Ion Implantation and Annealing in III-V Multilayer Heterojunctions
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ABSTRACTThis paper reviews the status of implantation and annealing in III-V multilayer heterojunctions. The limitations on diffusion doping of multilayers are noted. Current heterojunction device applications for implantation are summarized. Issues relevant to the annealing of multilayers are discussed, including Si migration in modulation doped structures, the effectiveness of rapid annealing in reducing SI diffusion, and impurity enhanced diffusion in superlattices. The formation of damage in multilayers and the unique properties of strained multilayers are also discussed. Finally, implant activation studies are summarized.
1974 ◽
Vol 10
(4)
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pp. 234-239
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1969 ◽
Vol 311
(1504)
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pp. 53-61
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1998 ◽
Vol 264-268
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pp. 717-720
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