EFFECT OF SHORT PIN FIN WITH DIFFERENT SHAPES AND ARRANGEMENTS ON THERMAL RESISTANCE OF MICRO HEAT SINK

2020 ◽  
Vol 27 (6) ◽  
pp. 491-503
Author(s):  
Gagan V. Kewalramani ◽  
Gaurav Hedau ◽  
Sandip Kumar Saha ◽  
Amit Agrawal
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
Pin Fin ◽  
Different Shapes

Thermal Simulation Analysis of High Power LED with Varied Heat Sink Fin Design

2014 ◽  
Vol 1082 ◽  
pp. 332-335
Author(s):  
Vithyacharan Retnasamy ◽  
Zaliman Sauli ◽  
Hussin Kamarudin ◽  
Muammar Mohamad Isa ◽  
Gan Meng Kuan
Keyword(s):  
High Power ◽  
Heat Sink ◽  
Simulation Analysis ◽  
Input Power ◽  
Junction Temperature ◽  
Single Chip ◽  
Pin Fin ◽  
High Power Led ◽  
Different Shapes ◽  
Fin Design

In this paper, the heat distribution for single chip high power LED package attached with varied heat sink fin shapes were analyzed through simulation. The main focus of this study was to scrutinize the fluctuation of junction temperature with different shapes of heat sink fin designs. The simulation was done using Ansys version 11. The single chip LED was loaded with input power of 0.5 W and 1 W . Simulation was done at ambient temperature of 25°C under three convection coefficient of 5, 10 and 15 W/m2.oC respectively. The obtained results showed that the LED package with pyramid pin fin heat sink has demonstrated a better thermal performance compared to the LED package with cylindrical pin fin heat sink.

S-Shaped Pin-Fins for Enhancement of Overall Performance of the Pin-Fin Heat Sink

2010 ◽  
Author(s):  
T. J. John ◽  
B. Mathew ◽  
H. Hegab
Keyword(s):  
Reynolds Number ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Heat Sinks ◽  
Uniform Heat Flux ◽  
Pumping Power ◽  
Pin Fin ◽  
Pin Fins ◽  
Overall Performance

In this paper the authors are studying the effect of introducing S-shaped pin-fin structures in a micro pin-fin heat sink to enhance the overall thermal performance of the heat sinks. For the purpose of evaluating the overall thermal performance of the heat sink a figure of merit (FOM) term comprising both thermal resistance and pumping power is introduced in this paper. An optimization study of the overall performance based on the pitch distance of the pin-fin structures both in the axial and the transverse direction, and based on the curvature at the ends of S-shape fins is also carried out in this paper. The value of the Reynolds number of liquid flow at the entrance of the heat sink is kept constant for the optimization purpose and the study is carried out over a range of Reynolds number from 50 to 500. All the optimization processes are carried out using computational fluid dynamics software CoventorWARE™. The models generated for the study consists of two sections, the substrate (silicon) and the fluid (water at 278K). The pin fins are 150 micrometers tall and the total structure is 500 micrometer thick and a uniform heat flux of 500KW is applied to the base of the model. The non dimensional thermal resistance and nondimensional pumping power calculated from the results is used in determining the FOM term. The study proved the superiority of the S-shaped pin-fin heat sinks over the conventional pin-fin heat sinks in terms of both FOM and flow distribution. S-shaped pin-fins with pointed tips provided the best performance compared to pin-fins with straight and circular tips.

Parametric Study of Heat Sink Performance at High Altitudes With Air Impingement Cooling

2006 ◽  
Author(s):  
Robert E. Seidel ◽  
Jinny Rhee
Keyword(s):  
Reynolds Number ◽  
Thermal Resistance ◽  
Heat Sink ◽  
Air Flow ◽  
Heat Sinks ◽  
Temperature Measurements ◽  
Test Apparatus ◽  
High Altitudes ◽  
Pin Fin ◽  
Hypobaric Chamber

