scholarly journals Micro Joining Package(Technical Topics)-Low Temperature Sintering Bonding Using Ag Nanoparticles and Ag2O Particles-

2011 ◽  
Vol 80 (8) ◽  
pp. 702-708 ◽  
Author(s):  
Akio HIROSE
Keyword(s):  
Low Temperature ◽  
Ag Nanoparticles ◽  
Low Temperature Sintering

Low Temperature Sintering Bonding Process Using Ag Nanoparticles Derived from Ag2O for Packaging of High-Temperature Electronics

2012 ◽  
Vol 706-709 ◽  
pp. 2962-2967 ◽  
Author(s):  
Akio Hirose ◽  
Naoya Takeda ◽  
Yosuke Konaka ◽  
Hiroaki Tatsumi ◽  
Yusuke Akada ◽  
...  
Keyword(s):  
Low Temperature ◽  
Ag Nanoparticles ◽  
Electronics Packaging ◽  
Bonding Process ◽  
Low Temperature Sintering ◽  
High Melting Point ◽  
Organic Nanoparticles ◽  
High Temperature Electronics ◽  
Low Temperature Bonding

A novel bonding process using Ag2O paste composed of Ag2O particles and a reducing agent has been proposed as a Pb-free alternative of high melting point solders in electronics packaging. Ag2O paste formed Ag nanoparticles through the redox reaction in the bonding process and in-situ formed Ag nanoparticles sintered immediately. While the bonding process using Ag metallo-organic nanoparticles, which have been proposed, was unfavorable to the bonding at 250 degree Celsius or lower in terms of requiring removal of stable organic shells, the bonding process using Ag2O paste demonstrated the possibility of further low-temperature bonding.

Thermal Behavior of Ag Micro/Nano Wires Formed by Low-Temperature Sintering of Ag Nanoparticles

2015 ◽  
Vol 44 (12) ◽  
pp. 4920-4927 ◽  
Author(s):  
Wen Wang ◽  
Yinghui Zhong ◽  
Dongxue Li ◽  
Pan Wang ◽  
Yuwei Cai ◽  
...  
Keyword(s):  
Low Temperature ◽  
Thermal Behavior ◽  
Ag Nanoparticles ◽  
Low Temperature Sintering ◽  
Nano Wires

Pressureless low-temperature sintering of plasma activated Ag nanoparticles for high-power device packaging

2019 ◽  
Vol 256 ◽  
pp. 126620 ◽  
Author(s):  
Hui Fang ◽  
Chenxi Wang ◽  
Te Wang ◽  
Hong Wang ◽  
Shicheng Zhou ◽  
...  
Keyword(s):  
Low Temperature ◽  
High Power ◽  
Ag Nanoparticles ◽  
Power Device ◽  
Low Temperature Sintering

Low temperature sintering of Ag nanoparticles for flexible electronics packaging

2010 ◽  
Vol 97 (15) ◽  
pp. 153117 ◽  
Author(s):  
A. Hu ◽  
J. Y. Guo ◽  
H. Alarifi ◽  
G. Patane ◽  
Y. Zhou ◽  
...  
Keyword(s):  
Low Temperature ◽  
Flexible Electronics ◽  
Ag Nanoparticles ◽  
Electronics Packaging ◽  
Low Temperature Sintering
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