scholarly journals BERYLLIUM THERMAL-CYCLING EXPERIMENT

1959 ◽  
Author(s):  
W. H. Kelley ◽  
D. L. Platus ◽  
J. R. Tallackson
Keyword(s):  
Thermal Cycling ◽  
Cycling Experiment

Discussion on the Reliability Issues of Solder-Bump and Direct-Solder Bonded Power Device Packages Having Double-Sided Cooling Capability

2005 ◽  
Vol 128 (3) ◽  
pp. 208-214 ◽  
Author(s):  
John G. Bai ◽  
Jesus N. Calata ◽  
Guo-Quan Lu
Keyword(s):  
Thermal Cycling ◽  
Solder Bump ◽  
Coefficient Of Thermal Expansion ◽  
Operating Temperature ◽  
Power Device ◽  
Element Analysis ◽  
Temperature Changes ◽  
Power Cycling ◽  
Thermomechanical Reliability ◽  
Cycling Experiment

Power device packages with solder-bump (SB) and direct-solder (DS) interconnections were fabricated and some of their thermomechanical reliability issues were discussed based on both thermal cycling experiment and finite element analysis (FEA). The SB interconnection shows superior reliability over the DS interconnection in the thermal cycling experiment because the mismatched coefficient of thermal expansion leads to smaller stresses at the SB interconnection under the same temperature changes. On the other hand, FEA results show that the DS package has significantly lower operating temperatures under the same double-sided cooling condition. After considering the operating temperature difference, the DS package was shown to be superior over the SB package in the power cycling analysis.

PENGARUH THERMAL CYCLING TERHADAP PERUBAHAN DIMENSI DAN STABILITAS WARNA BAHAN BASIS GIGI TIRUAN NILON TERMOPLASTIK

2015 ◽  
Vol 18 (3) ◽  
pp. 280-284
Author(s):  
Dwi Tjahyaning Putranti ◽  
Oktia Kiki Triana
Keyword(s):  
Thermal Cycling

Nilon termoplastik sebagai bahan basis gigi tiruan mulai menjadi pilihan perawatan. Salah satu sifat fisis nilontermoplastik yang menjadi perhatian dalam penggunaannya sebagai bahan basis gigi tiruan adalah stabilitas dimensi danstabilitas warna. Penggunaan basis gigi tiruan di rongga mulut dalam waktu tertentu akan mengakibatkan berbagaiperubahan sifat bahan. Salah satu metode yang dapat digunakan untuk mengevaluasi sifat suatu bahan yaitu thermalcycling. Sampel dibuat sesuai ADA No. 12 untuk uji perubahan dimensi dan ISO No. 1567 untuk uji stabilitas warna.Thermal cycling 70 cycles dan 300 cycles dilakukan pada masing-masing sampel perlakuan. Hasil uji dianalisismenggunakan uji ANOVA untuk mengetahui pengaruh thermal cycling terhadap perubahan dimensi dan stabilitas warnayang menunjukkan hasil signifikan (p < 0,05) dibandingkan kelompok kontrol, serta uji LSD yang menunjukkan terdapatperbedaan pengaruh thermal cycling terhadap perubahan dimensi dan stabilitas warna bahan basis gigi tiruan nilontermoplastik. Thermal cycling 70 cycle dan 300 cycle pada bahan basis gigi tiruan nilon termoplastik dapat meningkatkannilai perubahan dimensi dan menurunkan nilai stabilitas warna bahan basis gigi tiruan nilon termoplastik. Kesimpulan,penggunaan gigi tiruan selama 1 minggu dibandingkan 1 bulan menyebabkan perubahan dimensi semakin besar danberkurangnya stabilitas warna pada basis gigi tiruan nilon termoplastik.

