Phytic acid-based flame retardants for cotton

2020 ◽  
Vol 8 (3) ◽  
pp. 123-130 ◽  
Author(s):  
Anuttam Patra ◽  
Sara Kjellin ◽  
Anna-Carin Larsson
Keyword(s):  
Phytic Acid ◽  
Flame Retardants

scholarly journals Experimental and numerical perspective on the fire performance of MXene/Chitosan/Phytic acid coated flexible polyurethane foam

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Bo Lin ◽  
Anthony Chun Yin Yuen ◽  
Timothy Bo Yuan Chen ◽  
Bin Yu ◽  
Wei Yang ◽  
...  
Keyword(s):  
Phytic Acid ◽  
Polyurethane Foam ◽  
Flame Retardants ◽  
Layer By Layer ◽  
Aromatic Rings ◽  
Pyrolysis Model ◽  
Biomass Materials ◽  
Flexible Polyurethane Foam ◽  
Flexible Polyurethane ◽  
Phosphorous Compounds

AbstractRecent discoveries of two-dimensional transitional metal based materials have emerged as an excellent candidate for fabricating nanostructured flame-retardants. Herein, we report an eco-friendly flame-retardant for flexible polyurethane foam (PUF), which is synthesised by hybridising MXene (Ti$$_3\hbox {C}_2$$ 3 C 2 ) with biomass materials including phytic acid (PA), casein, pectin, and chitosan (CH). Results show that coating PUFs with 3 layers of CH/PA/Ti$$_3\hbox {C}_2$$ 3 C 2 via layer-by-layer approach reduces the peak heat release and total smoke release by 51.1% and 84.8%, respectively. These exceptional improvements exceed those achieved by a CH/Ti$$_3\hbox {C}_2$$ 3 C 2 coating. To further understand the fundamental flame and smoke reduction phenomena, a pyrolysis model with surface regression was developed to simulate the flame propagation and char layer. A genetic algorithm was utilised to determine optimum parameters describing the thermal degradation rate. The superior flame-retardancy of CH/PA/Ti$$_3\hbox {C}_2$$ 3 C 2 was originated from the shielding and charring effects of the hybrid MXene with biomass materials containing aromatic rings, phenolic and phosphorous compounds.

Preparation of Phytic Acid Modified Polyurethane Wet Spinning Fibers for Application in Pb2+ Adsorption

2019 ◽  
Vol 35 (4) ◽  
pp. 497-506 ◽  
Author(s):  
YINCHUN FANG ◽  
◽  
XINHUA LIU ◽  
XIAO WU ◽  
XUCHEN TAO ◽  
...  
Keyword(s):  
Phytic Acid ◽  
Wet Spinning

Effect of Fermentation Methods on Phytic acid Content in Wheat Flour Bread

2014 ◽  
Vol 27 (1) ◽  
pp. 128-142
Author(s):  
Ali A. Sahi ◽  
Ali H. Abdul-Kareem ◽  
Basim A. Jaber
Keyword(s):  
Phytic Acid ◽  
Wheat Flour ◽  
Acid Content ◽  
Phytic Acid Content

Conductive Filament Formation in Printed Circuit Boards – Effects of Reflow Conditions and Flame Retardants

2009 ◽  
Author(s):  
Bhanu Sood ◽  
Michael Pecht
Keyword(s):  
Flame Retardants ◽  
Printed Circuit Boards ◽  
Electrochemical Process ◽  
Lead Free ◽  
Circuit Boards ◽  
Filament Formation ◽  
Conductive Filament ◽  
Printed Circuit ◽  
Free Solder ◽  
Halogen Free

Abstract Failures in printed circuit boards account for a significant percentage of field returns in electronic products and systems. Conductive filament formation is an electrochemical process that requires the transport of a metal through or across a nonmetallic medium under the influence of an applied electric field. With the advent of lead-free initiatives, boards are being exposed to higher temperatures during lead-free solder processing. This can weaken the glass-fiber bonding, thus enhancing conductive filament formation. The effect of the inclusion of halogen-free flame retardants on conductive filament formation in printed circuit boards is also not completely understood. Previous studies, along with analysis and examinations conducted on printed circuit boards with failure sites that were due to conductive filament formation, have shown that the conductive path is typically formed along the delaminated fiber glass and epoxy resin interfaces. This paper is a result of a year-long study on the effects of reflow temperatures, halogen-free flame retardants, glass reinforcement weave style, and conductor spacing on times to failure due to conductive filament formation.

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