Optimal Promised Delivery Lead Time for E-Tailers with Delay Dependent Customer Returns

Abstract This paper presented the recent application of die powerup in Thermal Imaging as applied to the detection of defects causing thermal failure on revenue products or units not being captured using other available techniques. Simulating the condition on an actual computer setup, the infrared (IR) camera should capture images simultaneously as the entire bootup process is being executed by the processor, thus revealing a series of images and thermal information on each and every step of the startup process. This metrology gives the failure analyst a better approach to acquire a set of information that substantiate in the conduct of rootcause analysis of thermal-related failure in revenue units, especially on customer returns. Defective units were intentionally engineered in order to collect the thermal response data and eventually come up with a plot of all known thermal-related defects.

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Sample Preparation Challenges In WLCSP Epoxy Underfill Coating Removal

ISTFA 2012: Conference Proceedings from the 38th International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa2012p0471 ◽

2012 ◽

Author(s):

Jason H. Lagar ◽

Rudolf A. Sia

Keyword(s):

Sample Preparation ◽

Failure Analysis ◽

Vital Role ◽

Fault Isolation ◽

Wafer Level ◽

Chip Scale Package ◽

Coating Removal ◽

Customer Returns ◽

Preparation Techniques ◽

Mechanical Defect

Abstract Most Wafer Level Chip Scale Package (WLCSP) units returned by customers for failure analysis are mounted on PCB modules with an epoxy underfill coating. The biggest challenge in failure analysis is the sample preparation to remove the WLCSP device from the PCB without inducing any mechanical defect. This includes the removal of the underfill material to enable further electrical verification and fault isolation analysis. This paper discusses the evaluations conducted in establishing the WLCSP demounting process and removal of the epoxy underfill coating. Combinations of different sample preparation techniques and physical failure analysis steps were evaluated. The established process enabled the electrical verification, fault isolation and further destructive analysis of WLCSP customer returns mounted on PCB and with an epoxy underfill coating material. This paper will also showcase some actual full failure analysis of WLCSP customer returns where the established process played a vital role in finding the failure mechanism.

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The ROLE OF CHINA-PAK ECONOMIC CORRIDOR (CPEC) IN LOGISTIC SYSTEM OF PAKISTAN’S AND CHINA’S

Journal of Management Info ◽

10.31580/jmi.v6i1.469 ◽

2019 ◽

Vol 6 (1) ◽

pp. 48-50

Author(s):

Ikram Uddin

Keyword(s):

Persian Gulf ◽

Lead Time ◽

Fiber Optic ◽

Delivery Time ◽

Fiber Optic Cable ◽

Total Cost ◽

Economic Complexity ◽

Shipping Cost ◽

The Impact

This study will explain the impact of China-Pak Economic Corridor (CPEC) on logistic system of China and Pakistan. This project is estimated investment of US $90 billion, CPEC project is consists of various sub-projects including energy, road, railway and fiber optic cable but major portion will be spent on energy. This project will start from Kashgar port of china to Gwadar port of Pakistan. Transportation is sub-function of logistic that consists of 44% total cost of logistic system and 20% total cost of production of manufacturing and mainly shipping cost and transit/delivery time are critical for logistic system. According to OEC (The Observing Economic Complexity) currently, china is importing crude oil which 13.4% from Persian Gulf. CPEC will china for lead time that will be reduced from 45 days to 10 days and distance from 2500km to 1300km. This new route will help to china for less transit/deliver time and shipping cost in terms of logistic of china. Pakistan’s transportation will also improve through road, railway and fiber optic cabal projects from Karachi-Peshawar it will have speed 160km per hour and with help of pipeline between Gwadar to Nawabshah gas will be transported from Iran. According to (www.cpec.inf.com) Pakistan logistic industry will grow by US $30.77 billion in the end of 2020.

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