scholarly journals Outstanding Piezoelectricity of (K, Na)(Nb, Sb)O3-SrZrO3-(Bi, Ag)ZrO3 Piezoceramics and Their Application to a Planar-Type Actuator

2021 ◽  
Author(s):  
Su-Hwan Go ◽  
Jae-min Eum ◽  
Dae-Su Kim ◽  
Seok-Jun Chae ◽  
Sun-Woo Kim ◽  
...  
Keyword(s):  
Thick Film ◽  
Domain Boundary ◽  
Boundary Energy ◽  
Piezoelectric Actuators ◽  
Lead Free ◽  
Similar Proportion ◽  
Piezoelectric Charge

Abstract Fe2O3-added 0.96(K0.5Na0.5)(Nb0.94Sb0.06)-0.01SrZrO3-0.03(BiAg)ZrO3 [KNNS-0.01SZ-0.03BAZ] piezoceramic was well densified at 1090 °C. It exhibited a large piezoelectric charge constant (d33) of 650 pC/N, which is similar to the largest d33 value reported in the literature. This sample has a tetragonal-orthorhombic-rhombohedral (T-O-R) structure, in which each structure has a similar proportion. Moreover, nanodomains (2 nm × 15 nm) with low domain boundary energy were found in this sample, which exhibited relaxor properties. Therefore, the presence of a T-O-R multi-structure and nanodomains is responsible for the large d33 value of this sample. A KNNS-0.01SZ-0.03BAZ thick film was synthesized, and it also had a T-O-R multi-structure with a large d33 (630 pC/N). A planar-type actuator was produced using this thick film, and this actuator exhibited a large acceleration (335 G at 120 V/mm) and displacement (231 μm at 120 V/mm). Hence, the KNNS-0.01SZ-0.03BAZ thick film is a good candidate for lead-free piezoelectric actuators.

Piezoelectric Voltage Constant and Sensitivity Enhancements Through Phase Boundary Structure Control of Lead-free (K,Na)NbO3-based ceramics

2021 ◽  
Author(s):  
Min-Ku Lee ◽  
Byung-Hoon Kim ◽  
Gyoung-Ja Lee
Keyword(s):  
Material Parameter ◽  
Perovskite Oxide ◽  
Lead Free ◽  
Boundary Structure ◽  
Voltage Sensitivity ◽  
Phase Boundaries ◽  
Accelerometer Sensor ◽  
Structure Control ◽  
Piezoelectric Charge ◽  
Piezoelectric Voltage

Abstract The piezoelectric voltage constant (g33) is a material parameter critical to piezoelectric voltage-type sensors for detecting vibrations or strains. Here, we report a lead-free (K,Na)NbO3 (KNN)-based piezoelectric accelerometer with voltage sensitivity enhanced by taking advantage of a high g33. To achieve a high g33, the magnitudes of piezoelectric charge constant d33 and dielectric permittivity er of KNN were best coupled by manipulating the intrinsic polymorphic phase boundaries effectively with the help of Bi-based perovskite oxide additives. For the KNN composition that derives benefit from the combination of er and d33, the value of g33 was found to be 46.9 ´ 10-3 V·m/N, which is significantly higher than those (20 - 30 ´ 10−3 V·m/N) found in well-known polycrystalline lead-based ceramics including commercial Pb(Zr,Ti)O3 (PZT). Finally, the accelerometer sensor prototype built using the modified KNN composition demonstrated higher voltage sensitivity (183 mV/g) when measuring vibrations, showing a 29% increase against the PZT-based sensor (142 mV/g).

Large electrocaloric effect in lead-free Ba(ZrxTi1-x)O3 thick film ceramics

2018 ◽  
Vol 742 ◽  
pp. 165-171 ◽  
Author(s):  
Xiao-Dong Jian ◽  
Biao Lu ◽  
Dan-Dan Li ◽  
Ying-Bang Yao ◽  
Tao Tao ◽  
...  
Keyword(s):  
Thick Film ◽  
Lead Free ◽  
Electrocaloric Effect

