scholarly journals Influence of Solute Content on Grain Size in Binary Cu Alloys

2017 ◽  
Author(s):  
Andreas Cziegler ◽  
Peter Schumacher
Keyword(s):  
Grain Size ◽  
Solute Content ◽  
Cu Alloys

Grain Growth in Nanocrystalline Nickel

1999 ◽  
Vol 580 ◽  
Author(s):  
G.D. Hibbard ◽  
U. Erb ◽  
K.T. Aust ◽  
G. Palumbo
Keyword(s):  
Thermal Stability ◽  
Grain Size ◽  
Grain Growth ◽  
Size Distributions ◽  
Nanocrystalline Nickel ◽  
Scanning Calorimetry ◽  
Solute Content ◽  
Grain Size Distributions ◽  
Thermal Stability Of ◽  
Total Solute Content

AbstractIn this study, the effect of grain size distribution on the thermal stability of electrodeposited nanocrystalline nickel was investigated by pre-annealing material such that a limited amount of abnormal grain growth was introduced. This work was done in an effort to understand the previously reported, unexpected effect, of increasing thermal stability with decreasing grain size seen in some nanocrystalline systems. Pre-annealing produced a range of grain size distributions in materials with relatively unchanged crystallographic texture and total solute content. Subsequent thermal analysis of the pre-annealed samples by differential scanning calorimetry showed that the activation energy of further grain growth was unchanged from the as-deposited nanocrystalline nickel.

scholarly journals On the Role of Dilute Solute Additions on Growth Restriction in Binary Copper Alloys

2020 ◽  
Vol 9 (6) ◽  
pp. 825-832
Author(s):  
M. J. Balart ◽  
F. Gao ◽  
J. B. Patel ◽  
F. Miani
Keyword(s):  
Copper Alloys ◽  
Growth Restriction ◽  
Restriction Factor ◽  
Modeling Framework ◽  
Solute Content ◽  
Grain Length ◽  
Cu Alloys ◽  
Acta Mater ◽  
Columnar Grain

AbstractThe effect of dilute solute additions on growth restriction in binary Cu alloys has been assessed at different degrees of superheat. Columnar grain length values from Northcott’s work (Northcott in J Inst Metals 62:101-136, 1938) for binary Cu alloys were plotted against the corresponding undercooling parameter (P), the reciprocal of the conventional (Qconv.) and true (Qtrue) growth restriction factor (Schmid-Fetzer and Kozlov in Acta Mater 59(15):6133-6144, 2011) values. It was found that there was no correlation between the columnar grain length values and P, 1/Qconv. and 1/Qtrue values for different solutes and cast at the same degree of superheat. Unlike P, Qconv., and Qtrue values, the heuristic growth restriction parameter (β) (Fan et al. in Acta Mater 152, 248-257, 2018) modeling framework in conjunction with the critical solute content (C*) for growth restriction fitted well to binary Cu alloys.

Thermal decomposition of mechanically alloyed nanocrystalline fcc Fe60Cu40

1996 ◽  
Vol 11 (11) ◽  
pp. 2717-2724 ◽  
Author(s):  
J. Y. Huang ◽  
Y. D. Yu ◽  
Y. K. Wu ◽  
H. Q. Ye ◽  
Z. F. Dong
Keyword(s):  
Solid Solution ◽  
Grain Size ◽  
Magnetic Measurement ◽  
Orientation Relationships ◽  
Maximum Solubility ◽  
Mechanically Alloyed ◽  
X Ray ◽  
Cu Content ◽  
Cu Alloys ◽  
Transmission Electron