Parallel Glide: A Fundamentally Different Type of Dislocation Motion in Ultrathin Metal Films

2003 ◽  
Vol 779 ◽  
Author(s):  
T. John Balk ◽  
Gerhard Dehm ◽  
Eduard Arzt
Keyword(s):  
Thermal Cycling ◽  
Grain Boundaries ◽  
Film Surface ◽  
Metal Films ◽  
Geometric Constraints ◽  
Film Stress ◽  
Diffusional Creep ◽  
Creep Model ◽  
Substrate Interface ◽  
Film Substrate

AbstractWhen confronted by severe geometric constraints, dislocations may respond in unforeseen ways. One example of such unexpected behavior is parallel glide in unpassivated, ultrathin (200 nm and thinner) metal films. This involves the glide of dislocations parallel to and very near the film/substrate interface, following their emission from grain boundaries. In situ transmission electron microscopy reveals that this mechanism dominates the thermomechanical behavior of ultrathin, unpassivated copper films. However, according to Schmid's law, the biaxial film stress that evolves during thermal cycling does not generate a resolved shear stress parallel to the film/substrate interface and therefore should not drive such motion. Instead, it is proposed that the observed dislocations are generated as a result of atomic diffusion into the grain boundaries. This provides experimental support for the constrained diffusional creep model of Gao et al.[1], in which they described the diffusional exchange of atoms between the unpassivated film surface and grain boundaries at high temperatures, a process that can locally relax the film stress near those boundaries. In the grains where it is observed, parallel glide can account for the plastic strain generated within a film during thermal cycling. One feature of this mechanism at the nanoscale is that, as grain size decreases, eventually a single dislocation suffices to mediate plasticity in an entire grain during thermal cycling. Parallel glide is a new example of the interactions between dislocations and the surface/interface, which are likely to increase in importance during the persistent miniaturization of thin film geometries.

Crack Density Evaluation in Carbon Fibre Reinforced Polymers Aged by Thermal Cycling

2016 ◽  
Vol 53 (3) ◽  
pp. 125-143
Author(s):  
S. González ◽  
M. González ◽  
J. Dominguez ◽  
F. Lasagni
Keyword(s):  
Carbon Fibre ◽  
Thermal Cycling ◽  
Crack Density ◽  
Reinforced Polymers ◽  
Carbon Fibre Reinforced Polymers ◽  
Density Evaluation

KUBOTA ALLOY KHR12C

Alloy Digest ◽  
1999 ◽  
Vol 48 (3) ◽  
Keyword(s):  
High Temperature ◽  
Physical Properties ◽  
Thermal Cycling ◽  
Tensile Properties ◽  
Casting Alloy ◽  
Type Ii ◽  
Temperature Performance

Abstract Kubota alloy KHR12C is an austenitic Fe-Cr-Ni-Nb casting alloy developed from the well known HH type II grade. This alloy is superior to other grades in components that are subjected to frequent thermal cycling and shock. The alloy is available in both centrifugal and static castings. This datasheet provides information on composition, physical properties, and tensile properties as well as creep. It also includes information on high temperature performance as well as casting and joining. Filing Code: SS-738. Producer or source: Kubota Metal Corporation.

Evaluation of the Resistance of Individual Si Die to Cracking

1998 ◽  
Author(s):  
R. Berriche ◽  
R.K. Lowry ◽  
M.I. Rosenfield
Keyword(s):  
Thermal Cycling ◽  
Hardness Test ◽  
Mechanical Stresses ◽  
Test Method ◽  
Processing Conditions ◽  
Micro Hardness ◽  
Test Methodology ◽  
Vickers Micro Hardness

Abstract The present work investigated the use of the Vickers micro-hardness test method to determine the resistance of individual die to cracking. The results are used as an indicator of resistance to failure under the thermal and mechanical stresses of packaging and subsequent thermal cycling. Indentation measurements on die back surfaces are used to determine how changes in wafer backside processing conditions affect cracks that form around impressions produced at different loads. Test methodology and results obtained at different processing conditions are discussed.

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