Evaluation of Glass Frits for Development of Lead-Free Thick Film Resistor

2010 ◽  
Vol 2010 (1) ◽  
pp. 000752-000759
Author(s):  
Xudong Chen ◽  
W. Kinzy Jones
Keyword(s):  
Electrical Properties ◽  
Temperature Coefficient ◽  
Thick Film ◽  
Glass Frit ◽  
Lead Free ◽  
Temperature Coefficient Of Resistance ◽  
Film Resistor ◽  
Thick Film Resistor ◽  
Glass Compositions ◽  
Free Glass

Glass frit is a major component of thick film resistor (TFR) for the production of hybrid circuits. More than thirty commercial lead-free glass frits with different compositions have been evaluated for developing a lead-free thick film resistor that is compatible with typical industry thick film processing and has comparable electrical properties as the lead bearing counterpart. Two glass compositions were selected out of 33 candidates for preparation of RuO2 based TFR inks, which were screen printed on alumina substrates and fired at 850°C. The preliminary results of these resistors showed that the sheet resistance spanned from 400 ohms per square (Ω/□) to 0.4 mega-ohms per square (MΩ/□) with 5–15% RuO2 and the hot temperature coefficient of resistance (HTCR) fell in a range of ±350ppm/°C.

Performance Assessment of a Low Temperature Polymer Conductor for Lead-Free Soldering Processes

2014 ◽  
Vol 2014 (1) ◽  
pp. 000251-000257
Author(s):  
Steven Grabey ◽  
Samson Shahbazi ◽  
Sarah Groman ◽  
Catherine Munoz
Keyword(s):  
Low Temperature ◽  
Thick Film ◽  
Elevated Temperatures ◽  
Printed Electronics ◽  
High Reliability ◽  
Sem Analysis ◽  
Lead Free ◽  
Sac305 Solder ◽  
Soldering Process ◽  
Lead Free Solders

An increased interest in low temperature polymer thick film products has become apparent due to the rise of the printed electronics market. The specifications for these products are becoming more demanding with expectations that the low temperature products should perform at a level that is typically reserved for their high temperature counterparts; including solderability with lead free solders, high reliability and strong adhesion. Traditionally, it has only been possible to use leaded solders for soldering to polymer based thick film conductors. Over the last 15 years environmental concerns and legislation have pushed the industry towards a lead free approach. The shift to lead free solders, while beneficial, provides new challenges during processing. The high temperatures required for a lead-free soldering process yield a naturally harsher environment for polymer thick film pastes. In the past these conditions have proven too harsh for the pastes to survive. The polymer thick film discussed in this document aims to address some of these concerns for a highly reliable and easy to process polymer thick film paste. Due to the poor leaching characteristics of polymer thick films, at elevated temperatures, the predecessors of this paste typically soldered at low temperatures with leaded solders. The goal of this paper is to present a low temperature paste that is compatible with a variety of substrates and readily accepts lead-free solder. This paper will discuss a newly formulated low temperature curing (150°C – 200°C) RoHS and REACH compliant paste that shows excellent solderability with SAC305 solder. The paste was evaluated using a dip soldering method at 235°C–250°C on a variety of substrates. The data presented includes solder acceptance, adhesion data, thermal analysis and SEM analysis.

scholarly journals Lead Free Multilayer Piezoelectric Actuators by Economically New Approach

2020 ◽  
Vol 7 ◽  
Author(s):  
Fayaz Hussain ◽  
Amir Khesro ◽  
Zhilun Lu ◽  
Ge Wang ◽  
Dawei Wang
Keyword(s):  
Piezoelectric Actuators ◽  
Lead Free ◽  
New Approach

Aerosol-deposited KNN–LSO lead-free piezoelectric thick film for high frequency transducer applications

2010 ◽  
Vol 163 (1) ◽  
pp. 226-230 ◽  
Author(s):  
S.T. Lau ◽  
X. Li ◽  
Q.F. Zhou ◽  
K.K. Shung ◽  
J. Ryu ◽  
...  
Keyword(s):  
Thick Film ◽  
High Frequency ◽  
Lead Free ◽  
Frequency Transducer ◽  
High Frequency Transducer

scholarly journals Study of lead free ferroelectrics using overlay technique on thick film microstrip ring resonator

