Accurate and Precise Surface Temperature Measurements Up to 1500°C Using Thin Film Thermocouple Sensors

2021 ◽  
Author(s):  
Siqing Liu ◽  
Franklin L. Duan ◽  
Zhonglin Ji ◽  
Ziyi Xie ◽  
Zhiliang Hong ◽  
...  
Author(s):  
Hongseok Choi ◽  
Xiaochun Li

Laser-material interactions involved in laser micromachining are extremely complicated. In order to improve the fundamental understanding of the laser micromachining process, it is essential to investigate the complex phenomena and mechanisms of the physical processes within and close to the region of the interaction. Topographical characterizations of laser micromachining with various laser energy fluences were undertaken to correlate the resulting geometry changes with surface temperature measurements. Single pulses of laser beam with a nominal diameter of 47 μm were used. Possible changes of surface chemical composition induced by the laser micromachining process, in particular oxide formation, were also investigated around the laser spot. Moreover, C-type micro thin film thermocouples (TFTCs) with a junction size of 2 μm × 2 μm were fabricated to increase the maximum operation temperature and spatial resolution of temperature measurements. Surface temperature distribution around the laser spot was obtained in the range from 45 μm to 85 μm away from the center of laser spot. The result showed that there was a steep gradient of temperature in the radial direction and a superheated area around laser spot. It was also observed that the temperature profile matched the oxidation profile due to thermal effects.


Sensors ◽  
2018 ◽  
Vol 18 (4) ◽  
pp. 958 ◽  
Author(s):  
Yantao Liu ◽  
Wei Ren ◽  
Peng Shi ◽  
Dan Liu ◽  
Yijun Zhang ◽  
...  

1997 ◽  
Vol 503 ◽  
Author(s):  
Yongxia Zhang ◽  
Yanwei Zhang ◽  
Juliana Blaser ◽  
T. S. Sriiram ◽  
R. B. Marcus

ABSTRACTA thermal microprobe has been designed and built for high resolution temperature sensing. The thermal sensor is a thin-film thermocouple junction at the tip of an Atomic Force Microprobe (AFM) silicon probe needle. Only wafer-stage processing steps are used for the fabrication. The thermal response over the range 25–s 4.5–rovolts per degree C and is linear.


2015 ◽  
Vol 11 (2) ◽  
pp. 3017-3022
Author(s):  
Gurban Akhmedov

Results of researches show, that film p-n the structures received by a method of discrete thermal evaporation in a uniform work cycle, are suitable for use in low-voltage devices.  As a result of work are received p-n heterojunctions in thin-film execution, described by high values of differential resistance. Show that, thermo endurance - T0 maybe using as characteristic of thermo endurance of optic materials. If heating flow, destruction temperature and internal surface temperature is measured during test, it is possible to determine value T0 and other necessity characteristics. As a result of the taking test was lead to comparison evaluation of considered materials. Working range of heating flow and up level heating embark have been determined.


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