A Study on Inter-Metallic Compound Formation and Structure of Lead Free SnAgCu Solder System

2006 ◽  
Author(s):  
I. Ahmad ◽  
Hoh Huey Jiun ◽  
Eu Poh Leng ◽  
B.Y. Majlis ◽  
A. Jalar ◽  
...  
Keyword(s):  
Lead Free ◽  
Inter Metallic Compound ◽  
Compound Formation ◽  
Snagcu Solder ◽  
Metallic Compound

Two-dimensional inter-metallic compound formation: Yb-Ni/Mo(110)

1989 ◽  
Vol 1 (SB) ◽  
pp. SB271-SB272 ◽  
Author(s):  
O Bjorneholm ◽  
J N Andersen ◽  
M Christiansen ◽  
A Nilsson ◽  
C Wigren ◽  
...  
Keyword(s):  
Two Dimensional ◽  
Inter Metallic Compound ◽  
Compound Formation ◽  
Metallic Compound

A Comparative Study of Soldering Temperatures and Materials on the Reliability of Photovoltaic Modules

2012 ◽  
Vol 562-564 ◽  
pp. 188-191
Author(s):  
Keh Moh Lin ◽  
Yang Hsien Lee ◽  
Wen Yeong Huang ◽  
Po Chun Hsu ◽  
Chin Yang Huang ◽  
...  
Keyword(s):  
Comparative Study ◽  
Lead Free ◽  
Automatic Process ◽  
Lead Free Solder ◽  
Snagcu Solder ◽  
Photovoltaic Modules ◽  
Soldering Process ◽  
Different Temperatures ◽  
Free Solder

To find out the important factors which decisively affect the soldering quality of photovoltaic modules, solar cells were soldered under different conditions (different temperatures, PbSn vs. SnAgCu solder, manual vs. semi-automatic). Experimental results show that the soldering quality of PbSn under 350°C in the semi-automatic soldering process was quite stable while the soldering quality of lead-free solder was generally unacceptable in the manual or semi-automatic process under different temperatures. This result indicates that the soldering process with lead-free solder still needs to be further improved. It was also found that most cracks were formed on the interface between the solder and the silver paste and then expanded outwards.

Development of Lead-Free Flip Chip Package and Its Reliability

2003 ◽  
Author(s):  
Jeffrey C. B. Lee ◽  
Sting Wu ◽  
H. L. Chou ◽  
Yi-Shao Lai
Keyword(s):  
Failure Mode ◽  
Flip Chip ◽  
Failure Modes ◽  
Solder Bump ◽  
Wire Bonding ◽  
Point Of View ◽  
Lead Free ◽  
Temperature Cycle ◽  
Snagcu Solder ◽  
Temperature Cycle Test

SnAgCu solder used in laminate package like PBGA and CSP BGA to replace eutectic SnPb as interconnection has become major trend in the electronic industry. But unlike well-known failure mode of wire bonding package, flip chip package with SnAgCu inner solder bump and external solder ball as electrical interconnection present a extremely different failure mode with wire-bonding package from a point of view in material and process. In this study, one 16mm×16mm 3000 I/O SnAgCu wafer bumping using screen-printing process was explored including the effects of reflow times, high temperature storage life (HTSL) and temperature cycle test (TCT) on bump shear strength. Furthermore, the qualified wafer bumping is assembled by flip chip assembly with various underfill material and specific organic build-up substrate, then is subject to MSL4/260°C precondition and temperature cycle test to observe the underfill effect on SnAgCu bump protection and solder joint life. Various failure modes in the flip chip package like solder bump, underfill and UBM and so on, will be scrutinized with SEM. And finally, best material combination will be addressed to make the lead free flip package successful.

INDENTATION SIZE EFFECT ON THE CREEP BEHAVIOR OF A SnAgCu SOLDER

2010 ◽  
Vol 24 (01n02) ◽  
pp. 267-275 ◽  
Author(s):  
Y. D. HAN ◽  
H. Y. JING ◽  
S. M. L. NAI ◽  
L. Y. XU ◽  
C. M. TAN ◽  
...  
Keyword(s):  
Creep Rate ◽  
Strain Rate ◽  
Creep Strain ◽  
Creep Behavior ◽  
Maximum Load ◽  
Creep Strain Rate ◽  
Lead Free ◽  
Lead Free Solder ◽  
Snagcu Solder ◽  
Free Solder

In the present study, nanoindentation studies of the 95.8 Sn -3.5 Ag -0.7 Cu lead-free solder were conducted over a range of maximum loads from 20 mN to 100 mN, under a constant ramp rate of 0.05 s-1. The indentation scale dependence of creep behavior was investigated. The results revealed that the creep rate, creep strain rate and indentation stress are all dependent on the indentation depth. As the maximum load increased, an increasing trend in the creep rate was observed, while a decreasing trend in creep strain rate and indentation stress were observed. On the contrary, for the case of stress exponent value, no trend was observed and the values were found to range from 6.16 to 7.38. Furthermore, the experimental results also showed that the creep mechanism of the lead-free solder is dominated by dislocation climb.

