Contemporary COBOL: Developers' perspectives on Defects and Defect Location

2006 ◽

Author(s):

Ray Talacka ◽

Nandu Tendolkar ◽

Cynthia Paquette

Keyword(s):

High Performance ◽

Yield Enhancement ◽

Test Time ◽

Balance Test ◽

Specific Test ◽

Defect Location ◽

Test Methodology ◽

Memory Arrays ◽

Scan Chain ◽

Scan Pattern

Abstract The use of memory arrays to drive yield enhancement has driven the development of many technologies. The uniformity of the arrays allows for easy testing and defect location. Unfortunately, the complexities of the logic circuitry are not represented well in the memory arrays. As technologies push to smaller geometries and the layout and timing of the logic circuitry become more problematic the ability to address yield issue is becoming critical. This paper presents the added yield enhancement capabilities of using e600 core Scan Chain and Scan Pattern testing for logic debug, ways to interpret the fail data, and test methodologies to balance test time and acquiring data. Selecting a specific test methodology and using today's advanced tools like Freescale's DFT/FA has been proven to find more yield issues, earlier, enabling quicker issue resolution.

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Topside Defect Localization Using OBIRCH Analysis

ISTFA 2005: Conference Proceedings from the 31st International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2005p0095 ◽

2005 ◽

Author(s):

Clifford Howard ◽

Anusha Weerakoon ◽

Diana M. Mitro ◽

Dawn Glaeser

Keyword(s):

Functional Analysis ◽

Defect Location ◽

Analysis Tools ◽

Defect Localization ◽

Tools And Techniques

Abstract OBIRCH analysis is a useful technique for defect localization not only for parametric failures, but also for functional analysis. However, OBIRCH results do not always identify the exact defect location. OBIRCH analysis results must be used in conjunction with other analysis tools and techniques to successfully identify defect locations.

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Magnetic Current Imaging Power Short Localization

ISTFA 2015: Conference Proceedings from the 41st International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2015p0222 ◽

2015 ◽

Author(s):

J. Gaudestad ◽

F. Rusli ◽

A. Orozco ◽

M.C. Pun

Keyword(s):

Thermal Imaging ◽

Flip Chip ◽

Optical Microscope ◽

Fault Isolation ◽

Magnetic Current ◽

Multiple Fault ◽

Defect Location ◽

Isolation Techniques ◽

Chip Sample

Abstract A Flip Chip sample failed short between power and ground. The reference unit had 418Ω and the failed unit with the short had 16.4Ω. Multiple fault isolation techniques were used in an attempt to find the failure with thermal imaging and Magnetic Current Imaging being the only techniques capable of localizing the defect. To physically verify the defect location, the die was detached from the substrate and a die cracked was seen using a visible optical microscope.

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An automatic welding defect location algorithm based on deep learning

NDT & E International ◽

10.1016/j.ndteint.2021.102435 ◽

2021 ◽

Vol 120 ◽

pp. 102435

Author(s):

Lei Yang ◽

Huaixin Wang ◽

Benyan Huo ◽

Fangyuan Li ◽

Yanhong Liu

Keyword(s):

Deep Learning ◽

Automatic Welding ◽

Defect Location ◽

Location Algorithm ◽

Welding Defect

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Influence of a Delamination Defect Location on the Operating Life of a Multi-Layered Composite Sample

IOP Conference Series Materials Science and Engineering ◽

10.1088/1757-899x/731/1/012011 ◽

2020 ◽

Vol 731 ◽

pp. 012011

Author(s):

A N Anoshkin ◽

P V Pisarev ◽

D A Ermakov

Keyword(s):

Layered Composite ◽

Composite Sample ◽

Operating Life ◽

Defect Location

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Field Demonstration of Electro-Scan Defect Location Technology for Condition Assessment of Wastewater Collection Systems

Proceedings of the Water Environment Federation ◽

10.2175/193864711802837309 ◽

2011 ◽

Vol 2011 (5) ◽

pp. 265-281 ◽

Cited By ~ 1

Author(s):

Mary Ellen Tuccillo ◽

Charles Wilmut ◽

Christopher Feeney ◽

Kathy Martel ◽

Ariamalar Selvakumar

Keyword(s):

Condition Assessment ◽

Defect Location ◽

Wastewater Collection

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Means of Delivery of Healant to the Defect Location

Self-Healing Materials ◽

10.1016/b978-1-927885-23-9.50009-2 ◽

2017 ◽

pp. 69-77

Author(s):

George Wypych

Keyword(s):

Defect Location

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A Novel Defect Location Method for Plate-Like Structure by Using Forward-Scattering Wave and Fuzzy C-Means Clustering

Volume 5: High-Pressure Technology; ASME Nondestructive Evaluation, Diagnosis and Prognosis Division (NDPD); SPC Track for Senate ◽

10.1115/pvp2017-66236 ◽

2017 ◽

Author(s):

Shaojie Chen ◽

Shaoping Zhou ◽

Yong Li ◽

Lanzhu Zhang

Keyword(s):

Effective Means ◽

Parallel Line ◽

Forward Scattering ◽

Guided Wave ◽

Location Method ◽

Operational Conditions ◽

Fuzzy C Means ◽

Defect Location ◽

Scattering Wave ◽

Fuzzy C Means Clustering

Ultrasonic guided wave technology combined with sparse transducer array provides an efficient and relatively cost-effective means of defect detection and monitoring for rapid interrogation of large in plate-like structures. However, imaging algorithm used baseline subtraction methods may be compromised under mismatched environment and operational conditions. A defect location method based on forward-scattering wave and fuzzy c-means clustering is proposed in this paper. The distance coefficient including location information between sensor pair using exciting and receiving signal and defect is defined to explain feasibility of the method proposed in this paper. A Parallel line array is evaluated using the method to locate defect. Experimental results show that the proposed method can effectively reduce the influence of mismatched environment and operational conditions on the defect location.

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