Non-Equilibrium Solvent Injection Simulation via Pore Scale Heat Conduction and Dispersion

2017 ◽  
Author(s):  
Bita Bayestehparvin ◽  
S. M. Farouq Ali ◽  
Jalal Abedi
2020 ◽  
Vol 195 ◽  
pp. 107857
Author(s):  
Tong Chen ◽  
Juliana Y. Leung ◽  
Jonathan L. Bryan ◽  
Apostolos Kantzas

2016 ◽  
Vol 7 (2) ◽  
pp. 150-166 ◽  
Author(s):  
Péter Ván

Abstract The experimental basis and theoretical background of non-Fourier heat conduction is shortly reviewed from the point of view of non-equilibrium thermodynamics. The performance of different theories is compared in case of heat pulse experiments.


Author(s):  
Yuanpeng Yao ◽  
Huiying Wu ◽  
Zhenyu Liu

In this paper, a numerical model employing 3D foam structure represented by Weaire-Phelan foam cell is developed to study the steady heat conduction of high porosity open-cell metal foam/paraffin composite at the pore-scale level. Two conduction problems are considered in the cubic representative computation unit of the composite material: one with constant temperature difference between opposite sides of the cubic unit (that can be used to determine the effective thermal conductivity (ETC)) and the second with constant heat flux at the interface between metal foam and paraffin (that can be used to determine the interstitial conduction heat transfer coefficient (ICHTC)). The effects of foam pore structure parameters (pore size and porosity) on heat conduction are investigated for the above two problems. Results show that for the first conduction problem, the effect of foam structure on heat conduction (i.e. the ETC) is related to porosity rather than pore size. The essential reason is due to the thermal equilibrium state between metal foam and paraffin indicated by the negligible interstitial heat transfer. While for the second conduction problem with inherent thermal non-equilibrium effect, it shows that both porosity and pore size significantly influence the interstitial heat conduction (i.e. the ICHTC). Furthermore, the present ETC and ICHTC data are compared to the results in the published literature. It shows that our ETC data agree well with the reported experimental results, and are more accurate than the numerical predications based on body-centered-cubic foam cell in literature. And our ICHTC data are in qualitative agreement with the published numerical results, but the present results are based on a more realistic foam structure.


2017 ◽  
Vol 139 (9) ◽  
Author(s):  
Yuanpeng Yao ◽  
Huiying Wu ◽  
Zhenyu Liu

In this paper, a numerical model employing an approximately realistic three-dimensional (3D) foam structure represented by Weaire–Phelan foam cell is developed to study the steady-state heat conduction of high porosity open-cell metal foam/paraffin composite at the pore-scale level. The conduction problem is considered in a cubic representative computation unit of the composite material with a constant temperature difference between one opposite sides of the cubic unit (the other outer surfaces of the cubic unit are thermally insulated). The effective thermal conductivities (ETCs) of metal foam/paraffin composites are calculated with the developed pore-scale model considering small-scale details of heat conduction, which avoids using adjustable free parameters that are usually adopted in the previous analytical models. Then, the reason why the foam pore size has no evident effect on ETC as reported in the previous macroscopic experimental studies is explored at pore scale. Finally, the effect of air cavities existing within solid paraffin in foam pore region on conduction capacity of metal foam/paraffin composite is investigated. It is found that our ETC data agree well with the reported experimental results, and thus by direct numerical simulation (DNS), the ETC data of different metal foam/paraffin composites are provided for engineering applications. The essential reason why pore size has no evident effect on ETC is due to the negligible interstitial heat transfer between metal foam and paraffin under the present thermal boundary conditions usually used to determine the ETC. It also shows that overlarge volume fraction of air cavity significantly weakens the conduction capacity of paraffin, which however can be overcome by the adoption of high conductive metal foam due to enhancement of conduction.


Author(s):  
Syed A. Ali ◽  
Gautham Kollu ◽  
Sandip Mazumder ◽  
P. Sadayappan

Non-equilibrium heat conduction, as occurring in modern-day sub-micron semiconductor devices, can be predicted effectively using the Boltzmann Transport Equation (BTE) for phonons. In this article, strategies and algorithms for large-scale parallel computation of the phonon BTE are presented. An unstructured finite volume method for spatial discretization is coupled with the control angle discrete ordinates method for angular discretization. The single-time relaxation approximation is used to treat phonon-phonon scattering. Both dispersion and polarization of the phonons are accounted for. Three different parallelization strategies are explored: (a) band-based, (b) direction-based, and (c) hybrid band/cell-based. Subsequent to validation studies in which silicon thin-film thermal conductivity was successfully predicted, transient simulations of non-equilibrium thermal transport were conducted in a three-dimensional device-like silicon structure, discretized using 604,054 tetrahedral cells. The angular space was discretized using 400 angles, and the spectral space was discretized into 40 spectral intervals (bands). This resulted in ∼9.7×109 unknowns, which are approximately 3 orders of magnitude larger than previously reported computations in this area. Studies showed that direction-based and hybrid band/cell-based parallelization strategies resulted in similar total computational time. However, the parallel efficiency of the hybrid band/cell-based strategy — about 88% — was found to be superior to that of the direction-based strategy, and is recommended as the preferred strategy for even larger scale computations.


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