Low-temperature direct bonding of silicon to quartz glass wafer via sequential wet chemical surface activation

2017 ◽  
Author(s):  
Chenxi Wang ◽  
Jikai Xu ◽  
Xiaorun Zeng ◽  
Yanhong Tian ◽  
Chunqing Wang ◽  
...  
Keyword(s):  
Low Temperature ◽  
Quartz Glass ◽  
Surface Activation ◽  
Glass Wafer ◽  
Chemical Surface ◽  
Wet Chemical

Low-temperature wafer direct bonding of silicon and quartz glass by a two-step wet chemical surface cleaning

2017 ◽  
Vol 57 (2S1) ◽  
pp. 02BD02 ◽  
Author(s):  
Chenxi Wang ◽  
Jikai Xu ◽  
Xiaorun Zeng ◽  
Yanhong Tian ◽  
Chunqing Wang ◽  
...  
Keyword(s):  
Low Temperature ◽  
Quartz Glass ◽  
Surface Cleaning ◽  
Chemical Surface ◽  
Wet Chemical ◽  
Wafer Direct Bonding

Low temperature direct bonding of silica glass via wet chemical surface activation

RSC Advances ◽  
2015 ◽  
Vol 5 (53) ◽  
pp. 42721-42727 ◽  
Author(s):  
Chengle Mai ◽  
Mingyu Li ◽  
Shihua Yang
Keyword(s):  
Low Temperature ◽  
Silica Glass ◽  
Rectangular Channel ◽  
Surface Activation ◽  
Chemical Surface ◽  
Glass Chip ◽  
Wet Chemical

A silica glass chip with a ∼200 μm rectangular channel was bonded through low temperature chemical surface activation direct bonding.

Silicon direct bonding via low-temperature wet chemical surface activation

RSC Advances ◽  
2016 ◽  
Vol 6 (43) ◽  
pp. 37079-37084 ◽  
Author(s):  
Chengle Mai ◽  
Jiayuan Sun ◽  
Hongtao Chen ◽  
Cheng-Kang Mai ◽  
Mingyu Li
Keyword(s):  
Low Temperature ◽  
Surface Activation ◽  
Chemical Surface ◽  
Wet Chemical

A p–n junction with excellent I–V characteristics was prepared through low-temperature chemical surface activation direct bonding without rigorous conditions.

Low Temperature Wafer Direct Bonding Using Wet Chemical Treatment

2012 ◽  
Vol 482-484 ◽  
pp. 2381-2384
Author(s):  
Yan Li Zhao ◽  
Zi Jun Song ◽  
Yan Li ◽  
Hai Sheng San ◽  
Yu Xi Yu
Keyword(s):  
Low Temperature ◽  
Tensile Test ◽  
Silicon Oxide ◽  
Process Condition ◽  
Experimental Results ◽  
Optimum Process ◽  
Infrared Transmission ◽  
Chemical Surface ◽  
Wet Chemical ◽  
Wafer Direct Bonding

In this paper, the low-temperature (less than or equal to 400 °C) silicon wafer direct bonding technology using wet chemical surface treatment is proposed. For bonded pairs of silicon-oxide-covered wafers, the optimum process condition is established with respect to the experimental results of two different wet chemical processing methods. The bonding quality is evaluated through infrared transmission test and tensile test. Experimental results indicate that the bonding strength of the additional 29% NH3•H2O treated samples is about 7.2 MPa, while it is no more than 3.1 MPa for the only piranha (H2SO4/H2O2) solution and RCA1 (NH3•H2O/H2O2/H2O) solution cleaned samples. Effect of the pulling speed on tensile test is also investigated. The results show that the pulling speed effect should be considered during the tensile test.

scholarly journals Plasma Enhanced Wet Chemical Surface Activation of TiO2 for the Synthesis of High Performance Photocatalytic Au/TiO2 Nanocomposites

2020 ◽  
Vol 10 (10) ◽  
pp. 3345
Author(s):  
Nguyen Thi Thu Thuy ◽  
Do Hoang Tung ◽  
Le Hong Manh ◽  
Joon Heon Kim ◽  
Sergey Ivanovich Kudryashov ◽  
...  
Keyword(s):  
High Performance ◽  
Surface Activation ◽  
Tio2 Surface ◽  
Electron Hole ◽  
Effective Surface ◽  
Methylene Blue Degradation ◽  
Chemical Surface ◽  
Wet Chemical ◽  
H2o2 Solution ◽  
Hole Recombination

To enhance the effectiveness of TiO2 as a photocatalyst, it was believed that the drawbacks of the large bandgap and the rapid electron-hole recombination can be overcome by coupling TiO2 with plasmonic metal nanoparticles. The incorporation of the nanoparticles onto the TiO2 surface requires a suitable procedure to achieve the proper particle adhesion. In this work, we propose a simple, clean, and effective surface activation of TiO2 using plasma enhanced wet chemical surface treatment. Under only 5 min of plasma treatment in a 3% NH3/3% H2O2 solution, gold nanoparticles were found better adhered onto the TiO2 surface. Hence, the methylene blue degradation rate of the Au/TiO2 under sunlight treated was improved by a factor of 3.25 times in comparison to non-treated Au/TiO2 and by 13 times in comparison to the bare rutile TiO2.

scholarly journals Effect of Adjusted Gas Nitriding Parameters on Microstructure and Wear Resistance of HVOF-Sprayed AISI 316L Coatings

Materials ◽  
2019 ◽  
Vol 12 (11) ◽  
pp. 1760 ◽  
Author(s):  
Pia Kutschmann ◽  
Thomas Lindner ◽  
Kristian Börner ◽  
Ulrich Reese ◽  
Thomas Lampke
Keyword(s):  
Wear Resistance ◽  
Low Temperature ◽  
Process Management ◽  
Surface Activation ◽  
Aisi 316L ◽  
Spray Coatings ◽  
Gas Nitriding ◽  
Surface Distance ◽  
Diffusion Depth ◽  
Sprayed Coating

Gas nitriding is known as a convenient process to improve the wear resistance of steel components. A precipitation-free hardening by low-temperature processes is established to retain the good corrosion resistance of stainless steel. In cases of thermal spray coatings, the interstitial solvation is achieved without an additional surface activation step. The open porosity permits the penetration of the donator media and leads to a structural diffusion. An inhomogeneous diffusion enrichment occurs at the single spray particle edges within the coating’s microstructure. A decreasing diffusion depth is found with increasing surface distance. The present study investigates an adjusted process management for low-temperature gas nitriding of high velocity oxy-fuel-sprayed AISI 316L coatings. To maintain a homogeneous diffusion depth within the coating, a pressure modulation during the process is studied. Additionally, the use of cracked gas as donator is examined. The process management is designed without an additional surface activation step. Regardless of surface distance, microstructural investigations reveal a homogeneous diffusion depth by a reduced processing time. The constant hardening depth allows a reliable prediction of the coatings’ properties. An enhanced hardness and improved wear resistance is found in comparison with the as-sprayed coating condition.

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