2016 ◽  
Vol 10 (1) ◽  
pp. 41-46
Author(s):  
Shridhar Mathad ◽  
Maruti Rendale ◽  
Roopali Jadhav ◽  
Vijaya Puri
Keyword(s):  
Thick Film ◽  
Complex Permittivity ◽  
Ring Resonator ◽  
Low Cost ◽  
Solid State Reaction Method ◽  
Lead Free ◽  
Strontium Barium ◽  
Microstrip Ring ◽  
Very High Frequencies ◽  
Microstrip Ring Resonator

The lead free ferroelectrics, strontium barium niobates, were synthesized via the low cost solid state reaction method and their fritless thick films were fabricated by screen printing technique on alumina substrate. The X band response (complex permittivity at very high frequencies) of Ag thick film microstrip ring resonator perturbed with strontium barium niobates (SrxBa1-xNb2O6) in form of bulk and thick film was measured. A new approach for determination of complex permittivity (?? and ???) in the frequency range 8-12GHz, using perturbation of Ag thick film microstrip ring resonator (MSRR), was applied for both bulk and thick film of strontium barium niobates (SrxBa1-xNb2O6). The microwave conductivity of the bulk and thick film lie in the range from 1.779 S/cm to 2.874 S/cm and 1.364 S/cm to 2.296 S/cm, respectively. The penetration depth of microwave in strontium barium niobates is also reported.

Metal-based Optical MEMS Scanning Devices Using Lead-Free Piezoelectric Sheets Prepared by Aerosol Deposition

2012 ◽  
Vol 2012 (CICMT) ◽  
pp. 000246-000250
Author(s):  
Jae-Hyuk Park ◽  
Jun Akedo
Keyword(s):  
Resonant Frequency ◽  
Thick Film ◽  
Bulk Material ◽  
Ambient Air ◽  
Aerosol Deposition ◽  
Lead Free ◽  
Mems Devices ◽  
Optical Mems ◽  
Scanning Angle ◽  
Optical Scanning

We demonstrate metal-based lamb-wave resonant optical MEMS scanning devices actuated by aerosol deposition (AD) piezoelectric film and report their temperature properties and durability. Metal-based structure was introduced to reduce the production cost and to improve the optical scanning performance, simultaneously. The optical scanning devices with large mirror size as well as high scanning angle were fabricated. A high optical scanning angle (more than 60 °) and a high resonant frequency (more than 25 kHz) were achieved in ambient air without vacuum packaging. The resonant frequency and the scanning angle do not have any changes during life test of approximately 50,000 hours. In this report, BaTiO3 (BTO) thick film as a lead free piezoelectric material was prepared by AD process for a piezoelectric exaltation source of scanning devices. Piezoelectric d31 of BTO-AD film was approximately −138 pm/V. The performance of optical scanner driven by AD-BTO thick film was comparable with that of BTO bulk material and AD-PZT thick film. From these results, AD-BTO film might be used to practical applications on the MEMS devices.

Lead-free Solder Attach for 200°C Applications

2013 ◽  
Vol 2013 (HITEN) ◽  
pp. 000260-000267 ◽  
Author(s):  
Zhenzhen Shen ◽  
Kun Fang ◽  
Mike Hamilton ◽  
R. Wayne Johnson ◽  
Erica Snipes ◽  
...  
Keyword(s):  
Shear Strength ◽  
Thick Film ◽  
Solidus Temperature ◽  
Lead Free ◽  
Thermal Testing ◽  
Ceramic Substrates ◽  
Shear Strength Test ◽  
C Storage ◽  
Free Solder ◽  
Lead Free Solders

Conventional SAC lead-free solders have a melting point of 217°C to 227°C, limiting their suitability for applications at 200°C. AgBiXTM solder has potential for 200°C applications because of its ~260°C solidus temperature. BiAgX paste has been used to assemble SiC test die to ceramic substrates with direct bond copper (DBC), reactive brazed CuMo, thick film Au, thick film PtAu, thick film PdAg and thick film Ag. Surface mount chip resistors have also been attached to thick film metallized substrates. The assembly process and initial shear strength test results are presented. Assemblies have also been subjected to thermal testing: thermal cycling (−55°C to +195°C) and high temperature (200°C) storage. The shear strength of these assemblies after thermal testing are presented and compared to initial results.

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