Low temperature sintering of Ag nanoparticles for flexible electronics packaging

A novel bonding process using Ag2O paste composed of Ag2O particles and a reducing agent has been proposed as a Pb-free alternative of high melting point solders in electronics packaging. Ag2O paste formed Ag nanoparticles through the redox reaction in the bonding process and in-situ formed Ag nanoparticles sintered immediately. While the bonding process using Ag metallo-organic nanoparticles, which have been proposed, was unfavorable to the bonding at 250 degree Celsius or lower in terms of requiring removal of stable organic shells, the bonding process using Ag2O paste demonstrated the possibility of further low-temperature bonding.

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Low-temperature sintering of bimodal Ag nanoparticles for power electronics applications

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046511 ◽

2017 ◽

Author(s):

Yong Xiao ◽

Yong Cao ◽

Zhihao Zhang ◽

Ming Yang ◽

Shuai Wang ◽

...

Keyword(s):

Low Temperature ◽

Power Electronics ◽

Ag Nanoparticles ◽

Low Temperature Sintering

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Rapid pressureless low-temperature sintering of Ag nanoparticles for high-power density electronic packaging

Scripta Materialia ◽

10.1016/j.scriptamat.2013.08.031 ◽

2013 ◽

Vol 69 (11-12) ◽

pp. 789-792 ◽

Cited By ~ 89

Author(s):

Shuai Wang ◽

Mingyu Li ◽

Hongjun Ji ◽

Chunqing Wang

Keyword(s):

Low Temperature ◽

Power Density ◽

High Power ◽

Ag Nanoparticles ◽

Electronic Packaging ◽

Low Temperature Sintering ◽

High Power Density

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Micro Joining Package(Technical Topics)-Low Temperature Sintering Bonding Using Ag Nanoparticles and Ag2O Particles-

JOURNAL OF THE JAPAN WELDING SOCIETY ◽

10.2207/jjws.80.702 ◽

2011 ◽

Vol 80 (8) ◽

pp. 702-708 ◽

Cited By ~ 1

Author(s):

Akio HIROSE

Keyword(s):

Low Temperature ◽

Ag Nanoparticles ◽

Low Temperature Sintering

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Thermal Behavior of Ag Micro/Nano Wires Formed by Low-Temperature Sintering of Ag Nanoparticles

Journal of Electronic Materials ◽

10.1007/s11664-015-4086-9 ◽

2015 ◽

Vol 44 (12) ◽

pp. 4920-4927 ◽

Cited By ~ 9

Author(s):

Wen Wang ◽

Yinghui Zhong ◽

Dongxue Li ◽

Pan Wang ◽

Yuwei Cai ◽

...

Keyword(s):

Low Temperature ◽

Thermal Behavior ◽

Ag Nanoparticles ◽

Low Temperature Sintering ◽

Nano Wires

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Low-Temperature Sintering Bonding Using Silver Nanoparticle Paste for Electronics Packaging

Journal of Nanomaterials ◽

10.1155/2015/897142 ◽

2015 ◽

Vol 2015 ◽

pp. 1-7 ◽

Cited By ~ 16

Author(s):

Wei Guo ◽

Zhi Zeng ◽

Xiaoying Zhang ◽

Peng Peng ◽

Shanping Tang

Keyword(s):

Shear Strength ◽

Low Temperature ◽

Chemical Reduction ◽

Thermal Characteristics ◽

Electronics Packaging ◽

Low Temperature Sintering ◽

Ag Nps ◽

Scanning Calorimetry ◽

Joint Shear Strength ◽

Average Shear Strength

Ag nanoparticles (NPs) with about 40 nm diameter covered with 5–8 nm organic shell were prepared by chemical reduction reaction. The thermal characteristics of Ag nanoparticle (NP) paste were measured by thermogravimetric analysis (TGA) and differential scanning calorimetry (DSC). The low-temperature sintering bonding processes using Ag NP paste were carried out at the temperature range of 150–350°C for 5 min under the pressure of 3 MPa. The microstructures of the sintered joint and the fracture morphology were evaluated by scanning electron microscopy (SEM). The shear strength was used to evaluate the mechanical property of the sintered joint. TGA-DSC test showed that the Ag content is approximately 95.5 mass% in Ag NP paste. The average shear strength of the joint fabricated at 250°C for 5 min under the pressure of 3 MPa was about 28 MPa, which could meet the requirements of electronics packaging working at high temperature. The joint shear strength increased with the increase of the sintering temperature due to much denser sintered Ag NPs and more comprehensive metallurgical bonds formed in the joint.

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