Heat sinks are one of the primary mechanisms today for thermal management of electronics. In the high altitudes reached by modern military aircraft, the capacity for air cooling is reduced due to the rarefied atmosphere. With an increase in altitude there is a subsequent decrease in the density of air. A review of the literature shows a lack of research done on pin-fin heat sinks with impingement flows at low Reynolds number conditions. Experimental testing will determine the thermal resistance of a pin-fin heat sink with impingement flow at low absolute pressures. A test apparatus will be constructed, and experiments will be conducted within a hypobaric chamber. In a hypobaric chamber, it is possible to simulate altitudes up to 30 000 meters by reducing the absolute pressure using a vacuum pump. Temperature is regulated and air is circulated within the chamber. The test apparatus, which is to be completely enclosed within the hypobaric chamber, consists of a centrifugal blower forcing air through a duct. Air is impinged upon a pin-fin heat sink heated with uniform flux on the base. Incident air flow is along the axis of each circular pin-fin, and exhaust from the heat sink will be transverse to the pins. Feedthroughs are available in the chamber wall for supplying electrical power to the blower, for taking temperature measurements with embedded thermocouples, and for measuring blower shaft speed. Temperature measurements are made in the base of the heat sink, in the air, and at other points to characterize other heat losses from the apparatus. Blower speed is monitored with an optical tachometer, and by similarity laws for turbomachinery it will be possible to determine the air flow impinging upon the heat sink. Pressure in the chamber will be varied in several steps up to the equivalent of a 30 000-meter altitude, and at each step a correlation will be made between heat sink thermal resistance and Reynolds number of the impinging air.

Thermal Performance Analysis of Fan-Heat Sinks for CPU Cooling

2003 ◽  
Author(s):  
Seo Young Kim ◽  
Ralph L. Webb
Keyword(s):  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Heat Sinks ◽  
Operating Point ◽  
Pin Fin ◽  
Flow Impedance ◽  
Impedance Curve ◽  
Convective Thermal ◽  
Offset Strip Fin

The thermal performance of plate fin, round pin-fin and offset strip-fin heat sinks with a duct-flow type fan arrangement was analytically evaluated. Heat sinks of 65mm × 60mm plan area × 50 mm height with a 4300-RPM DC fan (60mm × 15mm) were chosen for the performance comparison. A constant temperature, 6 mm thick heat sink base plate is assumed so that thermal spreading resistance is not involved. The operating point on the fan curve is based on the flow pressure drop impedance curve through a heat sink using the friction factor correlation for the chosen heat sink. The loss coefficients at both the entrance and the exit of heat sink are included in the flow impedance curve. The operating point is defined by the balance point of the flow impedance curve and the fan performance curve. After determining the operating air velocity, the convective thermal resistance of heat sinks is evaluated from the Nusselt number correlation for the chosen heat sink. Results obtained show that optimized round pin-fin heat sinks provide 32.8%-to-46.4% higher convective thermal resistance compared to an optimized plate-fin heat sink. The optimized offset strip-fin heat sink shows a slightly lower convective thermal resistance than the plate-fin heat sink. As the offset strip length decreases, however, thermal performance seriously deteriorates.

Free Convection Limits for Pin-Fin Cooling

1998 ◽  
Vol 120 (3) ◽  
pp. 633-640 ◽  
Author(s):  
T. S. Fisher ◽  
K. E. Torrance
Keyword(s):  
Analytical Solution ◽  
Free Convection ◽  
Thermal Resistance ◽  
Heat Sink ◽  
Heat Dissipation ◽  
Inviscid Flow ◽  
System Size ◽  
Total System ◽  
Pin Fin ◽  
Optimal Values

An analytical solution for a system consisting of a pin-fin heat sink and a chimney is presented. The result is applied to problems in which the size of the overall system is constrained. For a given heat dissipation and total system size, optimal values of the pin-fin diameter and heat-sink porosity are observed. The optima occur for systems with and without chimneys. The optimization is used to show that the minimum thermal resistance from a pin-fin heat sink is about two times larger than that of an idealized model based on inviscid flow.

