scholarly journals X-Ray Fractographic Study on Dynamic Fracture Surface and its Application to Failure Analysis.

1993 ◽  
Vol 42 (483) ◽  
pp. 1438-1444 ◽  
Author(s):  
Kazuyuki MATSUI ◽  
Osamu NAKADA ◽  
Akiyoshi CHADANI ◽  
Yukio HIROSE
Keyword(s):  
Fracture Surface ◽  
Failure Analysis ◽  
Dynamic Fracture ◽  
X Ray ◽  
Fractographic Study

X-ray fractographic study on fatigue fracture surface of structural steels.

1985 ◽  
Vol 51 (465) ◽  
pp. 1477-1482 ◽  
Author(s):  
Keiji OGURA ◽  
Yoshio MIYOSHI ◽  
Masahiro KAWAGUCHI ◽  
Masahiro KAYAMA
Keyword(s):  
Fracture Surface ◽  
Fatigue Fracture ◽  
Structural Steels ◽  
Fatigue Fracture Surface ◽  
X Ray ◽  
Fractographic Study

X-ray Fractographic Study on Alumina and Zirconia Ceramics

1990 ◽  
Vol 34 ◽  
pp. 719-727 ◽  
Author(s):  
Sumio Tanaka ◽  
Yukio Hirose ◽  
Keisuke Tanaka
Keyword(s):  
Fracture Toughness ◽  
Residual Stress ◽  
Fracture Surface ◽  
High Strength Steels ◽  
High Strength ◽  
Fatigue Tests ◽  
Fracture Mechanisms ◽  
Zirconia Ceramics ◽  
X Ray ◽  
Fractographic Study

The residual stress left on the fracture surface is one of the important parameters in X-ray fractographic study. It has been used to analyze fracture mechanisms in fracture toughness and fatigue tests especially of high strength steels.In this paper, X-ray fractography was applied to brittle fracture of alumina (Al2O3) and zirconia (ZΓO2) ceramics.

X-Ray Fractographic Study on Fracture Surface of New Light Metal

1995 ◽  
pp. 435-442
Author(s):  
Hideaki Matsuoka ◽  
Yukio Hirose ◽  
Shigenobu Takahashi ◽  
Zenjiro Yajima ◽  
Yoichi Kishi
Keyword(s):  
Fracture Surface ◽  
Light Metal ◽  
X Ray ◽  
Fractographic Study

X-Ray Fractographic Study on Impact Fracture Surface of Alumina Ceramics

1989 ◽  
pp. 920-925
Author(s):  
Tadao Mishima ◽  
Hiroshi Kawakami ◽  
Yukio Nanayama ◽  
Yukio Hirose ◽  
Keisuke Tanaka
Keyword(s):  
Fracture Surface ◽  
Impact Fracture ◽  
Alumina Ceramics ◽  
X Ray ◽  
Fractographic Study

Failure Analysis Methods in Electronics Assembly Technology

2008 ◽  
Vol 589 ◽  
pp. 349-354 ◽  
Author(s):  
Bálint Balogh ◽  
Péter Gordon ◽  
Róbert Kovács ◽  
Csaba Nagynémedi ◽  
Péter János Szabó ◽  
...  
Keyword(s):  
Fracture Surface ◽  
Failure Analysis ◽  
Room Temperature ◽  
Spectroscopy Analysis ◽  
Electronic Assembly ◽  
Electronics Assembly ◽  
X Ray ◽  
Analysis Methodology ◽  
Snpb Solder ◽  
Assembly Technology

The aim of this paper is to describe a failure analysis methodology applicable to reveal the root causes of electronic assembly failures. The most relevant properties of the applied techniques, i.e. optical microscopy, X-ray microstructure analysis, SEM (scanning electron microscopy) combined with EDX (energy dispersive X-ray spectroscopy) analysis, are given. Three recent failure analysis case studies are also presented. In case of a burnt component the microwire and the leadframe formed AlCu intermetallic compound in the length of several millimeters. The low joint strength of gullwing leads were deduced back to paste printing and wetting problems. The fracture surface morphology of a joint broken on the field showed different structure from the ones broken at room temperature. It was revealed that SnPb solder fracture surface is different at room temperature and above 100°C.

Failure Analysis of Killer Defects and Yield Enhancement of Flat ROM Devices in Wafer Fabrication

2000 ◽  
Author(s):  
Y. N. Hua ◽  
Z. R. Guo ◽  
L. H. An ◽  
Shailesh Redkar
Keyword(s):  
Electron Microscope ◽  
Failure Analysis ◽  
Fault Isolation ◽  
Yield Enhancement ◽  
Wafer Fabrication ◽  
X Ray ◽  
Particle Contamination ◽  
Emission Microscopy ◽  
Microscopy Techniques ◽  
Scanning Electron

Abstract In this paper, some low yield cases in Flat ROM device (0.45 and 0.6 µm) were investigated. To find killer defects and particle contamination, KLA, bitmap and emission microscopy techniques were used in fault isolation. Reactive ion etching (RIE) and chemical delayering, 155 Wright Etch, BN+ Etch and scanning electron microscope (SEM) were used for identification and inspection of defects. In addition, energy-dispersive X-ray microanalysis (EDX) was used to determine the composition of the particle or contamination. During failure analysis, seven kinds of killer defects and three killer particles were found in Flat ROM devices. The possible root causes, mechanisms and elimination solutions of these killer defects/particles were also discussed.

Reballing/Rebumping Ultra-Fine Pitch Packages Less Than 0.5 mm Pitch for FA

2014 ◽  
Author(s):  
Bob Wettermann
Keyword(s):  
Solder Joint ◽  
Failure Analysis ◽  
Joint Strength ◽  
Semiconductor Devices ◽  
X Ray ◽  
Fine Pitch ◽  
Manual Methods

Abstract As the pitch and package sizes of semiconductor devices have shrunk and their complexity has increased, the manual methods by which the packages can be re-bumped or reballed for failure analysis have not kept up with this miniaturization. There are some changes in the types of reballing preforms used in these manual methods along with solder excavation techniques required for packages with pitches as fine as 0.3mm. This paper will describe the shortcomings of the previous methods, explain the newer methods and materials and demonstrate their robustness through yield, mechanical solder joint strength and x-ray analysis.

Sign in / Sign up

Export Citation Format

Share Document