scholarly journals RESEARCH OF THE EFFICIENCY THE DESIGN A BIMETALLIC RADIATOR COPPER AND ALUMINUM FOR A HEAT-LOADED SOURCE OF ELECTRONIC TECHNOLOGY

2020 ◽  
Author(s):  
Nikolay Chernov ◽  
Aleksandr Palii ◽  
Aleksandr Sayenko
Keyword(s):  
Heat Sink ◽  
Computational Experiment ◽  
Electronic Equipment ◽  
Production Costs ◽  
Electronic Technology

The paper describes the results of a computational experiment to assess the efficiency and optimize the design of a heat sink for a heat-loaded source of electronic equipment in order to minimize the temperature of the source and reduce production costs.

scholarly journals Meningkatkan Minat Belajar Siswa Menggunakan Aplikasi Multimedia Pembelajaran Mobile

2020 ◽  
Vol 9 (1) ◽  
pp. 83
Author(s):  
Tri Sugihartono ◽  
Rendy Rian Chrisna Putra
Keyword(s):  
Information Technology ◽  
Early Childhood ◽  
Multimedia Learning ◽  
Rapid Development ◽  
Electronic Equipment ◽  
Daily Activities ◽  
Student Interest ◽  
Electronic Technology ◽  
Learning Patterns ◽  
Computer Based

The rapid development of science and information technology, electronic technology has also developed rapidly. Indirectly, human lifestyle is influenced by the presence of a variety of sophisticated electronic equipment. With the development of technology and computer-based electronic equipment, many people already have such smartphones and tablets. These tools can help facilitate daily activities, for example student learning with an Android-based application. The problem with early childhood is a limited knowledge base, they need an understanding of letters, numbers, types of animals, and fruit names. Learning patterns of children who like to play greatly affect the concentration of children in learning. They are easily bored with theoretical material that is delivered verbally by the teacher and parents, children understand the material in the form of images faster. Therefore, this research discusses the application of multimedia learning to increase student interest in learning that can help in their learning process. the results of this study are the presence of multimedia learning applications, students can more easily understand and can increase interest in learning, feel interested and challenged with the exercise features in the form of multimedia.

scholarly journals Numerical Assessment of Heat Transfer and Entropy Generation of a Porous Metal Heat Sink for Electronic Cooling Applications

Energies ◽  
2020 ◽  
Vol 13 (15) ◽  
pp. 3851
Author(s):  
Hamed Rasam ◽  
Prosun Roy ◽  
Laura Savoldi ◽  
Shabnam Ghahremanian
Keyword(s):  
Heat Transfer ◽  
Temperature Field ◽  
Entropy Generation ◽  
Heat Sink ◽  
Cooling System ◽  
Solid Phase ◽  
Porous Metal ◽  
Electronic Equipment ◽  
Bejan Number ◽  
Pore Density

In the present study, the thermal performance of an electronic equipment cooling system is investigated. The heat sink used in the current cooling system consists of a porous channel with a rectangular cross-section that is assumed to be connected directly to the hot surface of an electronic device. In this modeling, a fully developed flow assumption is used. The Darcy–Brinkman model was used to determine the fluid flow field. Since using the local thermal equilibrium (LTE) model may provide results affected by the error in metal foams, in the present research, an attempt has first been made to examine the validity range of this model. The local thermal non-equilibrium (LTNE) model taking into account the viscous dissipation effect was then used to determine the temperature field. To validate the numerical solution, the computed results were compared with other studies, and an acceptable agreement was observed. Analysis of the temperature field shows that if the fluid–solid-phase thermal conductivity ratio is 1 or the Biot number has a large value, the difference between the temperature of the solid phase and the fluid phase decreases. Moreover, the effect of important hydrodynamic parameters and the porous medium characteristics on the field of hydrodynamic, heat, and entropy generation was studied. Velocity field analysis shows that increasing the pore density and reducing the porosity cause an increase in the shear stress on the walls. By analyzing the entropy generation, it can be found that the irreversibility of heat transfer has a significant contribution to the total irreversibility, leading to a Bejan number close to 1. As a guideline for the design of a porous metal heat sink for electronic equipment, the use of porous media with low porosity reduces the total thermal resistance and improves heat transfer, reducing the total irreversibility and the Bejan number. Moreover, the increasing of pore density increases the specific porous surface; consequently, it reduces the total irreversibility and Bejan number and improves the heat transfer.

Chip Level Refrigeration of Portable Electronic Equipment Using Thermoelectric Devices

2003 ◽  
Author(s):  
Gary L. Solbrekken ◽  
Kazuaki Yazawa ◽  
Avram Bar-Cohen
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
High Performance ◽  
Heat Dissipation ◽  
Electronic Equipment ◽  
Interfacial Thermal Resistance ◽  
Maximum Heat ◽  
Power Efficient ◽  
System Sensitivity ◽  
Heat Pumping

It is well established that the power dissipation for electronic components is increasing. At the same time, high performance portable equipment with volume, weight, and power limitations are gaining widespread acceptance in the marketplace. The combination of the above conditions requires thermal solutions that are high performance and yet small, light, and power efficient. This paper explores the possibility of using thermoelectric (TE) refrigeration as an integrated solution for portable electronic equipment accounting for heat sink and interface material thermal resistances. The current study shows that TE refrigeration can indeed have a benefit over using just a heat sink. Performance maps illustrating where TE refrigeration offers an advantage over an air-cooled heat sink are created for a parametric range of CPU heat flows, heat sink thermal resistances, and TE material properties. During the course of the study, it was found that setting the TE operating current based on minimizing the CPU temperature (Tj), as opposed to maximizing the amount of heat pumping, significantly reduces Tj. For the baseline case studied, a reduction of 20–30°C was demonstrated over a range of CPU heat dissipation. The parametric studies also illustrate that management of the heat sink thermal resistance appears to be more critical than the CPU/TE interfacial thermal resistance. However, setting the TE current based on a minimum Tj as opposed to maximum heat pumping reduces the system sensitivity to the heat sink thermal resistance.

Resistance Network Analysis of Airflow and Heat Transfer in a Thin Electronic Equipment Enclosure With a Localized Finned Heat Sink

2010 ◽  
Author(s):  
Takashi Fukue ◽  
Masaru Ishizuka ◽  
Shinji Nakagawa ◽  
Tomoyuki Hatakeyama ◽  
Wataru Nakayama
Keyword(s):  
Network Analysis ◽  
Thermal Performance ◽  
Heat Sink ◽  
Design Method ◽  
Electrical Equipment ◽  
Thermal Design ◽  
Electronic Equipment ◽  
Resistance Network ◽  
Fast Development ◽  
Analytical Accuracy

In recent years, thermal design of electrical equipment becomes importance and fast thermal design is required due to the fast development of electrical devices. We have proposed the flow and thermal resistance network analysis (coupled network analysis) as a fast thermal design method for electrical equipment. In this paper, we described analytical accuracy of the coupled network analysis of thin electronic equipment including the finned heat sink. We especially focused on the prediction of thermal performance on heatsink by using the coupled network analysis. For considering the accuracy of the coupled network analysis, we compared the results of the coupled network analysis with those of CFD analysis and the experiment. The results showed that the coupled network analysis can predict accurate thermal performance of heat sink and moreover accurate temperature distribution of electrical equipment.

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