Multi Layer Micro Pin-Fins Heat Sinks for Better Performance

2010 ◽  
Author(s):  
T. J. John ◽  
B. Mathew ◽  
H. Hegab
Keyword(s):  
Temperature Distribution ◽  
Thermal Resistance ◽  
Heat Sink ◽  
Single Layer ◽  
Heat Sinks ◽  
Substrate Thickness ◽  
Pin Fin ◽  
Micro Channels ◽  
Pin Fins ◽  
Overall Performance

This study numerically investigates the feasibility and advantages of using a multilayer pin-fin heat sink to increase the overall performance of the heat sink. For the purpose of determining overall performance of the pin-fin heat sink a figure of merit (FOM) term is introduced in this paper, which constituted of both the thermal resistance and the pumping power of the heat sink. Higher the FOM of a heat sink better is its overall performance. A computational fluid dynamics software CoventorWARE™ is used for the analysis of micro heat sink performance. A small portion of the entire heat sink is modeled in this study assuming repeatability towards both sides for the ease of analysis. The developed models consist of two sections, the substrate (silicon) and the fluid (water at 278K). A uniform heat flux is applied to the base of the heat sink. A single layer micro pin-fin heat sinks with same dimensions as of the multi layer heat sink was also modeled for the comparison purpose. Temperature distribution at five different locations from the inlet to the outlet section is also analyzed to study the temperature distribution over the heat sink. Circular pin-fins were used in both the multilayer and single layer micro heat sinks. Feasibility of using micro channels as the second layer was also investigated in this paper and it proved to have advantages over using pin-fin structures on both layers. A geometric optimization based on the substrate thickness of the second layer of the double layer heat sink showed that the substrate thickness of the second layer doesn’t have any effect on the overall thermal resistance of the heat sink.

Numerical Analysis on Natural Convection Heat Transfer of a Heat Sink with Cylindrical Pin Fin

2014 ◽  
Vol 695 ◽  
pp. 398-402
Author(s):  
Yap Zi Qin ◽  
Amer Nordin Darus ◽  
Nor Azwadi Che Sidik
Keyword(s):  
Heat Transfer ◽  
Natural Convection ◽  
Thermal Resistance ◽  
Thermal Management ◽  
Heat Sink ◽  
Information Age ◽  
Convection Heat Transfer ◽  
Pin Fin ◽  
Technology Advancement ◽  
Optimum Porosity

As technology advancement progressed in this information age or commonly known as digital age, thermal management has equally improved to keep up with demands from the electronic sector. Hence, heat sink study has become more and more prominent. Natural convection holds advantages since it is maintenance free and has zero power consumption. The purpose of this research is to study the heat transfer performance of heat sink with parametric variations of number and height of pin fin at temperature 308K, 323K, 338K, 353K and 368K. In addition, effect of porosity ranges from 0.524 to 0.960 on thermal resistance was investigated as well. Study found that heat transfer coefficient increases as temperature difference between heat sink and ambient increases. Thermal resistance decreases when porosity increases until it reaches the minimum and subsequently increases. The optimum porosity shown in this study is around 88%.

Analysis of Pin-Fin Heat Sinks With an Unconventional Fin Profile

2013 ◽  
Author(s):  
Jose-Luis Gonzalez-Hernandez ◽  
Abel Hernandez-Guerrero ◽  
Carlos Rubio-Jimenez ◽  
Cuauhtemoc Rubio-Arana
Keyword(s):  
Wave Function ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Geometric Parameter ◽  
Entropy Generation ◽  
Heat Sink ◽  
Total Pressure ◽  
Heat Sinks ◽  
Pin Fin ◽  
Sinusoidal Function

In this work the performance of pin-fin heat sinks having an unconventional fin profile is compared with the use of cylindrical fins. The fin profile is a sinusoidal function and a staggered array is considered. The overall thermal resistance and total pressure drop are reported for the pin-fin heat sinks. The effect of using a wave function for the fin is studied for different number of complete waves along the height of the fins and a geometric parameter defined as the ratio of the higher to the lower radius of the fins is proposed. The study is carried out for two different inlet velocities, and for two different fin densities, corresponding to 5×5 and 7×7 arrays. An entropy generation analysis for each pin fin heat sink configuration is carried out and reported. The results of the present analysis reveal that the proposed geometry has an improvement as compared to the conventional heat sinks profiles when there is a high number of waves per fin. The effect of the geometric parameters defined in this study for the thermal and hydraulic performance is identified and discussed as well.

Sign in / Sign up

Export Citation Format

Share Document