scholarly journals Electrodeposition Behaviors of Zn-Ni Alloy on Copper Foil with Carrier

2015 ◽  
Author(s):  
Gengfeng Deng ◽  
Qinghua Zeng ◽  
Jueqi Huang
Keyword(s):  
Copper Foil ◽  
Ni Alloy

Study of Electroplating Zn-Sn-Ni Alloy

2008 ◽  
Vol 575-578 ◽  
pp. 1338-1342
Author(s):  
Zheng Wang ◽  
Mao Zhong An ◽  
Jie Yu ◽  
Xu Ri Hu
Keyword(s):  
Ternary Alloy ◽  
Copper Foil ◽  
Three Dimensional ◽  
Xrd Analysis ◽  
Processing Conditions ◽  
Sem Images ◽  
Alkaline Salt ◽  
Ni Alloy ◽  
Δ Phase ◽  
Binding Intensity

When Zn-Sn-Ni ternary alloy is electroplated on electrolyte copper foil, the surface properties can be comprehensively improved by using alkaline salt pyrophosphate solution. After the bath composition and processing conditions are optimized, and an appropriate additive is chosen, the SEM images shows the electrocrystalized substance obtained is composed of nano-crystals. Besides, XRD analysis on the deposits of electroplated Zn-Sn-Ni alloy shows Zn in the deposits exist in the form of metal compound, including δ phase Ni3Zn22 as well as γ Ni5Zn21. This indicates under the pyrophosphate salt the process of nucleation of Zn-Sn-Ni ternary alloy is similar to the process of three-dimensional successive nucleation controlled by diffuseness. All these demonstrate that after the disposal of this study, the corrosion resistance, the heat resistance and the binding intensity of electrolyte copper foil are obviously improved.

scholarly journals Hydrogenation Induced Bending Motion of Composite Device of La-Ni Alloy Film Deposited on Copper Foil

2007 ◽  
Vol 48 (11) ◽  
pp. 2964-2968 ◽  
Author(s):  
Yoshitake Nishi ◽  
Haru-Hisa Uchida ◽  
Kenichi Numazaki
Keyword(s):  
Copper Foil ◽  
Alloy Film ◽  
Ni Alloy

Effect of Electrolyte Compositions on the Physical Property and Surface Morphology of Copper Foil

2010 ◽  
Vol 48 (10) ◽  
pp. 951-956 ◽  
Author(s):  
Tae-Gyu Woo ◽  
Il-Song Park ◽  
Woo-Yong Jeon ◽  
Eun-Kwang Park ◽  
Kwang-Hee Jung ◽  
...  
Keyword(s):  
Surface Morphology ◽  
Copper Foil ◽  
Physical Property

Effect of CeO$lt;inf$gt;2$lt;/inf$gt;-based Solid Solutions on Hydrogen Storage Kinetic Properties of Mg$lt;inf$gt;2$lt;/inf$gt;Ni Alloy

2014 ◽  
Vol 29 (12) ◽  
pp. 1241
Author(s):  
ZHANG Guo-Fang ◽  
ZHANG Yang-Huan ◽  
LIU Zhuo-Cheng ◽  
XU Jian-Yi ◽  
ZHANG Yin
Keyword(s):  
Hydrogen Storage ◽  
Solid Solutions ◽  
Kinetic Properties ◽  
Ni Alloy

INVAR M93

Alloy Digest ◽  
2008 ◽  
Vol 57 (1) ◽  
Keyword(s):  
Fracture Toughness ◽  
Low Temperature ◽  
Physical Properties ◽  
Tensile Properties ◽  
Low Temperatures ◽  
Bend Strength ◽  
Temperature Performance ◽  
Ni Content ◽  
Precision Alloys ◽  
Ni Alloy

Abstract Invar is an Fe-Ni alloy with 36% Ni content that exhibits the lowest expansion of known metals from very low temperatures up to approximately 230 deg C (445 deg F). Invar M93 is a cryogenic Invar with improved weldability. This datasheet provides information on composition, physical properties, hardness, elasticity, tensile properties, and shear and bend strength as well as fracture toughness and fatigue. It also includes information on low temperature performance as well as forming and joining. Filing Code: FE-143. Producer or source: Metalimphy Precision Alloys.

SOMERS LTA COPPER

Alloy Digest ◽  
1980 ◽  
Vol 29 (12) ◽  
Keyword(s):  
High Temperature ◽  
Low Temperature ◽  
Physical Properties ◽  
Copper Foil ◽  
Heat Treating ◽  
Dielectric Substrates ◽  
Printed Circuits

Abstract SOMERS LTA Copper is a wrought copper foil that can be annealed at 350 F in 15 minutes to the full-soft condition; its use simplifies the manufacture of printed circuits (LTA = Low-Temperature Annealable). LTA Copper is especially useful for foil weights up to and including one ounce per square foot (0.0014-inch thick) for laminating to high-temperature dielectric substrates. This datasheet provides information on composition, physical properties, and elasticity as well as fatigue. It also includes information on forming, heat treating, and machining. Filing Code: Cu-407. Producer or source: Olin Corporation.

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