scholarly journals Diffusion Kinetics in Explosive Cladding of Dissimilar Alloys as Described through the Miedema Model/ Kinetyka Procesu Dyfuzji W Układach Platerów Wytwarzanych Z Wykorzystaniem Energii Wybuchu, Na Bazie Stopów O Silnie Odmiennych Właściwościach, Opisanych Modelem Miedema

2014 ◽  
Vol 59 (4) ◽  
pp. 1615-1618 ◽  
Author(s):  
S. Saravanan ◽  
K. Raghukandan
Keyword(s):  
Miedema Model ◽  
Diffusion Kinetics ◽  
Interface Morphology ◽  
Inter Metallic Compound ◽  
Compound Formation ◽  
High Pressure And Temperature ◽  
Explosive Cladding ◽  
Dissimilar Alloys ◽  
Loading Ratio ◽  
Ss 304

Abstract Explosive cladding of dissimilar plates is achieved by the intensive deformation occurring at high pressure and temperature generated from the detonating explosive at the collision interface. The interface morphology, with its characteristic undulations, is dictated by the extent of kinetic energy spent at the mating interface. Nevertheless, the inter-metallic compound formation at the mating interface weakens the joint. The prediction of the probability of inter-metallic formation at aluminum-SS 304, copper-SS 304 and titanium-SS 304 explosive cladding interfaces is attempted in this study by employing Miedema model. Granular explosives (detonation velocity: 4000 m/s) and parallel plate combination were employed with uni-loading ratio (standoff distance-5 mm). The influence of chemical energy in determining the bond strength of explosive clads is discussed as well.

EXPLOSIVE CLADDING OF ALUMINIUM 5052-STAINLESS STEEL 304

2019 ◽  
Vol 14 (3) ◽  
Author(s):  
Saravanan S ◽  
Murugan G
Keyword(s):  
Stainless Steel ◽  
Interfacial Microstructure ◽  
Bend Angle ◽  
Flyer Plate ◽  
Layer Formation ◽  
Molten Layer ◽  
Explosive Cladding ◽  
Plate Velocity ◽  
Stainless Steel 304 ◽  
Loading Ratio

This study addresses the effect of process parameters viz., loading ratio (mass of explosive/mass of flyer plate) and preset angle on dynamic bend angle, collision velocity and flyer plate velocity in dissimilar explosive cladding. In addition, the variation in interfacial microstructure and mechanical strength of aluminium 5052-stainless steel 304 explosive clads is reported. The interface exhibits a characteristic undulating interface with a continuous molten layer formation. The interfacial amplitude increases with the loading ratio and preset angle. Maximum hardness is observed at regions closer to the interface

Metallurgical and Mechanical Properties of Wire-Mesh Reinforced Dissimilar Explosive Cladding

2018 ◽  
Vol 910 ◽  
pp. 14-18
Author(s):  
Somasundaram Saravanan ◽  
Krishnamorthy Raghukandan
Keyword(s):  
Mechanical Properties ◽  
Steel Wire ◽  
Wire Mesh ◽  
Interfacial Wave ◽  
Explosive Cladding ◽  
Stainless Steel Wire Mesh ◽  
Loading Ratio ◽  
Steel Wire Mesh ◽  
Wavy Topography ◽  
Better Than

Explosive cladding employs a controlled chemical explosive detonation to craft a metallurgical bond between similar and dissimilar metals. Aluminum 5052-copper and aluminum 5052-aluminum 1100 plates are explosively cladded with a stainless steel wire-mesh, having 900 orientation between them, at varied loading ratios (mass of explosive/mass of flyer plate). Microstructural, corrosion and mechanical properties of the clad were evaluated as per relevant standards and the results are presented. The dissimilar wire-mesh interlayered explosive clad reveal wavy topography, with the interfacial wave amplitude and wavelength proportional to loading ratio, R. The mechanical behavior of wire-mesh reinforced clad is better than weaker aluminum parent plate.

A Study of the Weld Zones on Explosive Cladded Titan12/Ss 304 L Plates

2007 ◽  
Vol 566 ◽  
pp. 285-290 ◽  
Author(s):  
Krishnamorthy Raghukandan ◽  
P. Tamilchelvan ◽  
N. Meikandan
Keyword(s):  
Stainless Steel ◽  
Kinetic Energy ◽  
Explosive Welding ◽  
Solid Phase ◽  
X Ray Diffraction ◽  
Explosive Cladding ◽  
X Ray ◽  
Weldability Window ◽  
Ss 304 ◽  
Bonding Technique

Explosive cladding is a non-conventional, solid-phase bonding technique in which bonding between two plates is produced by their high velocity collision induced by the use of explosives. Attempts were made to explosive clad Titanium-Stainless steel (SS 304 L) plates (3.5 and 3.0 mm thick respectively). The experiments were designed to analyze the bonding interface parallel to the detonation direction. The presence of intermetallics, caused by the melting at the interface due to kinetic energy dissipation, was observed in some locations. The process parameters of the explosive welding of Titanium-Stainless steel combination are defined using the microstructural observations, microhardness at the interface, the results of X-ray diffraction study. A weldability window is also constructed for explosive welding of Ti /Ss.