A ferromagnetic and supersaturated fcc Fe60Cu40 solid solution was prepared by mechanical alloying (MA). The phase transformations of the as-milled Fe60Cu40 powder upon heating to 1400 °C and subsequently cooling to room temperature were characterized by differential thermal analysis (DTA) and thermal magnetic measurement. The fcc Fe60Cu40 solid solution decomposes into α–Fe(Cu) + γ–Fe(Cu) + Cu(Fe) upon heating from 300 to 460 °C, and on further heating, α–Fe(Cu) transforms to γ–Fe(Cu) at 640 → 760 °C; during cooling, the reverse transformation occurs from 800 → 640 °C (obtained from thermomagnetic measurement) or from 700 → 622 °C (obtained from DTA). The γ ⇆ α transformation in mechanically alloyed Fe60Cu40 nanocrystalline occurs in a wide temperature range; the transformation temperature is higher than that of the martensite transformation in as-cast Fe–Cu alloys, but is much lower than that of the allotropic transformation of pure Fe. These differences may be caused by the different fabrication process, the nonequilibrium microstructure of MA, as well as the inhomogeneous grain size in α–Fe(Cu). High resolution transmission electron microscope (HRTEM) observations carried out in the specimen after the DTA run show that N-W or K-S orientation relationships exist between α–Fe(Cu) and Cu(Fe), which also represent the orientation relationship between α–Fe(Cu) and γ–Fe(Cu) due to excellent coherency between γ–Fe(Cu) and Cu(Fe). The grain size of the α–Fe(Cu) is inhomogeneous and varies from 50–600 mm. Energy dispersive x-ray spectroscopy (EDXS) result shows that the Cu content in these α–Fe(Cu) grains reaches as high as 9.5 at. % even after DTA heating to 1400 °C, which is even higher than the maximum solubility of Cu in γ–Fe above 1094 °C. This may be caused by the small grain size of α–Fe(Cu).

Texture of Al-Cu Alloys Deformed by ECAP

2005 ◽  
Vol 495-497 ◽  
pp. 851-856 ◽  
Author(s):  
Jan Kuśnierz ◽  
Marie Helene Mathon ◽  
Thierry Baudin ◽  
Zdzislaw Jasieński ◽  
Richard Penelle
Keyword(s):  
Grain Size ◽  
Aluminium Alloys ◽  
Superplastic Forming ◽  
Orientation Distribution ◽  
Coarse Grained ◽  
Fine Grained ◽  
Angular Pressing ◽  
Cu Alloys ◽  
Super Plastic ◽  
Short Time

Materials of ultra-fine grained microstructure (sub-micrometer grain size) exhibit large strength, hardness and ductility and also the increased toughness in comparison with conventional coarse-grained ones. In these materials also the super-plastic flow at lower temperatures is observed. This behaviour may be interesting when aluminium alloys like AlCuZr, used in superplastic forming, are considered. In the paper, the methods of preparing such materials by equal-channel angular pressing (ECAP) is proposed and the texture analysis, based on neutron diffraction pole figure measurements and calculated orientation distribution function of two alloys AlCu4SiMn and AlCu5AgMgZr is discussed. The influence of short time recrystallization is discussed in relation with TEM and SEM observations.

Ultrahigh Purity Copper Alloy Target Used Innanoscale ULSI Interconnects

2015 ◽  
Vol 815 ◽  
pp. 22-29
Author(s):  
Hao Zeng ◽  
Chao Lv ◽  
Yan Gao ◽  
Ting Yi Dong ◽  
Yong Hui Wang ◽  
...  
Keyword(s):  
Grain Size ◽  
Copper Alloy ◽  
Alloy Composition ◽  
Critical Dimension ◽  
Promising Technique ◽  
Large Size ◽  
Cu Alloys ◽  
Alloy Target ◽  
Deposited Film ◽  
Purity Copper

Current ULSI circuits have features with dimensions in the nanoscale region. As the critical dimension shrinks, Cu BEOL systems face reliability impacts. Alloying has been proved to be a promising technique to retard grain boundary electro-migration (EM). In this paper, dilute Cu Alloys such as Cu-Al, Cu-Mn for dual-damascene interconnect applications have been investigated. The alloy chosen principle for nanoscale interconnects has been discussed. The ultrahigh purity copper alloy target properties including purity, alloy composition, grain size and sputtering performance were investigated, to lay the foundation for the application of the large-size ultrahigh purity copper alloy target used for 300mm wafer fabrication. The relationships between deposited film behaviors and sputtering target properties in some applications were also discussed. In order to acquire high quality thin film, the properties of sputtering target such as alloy composition homogeneity, grain size and uniformity et al. have to be well controlled by proper fabrication techniques.

Influence of Mn solute content on grain size reduction and improved strength in mechanically alloyed Al–Mn alloys

2014 ◽  
Vol 589 ◽  
pp. 57-65 ◽  
Author(s):  
K.A. Darling ◽  
A.J. Roberts ◽  
L. Armstrong ◽  
D. Kapoor ◽  
M.A. Tschopp ◽  
...  
Keyword(s):  
Grain Size ◽  
Size Reduction ◽  
Mechanically Alloyed ◽  
Solute Content
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