An Investigation of the Lead-Free Surface Mount Soldering Process: Solder Joint Evaluation and Process Optimisation

2004 ◽  
Author(s):  
Claire Ryan ◽  
Jeff M. Punch ◽  
Bryan Rodgers ◽  
Greg Heaslip ◽  
Shane O’Neill ◽  
...  
Keyword(s):  
Screen Printing ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Paste ◽  
Surface Mount ◽  
Snagcu Solder ◽  
Soldering Process ◽  
Free Process ◽  
Free Solder

A European Union ban on lead in most electrical and electronic equipment will be imposed as of July 1st 2006. The ban, along with market pressures, means that manufacturers must transfer from a tin-lead soldering process to a lead-free process. In this paper the implications on the surface mount (SMT) soldering process are presented. A set of experiments was conducted to investigate the screen-printing and reflow steps of the SMT process using a tin-silver-copper (95.5Sn3.8Ag0.7Cu) solder and a baseline of standard tin-lead (63Sn37Pb). 10×10 arrays of micro Ball Grid Array (micro-BGA) components mounted on 8-layer FR4 printed wiring boards (PWBs) were used. The screen-printing experiment addressed the deposition of the solder paste on the board. The parameters used in the investigation were print speed, squeegee pressure, snap-off distance, separation speed and cleaning interval, with the responses being measurements of paste height and volume. Optimum screen-printer settings were determined which give adequate paste volume and height and a good print definition. The reflow experiment investigated the following parameters of the temperature profile: preheat, soak, peak and cool down temperatures, and conveyor speed. The resulting solder joints were evaluated using cross-section analysis and x-ray techniques in order to determine the presence of defects. A mechanical fatigue test was also carried out in order to compare the strength of the solder joints. The overall quality of the lead-free solder joints was determined from these tests and compared to that of tin-lead. The outcome is a set of manufacturing guidelines for transferring to lead-free solder including optimum screen-printer and reflow oven settings for use with an SnAgCu solder.

Experimental and Numerical Evaluation of SnAgCu and SnPb Solders Using a MicroBGA Under Accelerated Temperature Cycling Conditions

2004 ◽  
Author(s):  
Bryan Rodgers ◽  
Jeff Punch ◽  
Claire Ryan ◽  
Finbarr Waldron ◽  
Liam Floyd
Keyword(s):  
Fatigue Life ◽  
Large Scale ◽  
Temperature Cycling ◽  
Lead Free ◽  
Model Parameters ◽  
Lead Free Solder ◽  
Element Analysis ◽  
Snagcu Solder ◽  
Numerical Predictions ◽  
Free Solder

A comparative evaluation of the leading lead-free solder candidate (95.5Sn3.8Ag0.7Cu) and traditional tin-lead solder (63Sn37Pb) under thermal cycling conditions was carried out. A test vehicle consisting of four daisy chained 10×10 array 0.8mm pitch plastic micro ball grid arrays (microBGA) mounted on an 8-layer FR4 printed wiring board was designed. The board finish was organic solder preservative (OSP) for the lead-free devices and hot air solder levelled (HASL) in the case of the eutectic devices. An event detector was used to monitor the continuity of each daisy chain during accelerated temperature cycling, where the test vehicles were cycled with a ramp rate of approximately 3°C per minute from −40°C to 125°C, with 10-minute dwells and a total cycle time of 2 hours 10 minutes. Results to date plotted using a Weibull distribution indicate that the SnAgCu solder is more reliable under these conditions. Experiments were also carried out on large-scale lead-free solder specimens to determine the parameters required for the Anand viscoplasticity model. The Anand model was then implemented in finite element analysis using ANSYS®, where the submodelling technique was employed to determine the viscoplastic work per thermal cycle for each solder joint along the package diagonal. Schubert’s fatigue life model was used to predict the number of cycles to failure of each joint, although it should be noted that the necessary model parameters for the may need to be calibrated. Results indicate that the joint under the die edge is likely to fail first and that the SnAgCu solder is more fatigue resistant. The numerical predictions underestimate the fatigue life in both cases.

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