 to 1200 °C. Excimer laser energy per pulse ranged from 90 to 340 M.J. Transmission electron Microscopy (TEM) revealed microstructure of crystallized Si film with grain size over 0.5 μm. X-ray diffraction (XRD) and Raman spectroscopy were employed to determine the degree of crystallization. The a-Si:H started to crystallize at temperatures over 600 °C. An 850 °C anneal reduced film resistivity to 10s (ω-cm) for intrinsic and 1 (ω-cm) for n-type. Coplanar type thin film transistors (TFT) with gate channel length of 25 μm and width of 220 μm were fabricated with various insulating layers; if sputtered SiO2, Si3N4, BaTiO3, MgO, and evaporated SiO. The first two exhibited the least leakage current. The as-grown intrinsic a-Si:H field effect mobility was around 0.03 (cmVV.s) and delay time was 5×10−7 s. The solid phase crystallized silicon film exhibited high leakage current. The delay time of an excimer laser anneal treated TFT was reduced to 2.5×10−7 s. Crystallized Si film mobility was improved to 15 (cm2 /V.s).


1999 ◽  
Vol 587 ◽  
Author(s):  
Rosaria A. Puglisi ◽  
Hiroshi Tanabe ◽  
Claudine M. Chen ◽  
Harry A. Atwater ◽  
Emanuele Rimini

AbstractWe investigated the formation of large-grain polycrystalline silicon films on glass substrates for application in low-cost thin film crystalline silicon solar cells. Since use of glass substrates constrains process temperatures, our approach to form large-grain polycrystalline silicon templates is selective nucleation and solid phase epitaxy (SNSPE). In this process, selective crystallization of an initially amorphous silicon film, at lithographically predetermined sites, enables grain sizes larger than those observed via random crystallization. Selective heterogeneous nucleation centers were created on undoped, 75 nm thick, amorphous silicon films, by masked implantation of Ni islands, followed by annealing at temperatures below 600 °. At this temperature, the Ni precipitates into NiSi2 particles that catalyze the transition from the amorphous to the crystalline Si phase. Seeded crystallization begins at the metal islands and continues via lateral solid phase epitaxy (SPE), thus obtaining crystallized regions of several tens of square microns in one hour. We have studied the dependence of the crystallization rate on the Ni-implanted dose in the seed, in the 5×1015/cm3 - 1016/cm3range. The large grained polycrystalline Si films were then used as a substrate for molecular beam epitaxy (MBE) depositions of 1 [.proportional]m thick Si layers. Transmission electron microscopy (TEM) analysis showed a strong correlation between the substrate morphology and the deposited layer. The layer presented a large grain morphology, with sizes of about 4 [.proportional]m.


1985 ◽  
Vol 49 ◽  
Author(s):  
H. Pfleiderer ◽  
W. Kusian

AbstractThe characteristics of a thin-film transistor using an amorphous-silicon film are presented. The appearance of electron and hole channels is made possible by ohmic source and drain contacts. A theoretical model explains the phenomena.


1995 ◽  
Vol 408 ◽  
Author(s):  
T. Ohira ◽  
O. Ukai ◽  
M. Noda ◽  
Y. Takeuchi ◽  
M. Murata ◽  
...  

AbstractWe have performed molecular-dynamics (MD) simulations of hydrogenated amorphous silicon (a-Si:H) thin-film growth using realistic many-body semiclassical potentials developed to describe Si-H interactions. In our MD model, it was assumed that SiH3, SiH2 and the H radicals are main precursors for the thin-film growth. In MD simulations of a-Si:H thin-film growth by many significant precursor SiH3 radicals, we have evaluated average radical migration distances, defect ratios, hydrogen contents, and film growth rates as a function of different incident radical energies to know the effect of the radical energization on the properties. As a result of the comparison between the numerical and experimental results, it was observed that the agreement is fairly good, and that an increase of radical migration distance due to the radical energization is effective on a- Si:H thin-film growth with a low defect.


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