In Situ Cross-Sectional Scanning Tunneling Microscopy Sample Preparation Technique
Keyword(s):
ABSTRACTA novel in situ sample cleavage technique has been developed for fabricating specimens for cross-sectional scanning tunneling microscopy (XSTM) applications. This technique can be easily adapted to any ultrahigh vacuum (UHV) STM that has a coarse motion capability. A conducting diamond STM tip is used to create micron long scratches on Ge/GaAs or GaAs {001 }-type surfaces. These {001} surfaces are imaged with STM to observe scratch characteristics, and GaAs samples are cleaved to reveal {110}-type faces. Atomic resolution images of {110}-type GaAs surfaces are readily and reproducibly obtained.
1994 ◽
Vol 12
(4)
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pp. 2610
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2002 ◽
Vol 20
(4)
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pp. 1567
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1996 ◽
Vol 67
(5)
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pp. 1922-1924
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1997 ◽
pp. 59-64
1994 ◽
Vol 01
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pp. 621-624
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