Effects of Supercritical CO2 Drying and Photoresist Strip on Low-k Films
Keyword(s):
Low K
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AbstractFuture interlayer dielectric (ILD) requirements necessitate reductions in dielectric constant to 2.1 within four years. Due to gaseous-like transport properties and near liquid-like densities, supercritical methods have been developed to dry and strip resist from these highly porous materials. Although a non-polar molecule, the solvating capability of supercritical CO2 (SCCO2) can be tailored by varying pressure, temperature, and co-solvents. This flexibility has been employed to remove photoresist and moisture from porous low-k films. The results of these experiments have been characterized using FTIR, ellipsometry, and SEM.
2017 ◽
Vol 58
(6)
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pp. 664-669
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Keyword(s):
2016 ◽
Vol 55
(3-4)
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pp. 134-140
2012 ◽
Vol 69
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pp. 115-126
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2020 ◽
2006 ◽
Vol 45
(9-10)
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pp. 409-414
Keyword(s):