Effect on Explosive Cladding of TITAN 12/SS 304 L Plates under Multiple Conditions (Design Matrix)

2004 ◽  
Vol 465-466 ◽  
pp. 207-212 ◽  
Author(s):  
P. Tamilchelvan ◽  
Krishnamorthy Raghukandan ◽  
Kazuyuki Hokamoto ◽  
H.C. Dey ◽  
A.K. Bhaduri
Keyword(s):  
Design Matrix ◽  
Explosive Cladding ◽  
Ss 304 ◽  
Multiple Conditions

Two-dimensional inter-metallic compound formation: Yb-Ni/Mo(110)

1989 ◽  
Vol 1 (SB) ◽  
pp. SB271-SB272 ◽  
Author(s):  
O Bjorneholm ◽  
J N Andersen ◽  
M Christiansen ◽  
A Nilsson ◽  
C Wigren ◽  
...  
Keyword(s):  
Two Dimensional ◽  
Inter Metallic Compound ◽  
Compound Formation ◽  
Metallic Compound

An Electron Microscope Study of Interdiffusion and Compound Formation in Ta-Au Thin Films

1973 ◽  
Vol 31 ◽  
pp. 32-33 ◽  
Author(s):  
T. C. Tisone ◽  
S. Lau
Keyword(s):  
Electron Microscope ◽  
Electron Microscope Study ◽  
Thermally Grown Oxide ◽  
Ion Milling ◽  
Compound Formation ◽  
Technology Application ◽  
Transmission Electron ◽  
Before And After ◽  
Au Thin Films

In a study of the properties of a Ta-Au metallization system for thin film technology application, the interdiffusion between Ta(bcc)-Au, βTa-Au and Ta2M-Au films was studied. Considered here is a discussion of the use of the transmission electron microscope(TEM) in the identification of phases formed and characterization of the film microstructures before and after annealing.The films were deposited by sputtering onto silicon wafers with 5000 Å of thermally grown oxide. The film thicknesses were 2000 Å of Ta and 2000 Å of Au. Samples for TEM observation were prepared by ultrasonically cutting 3mm disks from the wafers. The disks were first chemically etched from the silicon side using a HNO3 :HF(19:5) solution followed by ion milling to perforation of the Au side.

Interface morphology of thermal oxide grown on polycrystalline silicon by different processes

1992 ◽  
Vol 50 (2) ◽  
pp. 1396-1397
Author(s):  
H. Yen ◽  
E. P. Kvam ◽  
R. Bashir ◽  
S. Venkatesan ◽  
G. W. Neudeck
Keyword(s):  
Integrated Circuits ◽  
Polycrystalline Silicon ◽  
Silicon Films ◽  
Interface Morphology ◽  
Oxide Interface ◽  
Poly Silicon ◽  
Thermal Oxide ◽  
Grain Orientations ◽  
Polycrystalline Silicon Films ◽  
P Type

Polycrystalline silicon, when highly doped, is commonly used in microelectronics applications such as gates and interconnects. The packing density of integrated circuits can be enhanced by fabricating multilevel polycrystalline silicon films separated by insulating SiO2 layers. It has been found that device performance and electrical properties are strongly affected by the interface morphology between polycrystalline silicon and SiO2. As a thermal oxide layer is grown, the poly silicon is consumed, and there is a volume expansion of the oxide relative to the atomic silicon. Roughness at the poly silicon/thermal oxide interface can be severely deleterious due to stresses induced by the volume change during oxidation. Further, grain orientations and grain boundaries may alter oxidation kinetics, which will also affect roughness, and thus stress.Three groups of polycrystalline silicon films were deposited by LPCVD after growing thermal oxide on p-type wafers. The films were doped with phosphorus or arsenic by three different methods.

DIFFUSION KINETICS IN GOLD-AMORPHOUS GeTe4THIN FILMS

1981 ◽  
Vol 42 (C4) ◽  
pp. C4-975-C4-978 ◽  
Author(s):  
J. M. Mackowski ◽  
M. Bendali ◽  
P. Normandon ◽  
P. Kumurdjian
Keyword(s):  
Diffusion Kinetics
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