scholarly journals Contemporary COBOL: Developers' Perspectives on Defects and Defect Location

Author(s):  
Agnieszka Ciborowska ◽  
Aleksandar Chakarov ◽  
Rahul Pandita
Keyword(s):  
Author(s):  
Ray Talacka ◽  
Nandu Tendolkar ◽  
Cynthia Paquette

Abstract The use of memory arrays to drive yield enhancement has driven the development of many technologies. The uniformity of the arrays allows for easy testing and defect location. Unfortunately, the complexities of the logic circuitry are not represented well in the memory arrays. As technologies push to smaller geometries and the layout and timing of the logic circuitry become more problematic the ability to address yield issue is becoming critical. This paper presents the added yield enhancement capabilities of using e600 core Scan Chain and Scan Pattern testing for logic debug, ways to interpret the fail data, and test methodologies to balance test time and acquiring data. Selecting a specific test methodology and using today's advanced tools like Freescale's DFT/FA has been proven to find more yield issues, earlier, enabling quicker issue resolution.


Author(s):  
Clifford Howard ◽  
Anusha Weerakoon ◽  
Diana M. Mitro ◽  
Dawn Glaeser

Abstract OBIRCH analysis is a useful technique for defect localization not only for parametric failures, but also for functional analysis. However, OBIRCH results do not always identify the exact defect location. OBIRCH analysis results must be used in conjunction with other analysis tools and techniques to successfully identify defect locations.


Author(s):  
J. Gaudestad ◽  
F. Rusli ◽  
A. Orozco ◽  
M.C. Pun

Abstract A Flip Chip sample failed short between power and ground. The reference unit had 418Ω and the failed unit with the short had 16.4Ω. Multiple fault isolation techniques were used in an attempt to find the failure with thermal imaging and Magnetic Current Imaging being the only techniques capable of localizing the defect. To physically verify the defect location, the die was detached from the substrate and a die cracked was seen using a visible optical microscope.


2021 ◽  
Vol 120 ◽  
pp. 102435
Author(s):  
Lei Yang ◽  
Huaixin Wang ◽  
Benyan Huo ◽  
Fangyuan Li ◽  
Yanhong Liu

2011 ◽  
Vol 2011 (5) ◽  
pp. 265-281 ◽  
Author(s):  
Mary Ellen Tuccillo ◽  
Charles Wilmut ◽  
Christopher Feeney ◽  
Kathy Martel ◽  
Ariamalar Selvakumar

Author(s):  
Shaojie Chen ◽  
Shaoping Zhou ◽  
Yong Li ◽  
Lanzhu Zhang

Ultrasonic guided wave technology combined with sparse transducer array provides an efficient and relatively cost-effective means of defect detection and monitoring for rapid interrogation of large in plate-like structures. However, imaging algorithm used baseline subtraction methods may be compromised under mismatched environment and operational conditions. A defect location method based on forward-scattering wave and fuzzy c-means clustering is proposed in this paper. The distance coefficient including location information between sensor pair using exciting and receiving signal and defect is defined to explain feasibility of the method proposed in this paper. A Parallel line array is evaluated using the method to locate defect. Experimental results show that the proposed method can effectively reduce the influence of mismatched environment and operational conditions on the defect location.


Author(s):  
Bin Feng ◽  
Lin Zhang ◽  
Shuai Hou ◽  
Xiaojing Dang ◽  
Wenbo Zhu ◽  
...  

2019 ◽  
Vol 9 (6) ◽  
pp. 1107 ◽  
Author(s):  
Bo Xing ◽  
Zujun Yu ◽  
Xining Xu ◽  
Liqiang Zhu ◽  
Hongmei Shi

This paper proposes a rail defect location method based on a single mode extraction algorithm (SMEA) of ultrasonic guided waves. Simulation analysis and verification were conducted. The dispersion curves of a CHN60 rail were obtained using the semi-analytical finite element method, and the modal data of the guided waves were determined. According to the inverse transformation of the excitation response algorithm, modal identification under low-frequency and high-frequency excitation was realized, and the vibration displacements at other positions of a rail were successfully predicted. Furthermore, an SMEA for guided waves is proposed, through which the single extraction results of four modes were successfully obtained when the rail was excited along different excitation directions at a frequency of 200 Hz. In addition, the SMEA was applied to defect location detection, and the single reflection mode waveform of the defect was extracted. Based on the group velocity of the mode and its propagation time, the distance between the defect and the excitation point was measured, and the defect location was predicted as a result. Moreover, the SMEA was applied to locate the railhead defect. The detection mode, the frequency, and the excitation method Were selected through the dispersion curves and modal identification results, and a series of signals of the sampling nodes were obtained using the three-dimensional finite element software ANSYS. The distance between the defect and the excitation point was calculated using the SMEA result. When compared with the structure of the simulated model, the errors obtained were all less than 0.5 m, proving the efficacy of this method in precisely locating rail defects, thus providing an innovated solution for rail defect location.


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