Redistribution of Ion Implanted Hydrogen in Polycrystalline Silicon Thin Films

1985 ◽  
Vol 59 ◽  
Author(s):  
Ronald N. Legge ◽  
James F. Brown

ABSTRACTThe effect of implanted hydrogen on the resistivity of polycrystalline silicon films has been investigated. The observed reduction in resistivity due to hydrogen is most pronounced for lightly doped films, and is accentuated by a 450°C anneal. An increase in Hall mobility is also observed. The pre-implant resistivity is completely recovered by annealling at 600°C. Diffusion of hydrogen at low temperatures is monitored by local resistivity changes detected with spreading resistance measurements.

1999 ◽  
Vol 557 ◽  
Author(s):  
M. Ichikawa ◽  
J. Takeshita ◽  
A. Yamada ◽  
M. Konagai

AbstractA new process, the Hot Wire Cell method, was developed and successfully used to grow polycrystalline silicon thin films at a low temperature and high growth rate. In the Hot Wire Cell method, reactant gases are decomposed as a result of reacting with a heated tungsten filament placed near to a substrate and polycrystalline silicon films can be deposited at a growth rate of 1.2nm/s without hydrogen dilution and 0.9nm/s with the use hydrogen dilution. The film crystallinity changed from amorphous to polycrystalline due to the addition of hydrogen, thus hydrogen dilution was effective for improving film crystallinity. Furthermore, we obtained (220) oriented polycrystalline silicon thin films with a 90% crystal fraction by the use of hydrogen dilution. These results showed that the Hot Wire Cell method is promising for the deposition of device-grade polycrystalline silicon films for photovoltaic applications.


2005 ◽  
Vol 487 (1-2) ◽  
pp. 252-254 ◽  
Author(s):  
Nobuyuki Andoh ◽  
Toshiyuki Sameshima ◽  
Yasunori Andoh

1983 ◽  
Vol 26 (7) ◽  
pp. 657-665 ◽  
Author(s):  
Ruey-Shing Huang ◽  
Chin-Hsiung Cheng ◽  
J.C. Liu ◽  
M.K. Lee ◽  
C.T. Chen

1990 ◽  
Vol 202 ◽  
Author(s):  
P. Krulevitch ◽  
Tai D. Nguyen ◽  
G. C. Johnson ◽  
R. T. Howe ◽  
H. R. Wenk ◽  
...  

ABSTRACTAn investigation of undoped LPCVD polycrystalline silicon films deposited at temperatures ranging from 605 to 700 C and silane pressures from 300 to 550 mTorr revealed large variations in stress with processing conditions and a correlation between stress and texture. TEM and HRTEM analysis show that morphology differences also exist. At lower temperatures (≈605 C) and higher pressures (≈400 mTorr), the films appear to deposit in an amorphous state and crystallize during the deposition to form microstructures characterized by equi-axed grains, tensile residual stress, and a texture with {110} and {11/} (/=2 or 3) components. Higher temperatures (between 620 and 650 C) produce films that nucleate at the Si02 interface, creating a {110} oriented columnar microstructure. At 700 C, the grains are still columnar, but the dominant texture is {100}. Films deposited at temperatures greater than 620 C exhibit compressive stress, and some contain regions of hexagonal silicon. This paper proposes possible causes of the varying stresses, textures, and microstructures in the films.


2000 ◽  
Vol 63 (2) ◽  
pp. 177-184 ◽  
Author(s):  
Michael Stöger ◽  
Michael Nelhiebel ◽  
Peter Schattschneider ◽  
Viktor Schlosser ◽  
Alexander Breymesser ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document