Optimized Surface Roughening by Pulsed Waterjet for Suitable Adhesion Strength of Plasma Transferred Wire Arc Coating

This study utilized the high-pressure pulsed waterjet process and paired it with the plasma transferred wire arc technology to develop a novel technique to remanufacture damaged engine cylinder bores. The objective of this research was to eliminate the need for expensive bond-coats such as Ni-Al by optimizing the surface roughness profile of the substrate to provide acceptable mechanical bonding between the coating and the substrate. In this study, a high chrome stainless steel wire (Metcoloy #2) was plasma spray coated on a wide range of pulsed waterjet roughened surface profiles generated on grey cast iron and cast aluminum A380 alloy, the two most common engine materials. The pulsed waterjet greatly increased the adhesion strength between the substrates and the Metcoloy #2 coating. The increase in adhesion strength is a result of the formation of favorable mechanical anchoring points. Optimal pulsed waterjet parameters were determined to avoid the production of a copious roughness profile which resulted in a coating that mirrored the roughened surface profile. Additionally, if the roughness profile produced by the pulsed waterjet was insignificant the coating was removed in its entirety during detachment-based failure.

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Effect of Pulsed Waterjet Surface Preparation on the Adhesion Strength of Cold Gas Dynamic Sprayed Aluminum Coatings

Journal of Thermal Spray Technology ◽

10.1007/s11666-015-0261-z ◽

2015 ◽

Vol 24 (6) ◽

pp. 984-993 ◽

Cited By ~ 22

Author(s):

T. Samson ◽

D. MacDonald ◽

R. Fernández ◽

B. Jodoin

Keyword(s):

Adhesion Strength ◽

Surface Preparation ◽

Aluminum Coatings ◽

Gas Dynamic ◽

Pulsed Waterjet ◽

Cold Gas

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Observation of surface roughening on Cu(1, 1, 5)

Journal de Physique ◽

10.1051/jphys:019870048060101700 ◽

1987 ◽

Vol 48 (6) ◽

pp. 1017-1028 ◽

Cited By ~ 49

Author(s):

F. Fabre ◽

D. Gorse ◽

B. Salanon ◽

J. Lapujoulade

Keyword(s):

Surface Roughening

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The Correlation of Adhesion Strength with Barrier Structure in Cu Metallization

MRS Proceedings ◽

10.1557/proc-766-e.3.5 ◽

2003 ◽

Vol 766 ◽

Author(s):

A. Sekiguchi ◽

J. Koike ◽

K. Ueoka ◽

J. Ye ◽

H. Okamura ◽

...

Keyword(s):

Thin Films ◽

Adhesion Strength ◽

Nitrogen Concentration ◽

Scratch Test ◽

Barrier Structure ◽

Barrier Layers ◽

Cu Metallization ◽

Microstructure Observation ◽

Sputter Deposited ◽

Sulfur Containing

AbstractAdhesion strength in sputter-deposited Cu thin films on various types of barrier layers was investigated by scratch test. The barrier layers were Ta1-xNx with varied nitrogen concentration of 0, 0.2, 0.3, and 0.5. Microstructure observation by TEM indicated that each layer consists of mixed phases of β;-Ta, bcc-TaN0.1, hexagonal-TaN, and fcc-TaN, depending on the nitrogen concentration. A sulfur- containing amorphous phase was also present discontinuously at the Cu/barrier interfaces in all samples. Scratch test showed that delamination occurred at the Cu/barrier interface and that the overall adhesion strength increased with increasing the nitrogen concentration. A good correlation was found between the measured adhesion strength and the composing phases in the barrier layer.

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